Encapsulant compositions and method for fabricating encapsulant materials
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C08F-002/46
B29B-013/08
B05D-005/00
출원번호
US-0639467
(2009-12-16)
등록번호
US-8367768
(2013-02-05)
우선권정보
GB-0822911.4 (2008-12-16)
발명자
/ 주소
Liu, Lung-Chang
Chung, Ming-Hua
Hsu, Tsung-Ju
Chang, Chih-Fen
Chen, Jen-Hao
출원인 / 주소
Industrial Technology Research Institute
인용정보
피인용 횟수 :
0인용 특허 :
18
초록▼
An encapsulant composition is provided. The encapsulant composition includes at least one silane-containing monomer and at least one resin monomer selected from the group consisting of acrylic resin monomers and epoxy resin monomers, a filler of about 0.1-15 wt % of the encapsulant composition, and
An encapsulant composition is provided. The encapsulant composition includes at least one silane-containing monomer and at least one resin monomer selected from the group consisting of acrylic resin monomers and epoxy resin monomers, a filler of about 0.1-15 wt % of the encapsulant composition, and an initiator. The invention also provides a method for fabricating an encapsulant material.
대표청구항▼
1. A method for fabricating an encapsulant material, comprising: providing an encapsulant composition comprising at least one silane-containing monomer and at least one acrylic resin monomer, a filler and an initiator, wherein the filler is about 0.1-15 wt % of the encapsulant composition;performing
1. A method for fabricating an encapsulant material, comprising: providing an encapsulant composition comprising at least one silane-containing monomer and at least one acrylic resin monomer, a filler and an initiator, wherein the filler is about 0.1-15 wt % of the encapsulant composition;performing a heating process by a microwave source to polymerize the encapsulant composition; and subsequently performing an illumination processby a light source to solidify the polymerized encapsulant composition. 2. The method for fabricating an encapsulant material as claimed in claim 1, wherein the heating process is performed for 1 to 200 minutes. 3. The method for fabricating an encapsulant material as claimed in claim 1, wherein the illumination process is performed for 1 to 200 minutes. 4. The method for fabricating an encapsulant material as claimed in claim 1, wherein the microwave source has a power of 1 to 20,000 watts. 5. The method for fabricating an encapsulant material as claimed in claim 1, wherein the light source has a power of 1 to 20,000 watts. 6. The method for fabricating an encapsulant material as claimed in claim 1, wherein the encapsulant material has a viscosity of 1-100,000 cps. 7. The method for fabricating an encapsulant material as claimed in claim 1, wherein the encapsulant material has a light transparency exceeding 85%. 8. The method for fabricating an encapsulant material as claimed in claim 1, wherein the acrylic resin monomer has a structure represented by a formula of: wherein each of R1 and R2 is an alkyl group having 1 to 12 carbon atoms, a tert-butyl group, an ester group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms or a cyclic ether group having 1 to 12 carbon atoms. 9. The method for fabricating an encapsulant material as claimed in claim 1, wherein the silane-containing monomer comprises a structure represented by a formula of: wherein R1′, R1″ and R1″′ are the same or different, and each of R1′, R1″, R1″′, R2 and R3 is an alkyl group having 1 to 12 carbon atoms, a tert-butyl group, an ester group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms or a cyclic ether group having 1 to 12 carbon atoms. 10. The method for fabricating an encapsulant material as claimed in claim 1, wherein the filler comprises metal oxides, metal halides or metal nitrides. 11. The method for fabricating an encapsulant material as claimed in claim 1, wherein the initiator comprises peroxides, azo compounds, free radical initiators, cationic initiators or metallocene complexes. 12. The method for fabricating an encapsulant material as claimed in claim 1, wherein the filler is 5-15 wt % of the encapsulant composition. 13. The method for fabricating an encapsulant material as claimed in claim 1, wherein the light source is an ultraviolet (UV) light source, a visible light source or an infrared (IR) light source. 14. A method of fabricating a light emitting device comprising encapsulating a light emitting device in an encapsulant material produced according to the method of claim 1. 15. A method of fabricating a light emitting device as claimed in claim 14 wherein the light emitting device is an organic light emitting diode or a light emitting diode. 16. A method of fabricating a solar cell comprising encapsulating a solar cell in an encapsulant material produced according to the method of claim 1.
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