초록 ▼

A micro fluid device includes a heating unit and a cooling unit, each with piping disposed within. The heating and cooling units are integrally coupled together, and fluid flows into the piping of respective units. A temperature control device includes a heat insulator which has a through hole equal

A micro fluid device includes a heating unit and a cooling unit, each with piping disposed within. The heating and cooling units are integrally coupled together, and fluid flows into the piping of respective units. A temperature control device includes a heat insulator which has a through hole equal in diameter to the piping disposed within the heating unit and cooling unit. The heat insulator is interposed between heating unit and the cooling unit. A positioning mechanism positions the heat insulator to bring the piping into communication with the through hole at the time of coupling the heating and cooling units.

대표청구항 ▼

1. A micro fluid device in which a plurality of units each having piping integrally coupled together to bring each piping of the units into communication with each other to cause fluid to flow into the piping to perform unit operations, and at least one of the plurality of units is a temperature con

1. A micro fluid device in which a plurality of units each having piping integrally coupled together to bring each piping of the units into communication with each other to cause fluid to flow into the piping to perform unit operations, and at least one of the plurality of units is a temperature controlling unit for controlling the temperature of the fluid, comprising: a heating unit which heats the fluid and a cooling unit which cools the fluid, the heating unit and the cooling unit which are provided in the temperature controlling unit; anda heat insulator which has a through hole equal in diameter to the piping and is interposed between the heating unit and the cooling unit, whereinthe heating unit and the cooling unit are thermally-insulated by the heat insulator,the piping of the heating unit and the piping of the cooling unit are thermally-insulated by the through hole formed in the heat insulator, andthe heat insulator includes a positioning mechanism which positions the piping of the heating unit, the piping of the cooling unit and the through hole so as to communicate with each other. 2. The micro fluid device according to claim 1, wherein the piping of the heating unit and the piping of the cooling unit each has a diameter of 5 mm or less and the through hole has a diameter of 5 mm or less. 3. The micro fluid device according to claim 1, wherein the heat insulator has heat conduction coefficient Hc, where 0