IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0607019
(2009-10-27)
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등록번호 |
US-8362609
(2013-01-29)
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발명자
/ 주소 |
- Dosdos, S. Gabriel R.
- Kim, Dong Wook
|
출원인 / 주소 |
|
인용정보 |
피인용 횟수 :
3 인용 특허 :
101 |
초록
▼
An integrated circuit package is described. The integrated circuit package comprises a substrate having a plurality of sides, where each pair of adjacent sides forms a corner; a die coupled to a first surface of the substrate; a lid having a first portion positioned over the die and a plurality of f
An integrated circuit package is described. The integrated circuit package comprises a substrate having a plurality of sides, where each pair of adjacent sides forms a corner; a die coupled to a first surface of the substrate; a lid having a first portion positioned over the die and a plurality of foot portions, each foot portion of the plurality of foot portions being coupled to the first surface of the substrate at a corresponding corner of the substrate, where a side of the integrated circuit package above the substrate and between two associated foot portions has an opening; and a plurality of contact elements coupled to a second surface of the substrate. A method of forming an integrated circuit package is also shown.
대표청구항
▼
1. An integrated circuit package comprising: a substrate having a plurality of sides, where each pair of adjacent sides forms a corner;a die coupled to a first surface of the substrate;a lid having a first portion positioned over the die and a plurality of foot portions, each foot portion of the plu
1. An integrated circuit package comprising: a substrate having a plurality of sides, where each pair of adjacent sides forms a corner;a die coupled to a first surface of the substrate;a lid having a first portion positioned over the die and a plurality of foot portions, each foot portion of the plurality of foot portions being coupled to the first surface of the substrate at a corresponding corner of the substrate, wherein a side of the integrated circuit package above the substrate and between two associated foot portions has an opening at a side of the lid extending from the first portion of the lid to the first surface of the substrate; anda plurality of contact elements coupled to a second surface of the substrate. 2. The integrated circuit package of claim 1, wherein each foot portion of the plurality of foot portions comprises a descending portion extending from the first portion of the lid to a flange. 3. The integrated circuit package of claim 2, further comprising a bonding agent between the flange of each foot portion and the first surface of the substrate. 4. The integrated circuit package of claim 2, wherein the lid comprises, for each foot portion, a linear edge formed between the first portion and the descending portion and the flange comprises a triangular flange. 5. The integrated circuit package of claim 2, wherein the lid comprises, for each foot portion, a contoured edge between the descending portion and the flange. 6. The integrated circuit package of claim 5, wherein the contoured edge comprises an angular-type edge having linear portions and angles between adjacent portions which are greater than ninety degrees. 7. The integrated circuit package of claim 5, wherein the contoured edge comprises rounded corners. 8. An integrated circuit package comprising: a substrate having a plurality of sides, where each pair of adjacent sides forms a corner;a die coupled to a first surface of the substrate;a lid having a first portion positioned over the die and a plurality of foot portions, each foot portion of the plurality of foot portions having a flange which is coupled to the first surface of the substrate at a corresponding corner of the substrate, wherein the lid comprises, for each foot portion, a descending portion having a contoured surface extending between a first side and a second side of the descending portion, wherein the first side of the descending portion extends between the first portion of the lid and the flange at a first side of the first portion of the lid, and the second side of the descending portion extends between the first portion of the lid and the flange at a second side of the first portion of the lid which is adjacent to the first side of the first portion of the lid; anda plurality of contact elements coupled to a second surface of the substrate. 9. The integrated circuit package of claim 8, wherein a side of the integrated circuit package above the substrate and between two associated foot portions has an opening. 10. The integrated circuit package of claim 9, further comprising decoupling capacitors below the first portion of the lid between the die and the opening. 11. The integrated circuit package of claim 8, wherein, for each foot portion, the contoured surface comprises an angular-type surface. 12. The integrated circuit package of claim 11, wherein, for each foot portion, an edge between the contoured surface and the flange comprises an angular-type edge having linear portions and angles between adjacent linear portions which are greater than ninety degrees. 13. The integrated circuit package of claim 8, further comprising a bonding agent between each flange of the plurality of foot portions and the first surface of the substrate. 14. The integrated circuit package of claim 8, further comprising a bonding agent between the first surface of the lid and the die, wherein the lid and the bonding agent between the first surface of the lid and the die comprise a heat sink. 15. A method of forming an integrated circuit package having a lid, the method comprising: providing a substrate having a plurality of sides, where each pair of adjacent sides forms a corner;coupling a die to a first surface of the substrate;positioning a first portion of a lid over the die; coupling flanges of foot portions of the lid to corresponding corners of the substrate, each foot portion having a descending portion extending down from the first portion of the lid to a flange, wherein each descending portion comprises a contoured surface extending between a first side and a second side of the descending portion, wherein the first side of the descending portion extends between the first portion of the lid and a corresponding flange at a first side of the first portion of the lid, and the second side of the descending portion extends between the first portion of the lid and the flange at a second side of the first portion of the lid which is adjacent to the first side of the first portion of the lid; andcoupling a plurality of contact elements to a second surface of the substrate. 16. The method of claim 15, further comprising forming the lid to have the first portion and the foot portions. 17. The method of claim 15, wherein positioning a first portion of the lid over the die comprises providing an opening on a side of the integrated circuit package between two adjacent foot portions. 18. The method of claim 17, further comprising attaching decoupling capacitors to the first surface of the substrate between the die and the opening. 19. The method of claim 15, further comprising bonding the flanges of the foot portions of the lid to the first surface of the substrate. 20. The method of claim 15, further comprising bonding the first portion of the lid to the die.
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