IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0108031
(2011-05-16)
|
등록번호 |
US-8466482
(2013-06-18)
|
우선권정보 |
JP-2000-024540 (2000-02-01) |
발명자
/ 주소 |
|
출원인 / 주소 |
- Semiconductor Energy Laboratory Co., Ltd.
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
24 인용 특허 :
72 |
초록
▼
A high performance electric device which uses an adhesive layer over a substrate. A color filter is over a substrate, and an adhesive layer is also located over the substrate and color film. An insulating layer is over the adhesive layer, and thin film transistors cover the insulating film and the c
A high performance electric device which uses an adhesive layer over a substrate. A color filter is over a substrate, and an adhesive layer is also located over the substrate and color film. An insulating layer is over the adhesive layer, and thin film transistors cover the insulating film and the color filters. Light emitting elements cover the thin film transistors and emit light through the substrate that is through the adhesive layer and color filter. The substrate may be plastic, thus increasing the heat resistance.
대표청구항
▼
1. A semiconductor device comprising: a first substrate;a color filter over the first substrate;a second substrate over the color filter;a pixel circuit comprising a first thin film transistor and a light emitting element electrically connected to the first thin film transistor, the light emitting e
1. A semiconductor device comprising: a first substrate;a color filter over the first substrate;a second substrate over the color filter;a pixel circuit comprising a first thin film transistor and a light emitting element electrically connected to the first thin film transistor, the light emitting element being configured to emit light by carriers recombination,a driver circuit comprising a second thin film transistor electrically connected to the pixel circuit; andwherein the light emitting element and the driver circuit are interposed between the color filter and the second substrate;wherein the second thin film transistor and the color filter overlap with each other when seen from above. 2. A semiconductor device according to claim 1, wherein the color filter is provided in a location vertically aligned with a channel forming region of the second thin film transistor. 3. A semiconductor device according to claim 1, wherein the light emitting element is located over the driver circuit. 4. A semiconductor device according to claim 1, wherein at least one of the first substrate and the second substrate comprises organic material. 5. A semiconductor device according to claim 1, wherein at least one of the first substrate and the second substrate is a plastic substrate. 6. A device according to claim 1, wherein the semiconductor device is selected from the group consisting of a video camera, a digital camera, a goggle type display, a car navigation system, a personal computer, and a personal digital assistant. 7. A semiconductor device comprising: a first substrate;a color filter over the first substrate;an organic compound layer over the color filter;a second substrate over the organic compound layer;a pixel circuit comprising a first thin film transistor and a light emitting element electrically connected to the first thin film transistor, the light emitting element being configured to emit light by carriers recombination,a driver circuit comprising a second thin film transistor electrically connected to the pixel circuit; andan organic insulating film interposed between the light emitting element and the driver circuit;wherein the light emitting element and the driver circuit are interposed between the organic compound layer and the second substrate;wherein the second thin film transistor and the color filter overlap with each other when seen from above. 8. A semiconductor device according to claim 7, wherein the color filter is provided in a location vertically aligned with a channel forming region of the second thin film transistor. 9. A semiconductor device according to claim 7, wherein the light emitting element is located over the driver circuit. 10. A semiconductor device according to claim 7, wherein at least one of the first substrate and the second substrate comprises organic material. 11. A semiconductor device according to claim 7, wherein at least one of the first substrate and the second substrate is a plastic substrate. 12. A semiconductor device according to claim 7, wherein the organic compound layer comprises a material selected from the group consisting of polyimide, acrylic, and epoxy resin. 13. A device according to claim 7, wherein the semiconductor device is selected from the group consisting of a video camera, a digital camera, a goggle type display, a car navigation system, a personal computer, and a personal digital assistant. 14. A semiconductor device comprising: a first substrate;a color filter over the first substrate;an adhesive layer over the color filter;a second substrate over the adhesive layer;a pixel circuit comprising a first thin film transistor and a light emitting element electrically connected to the first thin film transistor, the light emitting element being configured to emit light by carriers recombination,a driver circuit comprising a second thin film transistor electrically connected to the pixel circuit; andan organic insulating film interposed between the light emitting element and the driver circuit;wherein the light emitting element and the driver circuit are interposed between the adhesive layer and the second substrate;wherein the second thin film transistor and the color filter overlap with each other when seen from above. 15. A semiconductor device according to claim 14, wherein the color filter is provided in a location vertically aligned with a channel forming region of the second thin film transistor. 16. A semiconductor device according to claim 14, wherein the light emitting element is located over the driver circuit. 17. A semiconductor device according to claim 14, wherein at least one of the first substrate and the second substrate comprises organic material. 18. A semiconductor device according to claim 14, wherein at least one of the first substrate and the second substrate is a plastic substrate. 19. A semiconductor device according to claim 14, wherein the adhesive layer comprises a material selected from the group consisting of polyimide, acrylic, and epoxy resin. 20. A device according to claim 14, wherein the semiconductor device is selected from the group consisting of a video camera, a digital camera, a goggle type display, a car navigation system, a personal computer, and a personal digital assistant.
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