[특허]Method and system for communicating via flip-chip die and package waveguides

[미국특허] Method and system for communicating via flip-chip die and package waveguides 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-023/52
출원번호	US-0191605 (2008-08-14)
등록번호	US-8450846 (2013-05-28)
발명자 / 주소	Rofougaran, Ahmadreza
출원인 / 주소	Broadcom Corporation
대리인 / 주소	Farjami & Farjami LLP
인용정보	피인용 횟수 : 0 인용 특허 : 24

초록 ▼

Methods and systems for communicating via flip-chip die and package waveguides are disclosed and may include communicating one or more signals between sections of an integrated circuit via one or more waveguides integrated in a multi-layer package. The integrated circuit may be bonded to the multi-layer package. The waveguides may be configured via switches in the integrated circuit or by MEMS switches integrated in the multi-layer package. The signals may include a microwave signal and a low frequency control signal that may configure the microwave signal. The low frequency control signal may include a digital signal. The waveguides may comprise metal and/or semiconductor layers deposited on and/or embedded within the multi-layer package.

대표청구항 ▼

1. A method for wireless communication, the method comprising: wirelessly communicating one or more electrical signals between sections of an integrated circuit via one or more electrical waveguides integrated in a multi-layer package, wherein said integrated circuit is bonded to said multi-layer package, wherein said one or more electrical waveguides comprise metal layers embedded within said multi-layer package. 2. The method according to claim 1, comprising configuring said one or more electrical waveguides via switches integrated within said integrated circuit. 3. The method according to claim 1, comprising configuring said one or more electrical waveguides via MEMS switches integrated in said multi-layer package. 4. The method according to claim 1, wherein said one or more electrical signals comprises a microwave signal. 5. The method according to claim 1, comprising configuring said wireless communication of said one or more electrical signals via a low frequency control signal. 6. The method according to claim 5, wherein said low frequency control signal comprises a digital signal. 7. The method according to claim 1, wherein said one or more electrical waveguides comprise metal layers deposited on said multi-layer package. 8. The method according to claim 1, wherein said one or more electrical waveguides comprise semiconductor layers deposited on said multi-layer package. 9. The method according to claim 1, wherein said one or more electrical waveguides comprise semiconductor layers embedded within said multi-layer package. 10. A system for wireless communication, the system comprising: one or more circuits in an integrated circuit bonded to a multilayer package, wherein said one or more circuits enables wireless communication of one or more electrical signals between or among sections of said integrated circuit via one or more electrical waveguides integrated in said multi-layer package, wherein said one or more electrical waveguides comprise metal layers embedded within said multi-layer package. 11. The system according to claim 10, wherein said one or more circuits enables configuration of said one or more electrical waveguides via switches integrated within said integrated circuit. 12. The system according to claim 10, wherein said one or more circuits enables configuration of said one or more electrical waveguides via MEMS switches integrated in said multi-layer package. 13. The system according to claim 10, wherein said one or more electrical signals comprises a microwave signal. 14. The system according to claim 10, wherein said one or more circuits enables configuration of said wireless communication of said one or more electrical signals via a low frequency control signal. 15. The system according to claim 14, wherein said low frequency control signal comprises a digital signal. 16. The system according to claim 10, wherein said one or more electrical waveguides comprise metal layers deposited on said multi-layer package. 17. The system according to claim 10, wherein said one or more electrical waveguides comprise semiconductor layers deposited on said multi-layer package. 18. The system according to claim 10, wherein said one or more electrical waveguides comprise semiconductor layers embedded within said multi-layer package.

