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A method of forming an electronic device, including forming a preliminary buffer layer on a drift layer, forming a first layer on the preliminary buffer layer, selectively etching the first layer to form a first mesa that exposes a portion of the preliminary buffer layer, and selectively etching the

A method of forming an electronic device, including forming a preliminary buffer layer on a drift layer, forming a first layer on the preliminary buffer layer, selectively etching the first layer to form a first mesa that exposes a portion of the preliminary buffer layer, and selectively etching the exposed portion of the preliminary buffer layer to form a second mesa that covers a first portion of the drift layer, that exposes a second portion of the drift layer, and that includes a mesa step that protrudes from the first mesa. Dopants are selectively implanted into the drift layer adjacent the second mesa to form a junction termination region in the drift layer. Dopants are selectively implanted through a horizontal surface of the mesa step into a portion of the drift layer beneath the mesa step to form a buried junction extension in the drift layer.

대표청구항 ▼

1. A method of forming an electronic device, comprising: forming a preliminary buffer layer having a second conductivity type on a drift layer having a first conductivity type;forming a first layer having the second conductivity type on the preliminary buffer layer;selectively etching the first laye

1. A method of forming an electronic device, comprising: forming a preliminary buffer layer having a second conductivity type on a drift layer having a first conductivity type;forming a first layer having the second conductivity type on the preliminary buffer layer;selectively etching the first layer to form a first mesa that exposes a portion of the preliminary buffer layer;selectively etching the exposed portion of the preliminary buffer layer to form a second mesa that covers a first portion of the drift layer, that exposes a second portion of the drift layer, and that includes a mesa step that protrudes from the first mesa;selectively implanting second conductivity type dopants into the drift layer adjacent the second mesa to form a junction termination region in the drift layer; andselectively implanting second conductivity type dopants through a horizontal surface of the mesa step into the first portion of the drift layer beneath the mesa step to form a buried junction extension in the drift layer;wherein a first side of the buried junction extension is vertically aligned with a vertical sidewall of the first mesa and a second side of the buried junction extension is vertically aligned with a vertical sidewall of the second mesa. 2. The method of claim 1, wherein the second conductivity type is opposite the first conductivity type. 3. The method of claim 1, wherein the buffer layer has a thickness of about 0.2 μm to about 0.3 μm, and wherein the buried junction extension has a net doping concentration of about 1×1016 cm−3 to about 4×1017 cm−3. 4. The method of claim 1, wherein the buried junction extension extends into the drift layer to a depth beneath the buffer layer of about 0.3 μm. 5. The method of claim 1, wherein the horizontal surface of the mesa step is defined between the vertical sidewall of the first mesa and the vertical sidewall of the second mesa. 6. The method of claim 1, wherein selectively etching the exposed portion of the preliminary buffer layer to form the second mesa comprises etching the second portion of the drift layer. 7. The method of claim 1, further comprising: providing a substrate; andforming the drift layer on the substrate, wherein the substrate has the first conductivity type. 8. The method of claim 1, further comprising: providing a substrate; andforming the drift layer on the substrate, wherein the substrate has the second conductivity type. 9. The method of claim 1, further comprising: forming a second layer having the first conductivity type on the first layer, wherein selectively etching the first layer to form the first mesa comprises selectively etching the second layer.