Disclosed is a vacuum mold with at least a first plate and a second plate to mold materials (e.g., amorphous alloys), and a method for manufacturing parts using the mold. An ejector mechanism, to eject molded material, is enclosed within an ejector box that is vacuum sealed relative to the plates. A
Disclosed is a vacuum mold with at least a first plate and a second plate to mold materials (e.g., amorphous alloys), and a method for manufacturing parts using the mold. An ejector mechanism, to eject molded material, is enclosed within an ejector box that is vacuum sealed relative to the plates. An ejector rod for moving the mechanism is also vacuum sealed via a seal in a vacuum feed through opening. Seals are provided between adjacent interfaces of the mold parts (plates and ejector box) to vacuum seal the mold. The mold is connected to at least one vacuum source that applies vacuum pressure thereto via a first vacuum port in a first direction. A second vacuum port may also be provided to apply pressure in a second direction. A vacuum release valve may be connected to the mold to release vacuum pressure applied to the mold.
대표청구항▼
1. A vacuum mold comprising: at least a first plate and a second plate configured to mold amorphous alloy material therebetween so as to substantially eliminate exposure of the amorphous alloy material therebetween to oxygen and nitrogen;an enclosed ejector box positioned adjacent the at least first
1. A vacuum mold comprising: at least a first plate and a second plate configured to mold amorphous alloy material therebetween so as to substantially eliminate exposure of the amorphous alloy material therebetween to oxygen and nitrogen;an enclosed ejector box positioned adjacent the at least first and the second plates that is configured to be vacuum sealed by vacuum pressure from at least one vacuum source;at least a first vacuum port and a second vacuum port both in communication with the at least one vacuum source that is configured to apply vacuum pressure to the at least first and second plates and the enclosed ejector box;an ejector mechanism in the enclosed ejector box configured to eject molded amorphous alloy material from between the at least first and second plates;a plurality of seals configured to be positioned between adjacent interfaces of the at least first plate, the second plate, and the enclosed ejector box, andwherein the at least one vacuum source is configured to apply vacuum pressure from the at least one vacuum source to the at least first and second plates and the enclosed ejector box in a first direction using the first vacuum port and in a second direction to the at least first and second plates and the enclosed ejector box using the second vacuum port. 2. The mold according to claim 1, wherein the enclosed ejector box is configured to be vacuum sealed with respect to the second plate. 3. The mold according to claim 1, further comprising a vacuum release valve connected to the at least one vacuum port, and wherein the valve is configured to selectively release vacuum pressure applied to the at least first plate, the second plate, and the enclosed ejector box. 4. The mold according to claim 1, wherein the ejector mechanism further comprises an actuation portion configured to extend through an opening in the enclosed ejector box and an ejector plate connected to the actuation portion, and wherein the actuation portion is configured to move the ejector plate within the enclosed ejector box to eject the molded amorphous alloy material. 5. The mold according to claim 4, further comprising a seal configured to be positioned between the opening of the ejector box and the actuation portion of the ejector mechanism. 6. The mold according to claim 5, wherein the ejector plate further comprises a plurality of ejector pins extending in a linear direction, and wherein the ejector pins are configured to eject the molded amorphous alloy material upon movement of the ejector plate. 7. The mold according to claim 4, wherein the ejector mechanism is configured to move in a horizontal direction with respect to the enclosed ejector box. 8. The mold according to claim 1, further comprising at least one support plate provided adjacent the at least first plate, the second plate and/or the ejector box and that is configured to assist in molding the amorphous alloy material and that is configured to be vacuum sealed to the at least first plate, the second plate, and/or the ejector box by vacuum pressure from the at least one vacuum source. 9. The mold according to claim 8, further comprising one or more seals between adjacent interfaces of the at least one support plate and the at least first plate, second plate, and/or ejector box. 10. The mold according to claim 1, further comprising an injection system configured to inject melted amorphous alloy material between the at least first plate and the second plate in a horizontal direction. 11. The mold according to claim 1, wherein the second direction is different from the first direction. 12. The mold according to claim 1, wherein the second direction is perpendicular to the first direction. 13. A vacuum mold comprising: at least a first plate and a second plate configured to mold amorphous alloy material therebetween so as to substantially eliminate exposure of the amorphous alloy material therebetween to oxygen and nitrogen;an injection system configured to inject melted amorphous alloy material between the at least first plate and the second plate;at least a first vacuum port and a second vacuum port both in communication with at least one vacuum source that is configured to apply vacuum pressure to a mold cavity positioned between the at least first and second plates;an enclosed ejector box that is configured to be vacuum sealed with respect to the second plate by vacuum pressure from the at least one vacuum source;an ejector mechanism in the enclosed ejector box configured to eject molded amorphous alloy material from between the at least first and second plates, the ejector mechanism having an actuation portion configured to extend through an opening in the enclosed ejector box;a seal configured to be positioned between each adjacent interfaces of: (a) the at least first plate and the second plate, (b) the second plate and the enclosed ejector box, and (c) the opening of the ejector box and the actuation portion of the ejector mechanism, andwherein the at least one vacuum source is configured to apply vacuum pressure from the at least one vacuum source to the at least first and second plates and the enclosed ejector box in a first direction using the first vacuum port and in a second direction to the at least first and second plates and the enclosed ejector box using the second vacuum port. 14. The mold according to claim 13, further comprising a vacuum release valve connected to the at least one vacuum port, and wherein the valve is configured to release vacuum pressure applied to at least the mold cavity. 