Method for joining aligned discrete optical elements
원문보기
IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0522366
(2008-01-08)
|
등록번호 |
US-8431477
(2013-04-30)
|
우선권정보 |
DE-10 2007 002 436 (2007-01-09) |
국제출원번호 |
PCT/DE2008/000038
(2008-01-08)
|
§371/§102 date |
20091014
(20091014)
|
국제공개번호 |
WO2008/083676
(2008-07-17)
|
발명자
/ 주소 |
- Beckert, Erik
- Banse, Henrik
- Zakel, Elke
- Fettke, Matthias
|
출원인 / 주소 |
- Fraunhofer-Gesellschaft zur forderung der Angewandten Forschung e.V.
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
0 인용 특허 :
2 |
초록
▼
A method for joining aligned discrete optical elements by which the optical elements can be joined in the aligned state. A thermal connection having long-term stability can be produced at little expense and with high positioning accuracy. Surface regions to be joined can be provided with at least on
A method for joining aligned discrete optical elements by which the optical elements can be joined in the aligned state. A thermal connection having long-term stability can be produced at little expense and with high positioning accuracy. Surface regions to be joined can be provided with at least one thin metallic layer by the method for joining aligned discrete optical elements. The surface regions are subsequently wetted using a liquid solder free of flux in a contactless dosed manner. The solder is applied to the surface regions to be joined via a nozzle using a pressurized gas stream.
대표청구항
▼
1. A method for joining aligned discrete optical elements, the method comprising: providing the aligned discrete optical elements with surface regions which are to be joined;providing at least one metal layer on the surface regions of the aligned discrete optical elements; andsubsequently wetting a
1. A method for joining aligned discrete optical elements, the method comprising: providing the aligned discrete optical elements with surface regions which are to be joined;providing at least one metal layer on the surface regions of the aligned discrete optical elements; andsubsequently wetting a surface of the at least one metal layer by applying liquid, flux-free solder, via a nozzle using a pressurized gas flow, to the surface regions to be joined in a contact-free, metered manner. 2. A method in accordance with claim 1 wherein the liquid, flux-free solder is applied in a join gap. 3. A method in accordance with claim 2 wherein the liquid, flux-free solder is distributed over the surface regions to be joined by the pressurized gas flow. 4. A method in accordance with claim 3 wherein the at least one metal layer is formed with at least one of titanium, chromium, gold, tungsten and platinum. 5. A method in accordance with claim 4 wherein an upper metal layer onto which the liquid, flux-free solder is applied is formed by gold. 6. A method in accordance with claim 3 wherein an upper metal layer onto which the liquid, flux-free solder is applied is formed by gold. 7. A method in accordance with claim 2 wherein the at least one metal layer is formed with at least one of titanium, chromium, gold, tungsten and platinum. 8. A method in accordance with claim 7 wherein an upper metal layer onto which the liquid, flux-free solder is applied is formed by gold. 9. A method in accordance with claim 2 wherein an upper metal layer onto which the liquid, flux-free solder is applied is formed by gold. 10. A method in accordance with claim 1 wherein the liquid, flux-free solder is distributed over the surface regions to be joined by the gas flow. 11. A method in accordance with claim 10 wherein the at least one metal layer is formed with at least one of titanium, chromium, gold, tungsten and platinum. 12. A method in accordance with claim 11 wherein an upper metal layer onto which the liquid, flux-free solder is applied is formed by gold. 13. A method in accordance with claim 10 wherein an upper metal layer onto which the liquid, flux-free solder is applied is formed by gold. 14. A method in accordance with claim 1 wherein the at least one metal layer is formed with at least one of titanium, chromium, gold, tungsten and platinum. 15. A method in accordance with claim 14 wherein an upper metal layer onto which the liquid, flux-free solder is applied is formed by gold. 16. A method in accordance with claim 1 wherein an upper metal layer onto which the liquid, flux-free solder is applied is formed by gold. 17. A method in accordance with claim 1 wherein the liquid, flux-free solder comprises a eutectic alloy. 18. A method in accordance with claim 1 wherein the liquid, flux-free solder comprises at least one of a gold-tin alloy, a silver-tin alloy and a bismuth-tin alloy. 19. A method in accordance with claim 1 wherein the pressurized gas flow comprises an inert gas flow. 20. A method in accordance with claim 1 wherein the liquid, flux-free solder is melted using laser radiation prior to its application. 21. A method in accordance with claim 1 wherein at least one of intermetallic phases and mixed crystals are formed within a transition region with the liquid, flux-free solder and at least one of the at least one metal layer and a thick metal layer thicker than the at least one metal layer. 22. A method in accordance with claim 1 wherein the liquid, flux-free solder is applied in a pulsed manner. 23. A method in accordance with claim 22 wherein the position for the application on the surface region to be joined is changed on the pulsed application. 24. A method in accordance with claim 1 wherein an applicator for the liquid, flux-free solder is moved and positioned in three dimensions. 25. A method in accordance with claim 24 wherein the applicator is electronically controlled.
이 특허에 인용된 특허 (2)
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Nguyen Hung N. (Bensalem PA), Apparatus and method for fluxless soldering.
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Alkhimov Anatoly P. (ulitsa Vyazemskogo 2 ; kv. 72 Novosibirsk SUX) Papyrin Anatoly N. (ulitsa Vyazemskogo 2 ; kv. 72 Novosibirsk SUX) Kosarev Vladimir F. (Novosibirsk SUX) Nesterovich Nikolai I. (No, Gas-dynamic spraying method for applying a coating.
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