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An electrical connector system may include a plurality of wafer assemblies. Each wafer assembly may include a first overmolded array of electrical contacts defining a plurality of apertures; a second overmolded array of electrical contacts configured to be assembled with the first overmolded array o

An electrical connector system may include a plurality of wafer assemblies. Each wafer assembly may include a first overmolded array of electrical contacts defining a plurality of apertures; a second overmolded array of electrical contacts configured to be assembled with the first overmolded array of electrical contacts, the second overmolded array of electrical contacts defining a plurality of apertures; and a conductive ground bracket positioned in the wafer assembly between the first overmolded array of electrical contacts and the second array of electrical contacts. The conductive ground bracket defines a first array of ridges, each ridge of the first array of ridges positioned in an aperture of the first overmolded array of electrical contacts. The conductive ground bracket defines a second array of ridges, each ridge of the second array of ridges positioned in an aperture of the second overmolded array of electrical contacts.

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1. An electrical connector system comprising: a plurality of wafer assemblies defining a mating end and a mounting end, each of the wafer assemblies comprising: a first overmolded array of electrical contacts, each electrical contact of the first overmolded array of electrical contacts defining an e

1. An electrical connector system comprising: a plurality of wafer assemblies defining a mating end and a mounting end, each of the wafer assemblies comprising: a first overmolded array of electrical contacts, each electrical contact of the first overmolded array of electrical contacts defining an electrical mating connector extending past an edge of an overmold of the first overmolded array of electrical contacts at the mating end of the wafer assembly, the first overmolded array of electrical contacts defining a plurality of apertures;a second overmolded array of electrical contacts configured to be assembled with the first overmolded array of electrical contacts, each electrical contact of the second overmolded array of electrical contacts defining an electrical mating connector extending past an edge of an overmold of the second overmolded array of electrical contacts at the mating end of the wafer assembly, the second overmolded array of electrical contacts defining a plurality of apertures; anda conductive ground bracket positioned in the wafer assembly between a portion of the first overmolded array of electrical contacts and a portion of the second overmolded array of electrical contacts;wherein the conductive ground bracket defines a first array of ridges on a first side of the conductive ground bracket, each ridge of the first array of ridges positioned in an aperture of the plurality of apertures defined by the first overmolded array of electrical contacts;wherein the conductive ground bracket defines a second array of ridges on a second side of the conductive ground bracket that is opposite to the first side of the conductive ground bracket, each ridge of the second array of ridges positioned in an aperture of the plurality of apertures defined by the second overmolded array of electrical contacts; andwherein for each wafer assembly of the plurality of wafer assemblies, each electrical contact of the first overmolded array of electrical contacts is positioned in the wafer assembly adjacent to an electrical contact of the second overmolded array of electrical contacts to form a plurality of electrical contact pairs, and wherein for each electrical contact pair, the electrical mating connector of the electrical contact of the first overmolded array of electrical contacts is horizontally aligned with the electrical mating connector of the electrical contact of the second overmolded array of electrical contacts. 2. The electrical connector system of claim 1, wherein the conductive ground bracket comprises die casting metal. 3. The electrical connector system of claim 1, wherein the conductive ground bracket comprises conductive plastic. 4. The electrical connector system of claim 1, wherein each of the wafer assemblies further comprises: a first ground shield configured to be assembled with the first overmolded array of electrical contacts, wherein an end of each ridge of the first array of ridges defined by the conductive ground bracket is positioned in the wafer assembly adjacent to the first ground shield; anda second ground shield configured to be assembled with the second overmolded array of electrical contacts, wherein an end of each ridge of the second array of ridges defined by the conductive ground bracket is positioned in the wafer assembly adjacent to the second ground shield; andwhere the conductive ground bracket, the first ground shield, and the second ground shield are electrically commoned to provide the wafer assembly with a common ground. 5. The electrical connector system of claim 1, wherein each of the wafer assemblies further comprises: a first ground shield configured to be assembled with the first overmolded array of electrical contacts, the first ground shield defining a plurality of apertures; anda second ground shield configured to be assembled with the second overmolded array of electrical contacts, the second ground shield defining a plurality of apertures;wherein at least a portion of a ridge of the first array of ridges defined by the conductive ground bracket passes through an aperture of the plurality of apertures defined by the first overmolded array of electrical contacts and is positioned in an aperture of the plurality of apertures defined by the first ground shield; andwherein at least a portion of a ridge of the second array of ridges defined by the conductive ground bracket passes through an aperture of the plurality of apertures defined by the second overmolded array of electrical contacts and is positioned in an aperture of the plurality of apertures defined by the second ground shield; andwherein for each of the wafer assemblies, the conductive ground bracket, the first ground shield, and the second ground shield provide the wafer assembly with a common ground. 