이 특허에 인용된 특허 (24) 인용/피인용 타임라인 분석

Cheung,Philip; Harjani,Ramesh, Circuit package integrating passive radio frequency structure.
상세보기
Al Taei,Sarmad; Passiopoulos,George, Coupling device.
상세보기
Blish ; II Richard C., Distributed voltage converter apparatus and method for high power microprocessor with array connections.
상세보기
Lee,Jar J.; Quan,Clifton; Livingston,Stanley W., Dual band space-fed array.
상세보기
Qiu, Cindy Xing; Qiu, Chunong; Shih, Yi-Chi, Electrostatically actuated microwave MEMS switch.
상세보기
Kondo, Koji; Kataoka, Ryohei; Masuda, Gentaro, Enhancement of current-carrying capacity of a multilayer circuit board.
상세보기
Tonomura S. Doug ; Harris James M. ; Moye Christopher A., Gallium arsenide monolithic microwave integrated circuits employing thermally bumped devices.
상세보기
Bosco,Bruce A.; Emrick,Rudy M.; Franson,Steven J.; Holmes,John E.; Rockwell,Stephen K., Hermetic cavity package.
상세보기
Kuroki,Hiroshi; Mori,Hiroyuki; Kitazawa,Kenji; Miyawaki,Yoshihiro, High-frequency module and communication apparatus.
상세보기
Horiuchi,Masafumi; Nakamata,Katsuro; Ninomiya,Hiroshi; Fukuoka,Yasuhiko; Iwasaki,Satoru; Fukuyama,Kenta, High-frequency module and radio communication apparatus.
상세보기
Li, Yuan Liang; Figueroa, David G., Inductive filters and methods of fabrication therefor.
상세보기
Huff,Michael A.; Ozgur,Mehmet, Method of fabricating radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates.
상세보기
Letavic Theodore James ; Kim Manjin Jerome, Microwave monolithic integrated circuit with coplaner waveguide having silicon-on-insulator composite substrate.
상세보기
Kakimoto Noriko,JPX ; Suematsu Eiji,JPX, Millimeter wave semiconductor device.
상세보기
Ichitsubo,Ikuroh; Wang,Guan Wu; Wang,Weiping; Filipvic,Zlatko Aurelio, Multi-substrate RF module for wireless communication devices.
상세보기
Suzuki,Takuya, Multilayer dielectric substrate and semiconductor package.
상세보기
Weller, Thomas; Ketterl, Thomas, Nanometer-scale electromechanical switch and fabrication process.
상세보기
Daneman,Michael J.; Wall,Franklin; Behin,Behrang; Chaparala,Murali; Chang,Mark W.; Dalton,Scott; Beerling,Timothy; Panyko,Stephen; Kiang,Meng Hsiung; Kobrin,Boris; Lin,Chuang Chia, Optical cross-connect system.
상세보기
Okabe, Hiroshi; Matsumoto, Hidetoshi, Radio frequency circuit module.
상세보기
Nakai, Shinya; Kondo, Ryoichi, Radio frequency signal output module having radio-frequency power amplifier and isolator element.
상세보기
Iwaki,Hideki; Ogura,Tetsuyoshi; Taguchi,Yutaka, Semiconductor module.
상세보기
Rottenberg,Xavier; Jansen,Henri; Tilmans,Hendrikus; De Raedt,Walter, Switchable capacitor and method of making the same.
상세보기
du Toit, Cornelis Frederik; Ryan, Deirdre A., Tunable microwave devices with auto-adjusting matching circuit.
상세보기
Leedy,Glenn J., Vertical system integration.
상세보기

활용도 분석정보

상세보기

다운로드

내보내기

활용도 Top5 특허

해당 특허가 속한 카테고리에서 활용도가 높은 상위 5개 콘텐츠를 보여줍니다.
더보기 버튼을 클릭하시면 더 많은 관련자료를 살펴볼 수 있습니다.

내보내기 메뉴

내보내기 구분

파일저장
인쇄
메일전송

구성항목

기본정보
상세정보

관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC

저장형식

Text(ASCII format)
Excel format
PIAS분석(.xls)

메일정보

받는사람 (필수): @
보내는사람 (선택): @
제목
내용: KISTI 검색결과 이메일 서비스

안내

총 건의 자료가 검색되었습니다.

다운받으실 자료의 인덱스를 입력하세요. (1-10,000)

검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다.

데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요)

다운로드 파일은 UTF-8 형태로 저장됩니다.
파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오.

Text(ASCII format)
Excel format

AI-Helper ※ AI-Helper는 을 사용합니다.

AI-Helper

안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

연합인증

[미국특허] Method and system for communicating via flip-chip die and package waveguides 원문보기