IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0110215
(2011-05-18)
|
등록번호 |
US-8382524
(2013-02-26)
|
발명자
/ 주소 |
- Khilchenko, Leon
- Gailus, Mark W.
|
출원인 / 주소 |
|
인용정보 |
피인용 횟수 :
31 인용 특허 :
60 |
초록
▼
An electrical connector electrically connects a first printed circuit board and a second printed circuit board, where the electrical connector includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed wit
An electrical connector electrically connects a first printed circuit board and a second printed circuit board, where the electrical connector includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor.
대표청구항
▼
1. An electrical connector comprising: an insulative housing having a surface;a signal conductor disposed on the surface of said insulative housing, said signal conductor having a first contact end, a second contact end, and an intermediate portion therebetween, said intermediate portion having a fi
1. An electrical connector comprising: an insulative housing having a surface;a signal conductor disposed on the surface of said insulative housing, said signal conductor having a first contact end, a second contact end, and an intermediate portion therebetween, said intermediate portion having a first signal conductor segment and a second signal conductor segment spatially separated from the first signal conductor segment; and,a thick film layer disposed on at least a portion of said first signal conductor segment, at least a portion of said insulative housing, and at least a portion of said second signal conductor segment. 2. The electrical connector of claim 1, wherein said thick film layer has a resistance. 3. The electrical connector of claim 1, wherein the surface at said portion of said insulative housing is roughened or grooved to facilitate a connection between said thick film layer and said insulative housing. 4. The electrical connector of claim 1, wherein a surface of said portions of the first and second signal conductor segments are roughened or grooved to facilitate a connection between said thick film layer and said portion of the first and second signal conductor segments. 5. A method for adding a circuit element to an electrical connector, comprising the steps of: providing at least one opening in an insulative housing of an electrical connector to expose a first signal conductor;forming a first gap in the first signal conductor, thereby forming a first segment with a first contact end and a second segment with a second contact end, wherein the first gap is accessible in the at least one opening; andcovering at least a portion of the at least one opening with a first thick film, wherein the thick film covers at least a portion of the first and second segments and the first gap. 6. An electrical connector comprising: an insulative housing having a surface;a signal conductor having a first contact end, a second contact end, and an intermediate portion therebetween, said intermediate portion having a first signal conductor segment and a second signal conductor segment spatially separated from the first signal conductor segment;a first thick film layer disposed on at least a portion of said first signal conductor segment; and,a second thick film layer disposed on at least a portion of said first thick film layer and at least a portion of said second signal conductor segment. 7. The electrical connector of claim 6, wherein said first thick film layer is not disposed on said second signal conductor segment and said second thick film layer is not disposed on said first signal conductor segment. 8. The electrical connector of claim 7, wherein said second thick film layer is disposed over said first signal conductor segment to form a capacitor therewith. 9. The electrical connector of claim 8, wherein said second thick film layer is resistive, and further forms a resistor with the capacitor, in series with said first and second signal conductor segments. 10. The electrical connector of claim 7, further comprising a third thick film layer disposed on said first signal conductor segment and second thick film layer. 11. The electrical connector of claim 10, further comprising a fourth thick film layer disposed on said first signal conductor segment and said third thick film layer. 12. The electrical connector of claim 6, wherein said first thick film layer is insulative and said second thick film is a good conductor. 13. The electrical connector of claim 6, wherein said first thick film layer is insulative and said second thick film is resistive. 14. The electrical connector of claim 6, wherein said second thick film layer is further disposed on said first signal conductor segment. 15. The electrical connector of claim 14, wherein said first thick film layer is insulative and said second thick film layer is a lossy material. 16. The electrical connector of claim 15, wherein said first thick film layer has a high dielectric constant. 17. The electrical connector of claim 14, wherein said second thick film layer has two ends and a middle therebetween, wherein the two ends have a resistance and the middle is disposed over said first signal conductor segment and forms a capacitance therewith. 18. The method according to claim 5, further comprising the step of etching at least a portion of the first thick film to achieve a desired level of electrical resistance. 19. An electrical connector comprising: an insulative housing having a surface;a differential signal pair comprising a first signal conductor having a first contact end, a second contact end, and a first intermediate portion therebetween, said first intermediate portion having a first signal conductor segment and a second signal conductor segment spatially separated from the first signal conductor segment, and a second signal conductor having a third contact end, a fourth contact end, and a second intermediate portion therebetween, said second intermediate portion having a third signal conductor segment and a fourth signal conductor segment spatially separated from the third signal conductor segment; and,a first thick film layer disposed on at least a portion of said first signal conductor segment and a portion of said third signal conductor segment. 20. The electrical connector of claim 19, further comprising a second thick film layer disposed on said first thick film layer and said second signal conductor segment. 21. The electrical connector of claim 20, wherein said second thick film layer is further disposed on said further signal conductor segment. 22. The electrical connector of claim 21, wherein said second thick film layer is connected to at least one ground conductor. 23. The electrical connector of claim 22, further comprising a third thick film layer connected to said first and third signal conductor segments and said at least one ground conductor. 24. The method according to claim 5, wherein the step of providing at least one opening in an insulative housing of an electrical connector comprises the steps of: receiving a plurality of existing wafers; andmodifying the plurality of existing wafers to each have the at least one opening. 25. A method of forming an electrical connector comprising: providing an insulative housing having a surface;providing a signal conductor disposed on the surface of said insulative housing, said signal conductor having a first contact end, a second contact end, and an intermediate portion therebetween, said intermediate portion having a first signal conductor segment and a second signal conductor segment spatially separated from the first signal conductor segment; and,disposing a thick film layer on at least a portion of said first signal conductor segment, at least a portion of said insulative housing, and at least a portion of said second signal conductor segment. 26. The method of claim 25, further comprising the step of insert molding the signal conductor into an insulative housing. 27. The method according to claim 5, wherein the insulative housing is formed using an overmolding process. 28. The method according to claim 5, further comprising adding a second thick film on top of the first thick film. 29. The method according to claim 5, wherein the first thick film has a conductivity ranging from about 1:100 and about 1:1,000,000 of that of standard pure copper. 30. The method according to claim 5, wherein the first thick film is a lossy dielectric, a lossy polymer resin, or a lossy magnetic material. 31. The method according to claim 30, wherein the lossy magnetic material is one of a ferrite and a ferrite-particle-filled polymer resin matrix.
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