IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0981124
(2010-12-29)
|
등록번호 |
US-8441789
(2013-05-14)
|
우선권정보 |
TW-99137335 A (2010-10-29) |
발명자
/ 주소 |
- Wu, Hsi Sheng
- Chiang, Hsu Cheng
- Hung, Kuo Shu
- Sun, Kuel Ker
|
출원인 / 주소 |
- Industrial Technology Research Institute
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
12 인용 특허 :
13 |
초록
▼
A module for data center is presented, which is used for heat sinking of a heat source. The module for data center includes a first chamber, a second chamber, and a heat pipe. The heat source is positioned in the first chamber. The second chamber is adjacent to the first chamber. In addition, the he
A module for data center is presented, which is used for heat sinking of a heat source. The module for data center includes a first chamber, a second chamber, and a heat pipe. The heat source is positioned in the first chamber. The second chamber is adjacent to the first chamber. In addition, the heat pipe has an evaporation end positioned inside the first chamber and a condensation end positioned inside the second chamber. The heat pipe absorbs the heat energy in the first chamber with the evaporation end, transfers the heat energy to the condensation end, and eliminates the heat energy with the condensation end.
대표청구항
▼
1. A data center module, for heat sinking of a plurality of servers in at least one rack of server, comprising: a first chamber, in which the rack of server is positioned;a second chamber, adjacent to the first chamber;a heat pipe, having an evaporation end positioned inside the first chamber and a
1. A data center module, for heat sinking of a plurality of servers in at least one rack of server, comprising: a first chamber, in which the rack of server is positioned;a second chamber, adjacent to the first chamber;a heat pipe, having an evaporation end positioned inside the first chamber and a condensation end positioned inside the second chamber; anda cooling pipeline, having a nozzle at one end, wherein the nozzle is disposed in the second chamber, and sprays atomized liquid to the condensation end or an air vent;wherein the heat pipe absorbs heat energy emitted from the rack of server in the first chamber with the evaporation end, transfers the heat energy to the condensation end, and eliminates the heat energy with the condensation end. 2. The data center module according to claim 1, wherein the air vent is in communication with external environment, and natural convection is generated between the air in the second chamber and the air in the external environment, so as to eliminate the heat energy of the condensation end. 3. The data center module according to claim 1, wherein the cooling pipeline is connected to a cooling water tower, 4. The data center module according to claim 1, wherein the cooling pipeline is connected to a pump, so a cooling fluid circularly flows in the cooling pipeline. 5. The data center module according to claim 1, further comprising a heat exchanger disposed in the first chamber and connected to the cooling pipeline. 6. The data center module according to claim 5, wherein the cooling pipeline is connected to a cooling water tower. 7. The data center module according to claim 5, wherein the cooling pipeline is connected to a pump, so a cooling fluid circularly flows in the cooling pipeline. 8. The data center module according to daim 5, further comprising a freezer connected to the heat exchanger via the cooling pipeline. 9. The data center module according to claim 8, wherein the cooling pipeline is connected to a cooling water tower. 10. The data center module according to claim 8, wherein the cooling pipeline is connected to a pump, so a cooling fluid circularly flows in the cooling pipeline. 11. The data center module according to claim 1, further comprising a first fan disposed in the first chamber and generating forced convection in the first chamber. 12. The data center module according to claim 1, further comprising a second fan disposed in the second chamber and generating forced convection in the second chamber. 13. A data center module, for heat sinking of a plurality of servers in at least one rack of server, comprising: a first chamber, in which the rack of server is positioned;a second chamber, adjacent to the first chamber;a heat pipe, having an evaporation end positioned inside the first chamber and a condensation end positioned inside the second chamber;a cooling pipeline, combined with the condensation end of the heat pipe and used for eliminating the heat energy of the condensation end;a heat exchanger, disposed in the first chamber and connected to the cooling pipeline; anda freezer, connected to the heat exchanger via the cooling pipeline;wherein the heat pipe absorbs heat energy emitted from the rack of server in the first chamber with the evaporation end, transfers the heat energy to the condensation end, and eliminates the heat energy with the condensation end. 14. The data center module according to claim 13, wherein the cooling pipeline is connected to a pump, so a cooling fluid circularly flows in the cooling pipeline. 15. The data center module according to claim 13, further comprising a first fan disposed in the first chamber and generating forced convection in the first chamber, 16. The data center module according to claim 13, further comprising a second fan disposed in the second chamber and generating forced convection in the second chamber.
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