초록 ▼

A data center system can include a mobile support structure; one or more enclosures for removable electronic equipment where the enclosures are housed by the support structure; a cooling system in fluid communication with the enclosures for cooling of the electronic equipment where the cooling syste

A data center system can include a mobile support structure; one or more enclosures for removable electronic equipment where the enclosures are housed by the support structure; a cooling system in fluid communication with the enclosures for cooling of the electronic equipment where the cooling system is housed by the support structure; and a power system operably connected to the electronic equipment and the cooling system for supplying power thereto where the power system comprises a generator housed by the support system. The mobile data center can be moved to remote locations, and the electronic equipment can be placed in communication with a network when at the remote location Other embodiments are disclosed.

대표청구항 ▼

1. A data center system comprising: a housing for removable electronic equipment;a cooling system in fluid communication with an inner volume of the housing for cooling of the electronic equipment, the cooling system being at least partially housed by the housing;wherein the data center system is ca

1. A data center system comprising: a housing for removable electronic equipment;a cooling system in fluid communication with an inner volume of the housing for cooling of the electronic equipment, the cooling system being at least partially housed by the housing;wherein the data center system is capable of being moved to remote locations, and wherein the electronic equipment is capable of being placed in communication with a network when at the remote location;a plurality of cabinets within the housing that each form an enclosure, wherein each of the cabinets has an inlet and an outlet, wherein the inlet is in proximity to a bottom portion of the cabinets, and wherein the outlet is in proximity to a top portion of the cabinets;a supply channel connected with the cabinet inlets, wherein the cabinets are positioned on a floor in the housing and the supply channel is under the floor;an exhaust channel connected with the cabinet outlets;one or more plenums in fluid communication with at least one of the supply and exhaust channels, wherein the one or more plenums have a pressure source for generating a pressure differential through the enclosures of the cabinets causing air to flow therethrough;a cooling coil positioned under the floor and in thermal contact with the supply channel, wherein a coolant flows through the cooling coil to remove heat from the air flowing through the supply channel;one or more sensors in proximity to the cabinets for monitoring at least one of a temperature, pressure and humidity associated with the electronic equipment; anda controller in communication with the sensors for receiving data from the sensors electronic equipment, wherein, based upon the data, the controller adjusts at least one of the temperature, the pressure and the humidity associated with the electronic equipment. 2. The system of claim 1, wherein the controller adjusts at least one of the temperature, the pressure and the humidity within a desired range in real time. 3. The system of claim 1, wherein the controller adjusts the temperature associated with the electronic equipment by generating a pressure differential across the electronic equipment that causes air flow across the electronic equipment. 4. The system of claim 1 further comprising a closed loop water chiller system.