15. The mold according to claim 13, wherein the ejector mechanism comprises an ejector plate connected to the actuation portion, and wherein the actuation portion is configured to move the ejector plate within the enclosed ejector box to eject the molded amorphous alloy material. 16. The mold according to claim 15, wherein the ejector plate further comprises a plurality of ejector pins extending in a linear direction towards the second plate, and wherein the ejector pins are configured to eject the molded amorphous alloy material upon movement of the ejector plate. 17. The mold according to claim 15, wherein the ejector mechanism is configured to move in a horizontal direction with respect to the enclosed ejector box. 18. The mold according to claim 13, further comprising at least one support plate provided adjacent the at least first plate, the second plate and/or the ejector box and that is configured to assist in molding the amorphous alloy material and that is configured to be vacuum sealed to the at least first plate, the second plate, and/or the ejector box by vacuum pressure from the at least one vacuum source. 19. The mold according to claim 18, further comprising one or more seals provided between adjacent interfaces of the at least one support plate and the at least first plate, second plate, and/or ejector box. 20. The mold according to claim 13, wherein the injection system configured to inject melted amorphous alloy material in a horizontal direction. 21. The mold according to claim 13, wherein the second direction is different from the first direction. 22. The mold according to claim 13, wherein the second direction is perpendicular to the first direction. 23. A method of manufacturing a part of amorphous alloy material using a vacuum mold comprising: obtaining at least a first plate and a second plate configured to mold amorphous alloy material therebetween so as to substantially eliminate exposure of the amorphous alloy material therebetween to oxygen and nitrogen, the at least first and the second plates configured to be positioned adjacent an enclosed ejector box with a plurality of seals between adjacent interfaces of the at least first plate, the second plate, and the enclosed ejector box and configured to be vacuum sealed by vacuum pressure from at least one vacuum source configured to apply vacuum pressure to the at least first and second plates and the enclosed ejector box;applying a vacuum pressure to the at least first and second plates and the enclosed ejector box via at least a first vacuum port and a second vacuum port both in communication with the at least one vacuum source;injecting molten amorphous alloy material into a cavity between the at least first and second plates to mold the part;releasing the vacuum pressure applied to the at least first and second plates and the enclosed ejector box via the at least one vacuum port;moving the at least first plate and the second plate relative to and away from each other;actuating an ejector mechanism positioned within the enclosed ejector box by moving an actuation portion extending through an opening in the enclosed ejector box, andejecting the molded part from between the at least first and second plates using the ejector mechanism,wherein applying a vacuum pressure to the at least first and second plates and the enclosed ejector box comprises applying vacuum pressure from the at least one vacuum source to the at least first and second plates and the enclosed ejector box in a first direction using the first vacuum port and in a second direction to the at least first and second plates and the enclosed ejector box using the second vacuum port. 24. The method according to claim 23, further comprising a seal between the opening in the enclosed ejector box and the actuation portion of the ejector mechanism. 25. The method according to claim 24, wherein actuating of the ejector mechanism comprises moving the ejector mechanism in a horizontal direction with respect to the enclosed ejector box. 26. The method according to claim 23, wherein the ejector mechanism comprises an ejector plate connected to the actuation portion, and wherein the actuating comprises moving the ejector plate within the enclosed ejector box to eject the molded part. 27. The method according to claim 26, wherein the ejector plate further comprises a plurality of ejector pins extending in a linear direction, and wherein the ejecting comprises the ejector pins being moved in a linear direction to eject the molded part upon moving the ejector plate. 28. The method according to claim 23, wherein the second direction is different from the first direction. 29. The method according to claim 23, wherein the second direction is perpendicular to the first direction. 30. A vacuum mold comprising: at least a first plate and a second plate configured to mold amorphous alloy material therebetween so as to substantially eliminate exposure of the amorphous alloy material therebetween to oxygen and nitrogen;an enclosed ejector box positioned adjacent the at least first and the second plates that is configured to be vacuum sealed by vacuum pressure from at least one vacuum source;at least one vacuum port in communication with the at least one vacuum source that is configured to apply vacuum pressure to the at least first and second plates and the enclosed ejector box;an ejector mechanism in the enclosed ejector box configured to eject molded amorphous alloy material from between the at least first and second plates, the ejector mechanism comprising an actuation portion extending through a base plate of the enclosed ejector box, wherein the actuation portion at least partially extends outside of the enclosed ejector box; anda plurality of seals configured to be positioned between adjacent interfaces of the at least first plate, the second plate, and the enclosed ejector box, at least one of the seals provided at an interface between the actuation portion of the ejector mechanism and the base plate of the enclosed ejector box to vacuum seal the enclosed ejector box. 31. The mold according to claim 30, wherein the actuation portion extending outside of the base plate is outside an area within the ejector box that is vacuum sealed. 32. The mold according to claim 30, further comprising a seal positioned between adjacent surfaces of the second plate and the enclosed ejector box during application of the vacuum pressure. 33. The mold according to claim 30, wherein the base plate of the ejector box is spaced from the second plate such that an area is formed therebetween, and wherein the area is configured to be vacuum sealed by vacuum pressure. 34. The mold according to claim 30, wherein the ejector box further comprises one or more side plates extending between the base plate and the second plate.
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이 특허에 인용된 특허 (25)
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