6. The electrical connector system of claim 5, wherein for each of the wafer assemblies: the first ground shield defines a plurality of ground tab portions extending past the edge of the overmold of the first overmolded array of electrical contacts when the first ground shield is assembled with the first overmolded array of electrical contacts;the second ground shield defines a plurality of ground tab portions extending past the edge of the overmold of the second overmolded array of electrical contacts when the second ground shield is assembled with the second overmolded array of electrical contacts; andeach ground tab portion of the plurality of ground tab portions of the first ground shield is positioned in the wafer assembly adjacent to a ground tab portion of the plurality of ground tab portions of the second ground shield to form a plurality of ground tabs. 7. The electrical connector system of claim 6, wherein for each wafer assembly, a ground tab of the plurality of ground tabs is positioned between two pairs of electrical mating connectors of the plurality of electrical contact pairs at the mating end of the wafer assembly. 8. The electrical connector system of claim 1, where each electrical contact of the second overmolded array of electrical contacts mirrors an adjacent electrical contact of the first overmolded array of electrical contacts. 9. The electrical connector system of claim 1, wherein a distance between an electrical contact of the first overmolded array of electrical contacts and an adjacent electrical contact of the second overmolded array of electrical contacts is substantially the same throughout a wafer assembly of the plurality of wafer assemblies. 10. The electrical connector system of claim 1, wherein the overmold of the first overmolded array of electrical contacts and the overmold of the second overmolded array of electrical contacts comprises plastic. 11. The electrical connector system of claim 1, wherein for each wafer assembly, the first overmolded array of electrical contacts defines a plurality of stops configured to abut a wafer housing when the wafer assembly is positioned in the wafer housing 12. A wafer assembly comprising: a first overmolded array of electrical contacts, each electrical contact of the first overmolded array of electrical contacts defining an electrical mating connector extending past an edge of an overmold of the first overmolded array of electrical contacts at a mating end of the wafer assembly, the first overmolded array of electrical contacts defining a plurality of apertures;a second overmolded array of electrical contacts configured to be assembled with the first overmolded array of electrical contacts, each electrical contact of the second overmolded array of electrical contacts defining an electrical mating connector extending past an edge of an overmold of the second overmolded array of electrical contacts at the mating end of the wafer assembly, the second overmolded array of electrical contacts defining a plurality of apertures; anda conductive ground bracket positioned in the wafer assembly between a portion of the first overmolded array of electrical contacts and a portion of the second array of electrical contacts;wherein the conductive ground bracket defines a first array of ridges on a first side of the conductive ground bracket, each ridge of the first array of ridges positioned in an aperture of the plurality of apertures defined by the first overmolded array of electrical contacts;wherein the conductive ground bracket defines a second array of ridges on a second side of the conductive ground bracket that is opposite to the first side of the conductive ground bracket, each ridge of the second array of ridges positioned in an aperture of the plurality of apertures defined by the second overmolded array of electrical contacts; andwherein each electrical contact of the first overmolded array of electrical contacts is positioned in the wafer assembly adjacent to an electrical contact of the second overmolded array of electrical contacts to form a plurality of electrical contact pairs, and wherein for each electrical contact pair, the electrical mating connector of the electrical contact of the first overmolded array of electrical contacts is horizontally aligned with the electrical mating connector of the electrical contact of the second overmolded array of electrical contacts. 13. The wafer assembly of claim 12, further comprising: a first ground shield configured to be assembled with the first overmolded array of electrical contacts, wherein an end of each ridge of the first array of ridges defined by the conductive ground bracket is positioned in the wafer assembly adjacent to the first ground shield; anda second ground shield configured to be assembled with the second overmolded array of electrical contacts, wherein an end of each ridge of the second array of ridges defined by the conductive ground bracket is positioned in the wafer assembly adjacent to the second ground shield. 14. The wafer assembly of claim 13, where the conductive ground bracket, the first ground shield, and the second ground shield are electrically commoned to provide the wafer assembly with a common ground. 15. The wafer assembly of claim 12, further comprising: a first ground shield configured to be assembled with the first overmolded array of electrical contacts, the first ground shield defining a plurality of apertures; anda second ground shield configured to be assembled with the second overmolded array of electrical contacts, the second ground shield defining a plurality of apertures;wherein at least a portion of a ridge of the first array of ridges defined by the conductive ground bracket passes through an aperture of the plurality of apertures defined by the first overmolded array of electrical contacts and is positioned in an aperture of the plurality of apertures defined by the first ground shield; andwherein at least a portion of a ridge of the second array of ridges defined by the conductive ground bracket passes through an aperture of the plurality of apertures defined by the second overmolded array of electrical contacts and is positioned in an aperture of the plurality of apertures defined by the second ground shield. 16. The wafer assembly of claim 15, wherein the conductive ground bracket, the first ground shield, and the second ground shield provide the wafer assembly with a common ground. 17. The wafer assembly of claim 15, wherein the first ground shield defines a plurality of ground tab portions extending past the edge of the overmold of the first overmolded array of electrical contacts when the first ground shield is assembled with the first overmolded array of electrical contacts; wherein the second ground shield defines a plurality of ground tab portions extending past the edge of the overmold of the second overmolded array of electrical contacts when the second ground shield is assembled with the second overmolded array of electrical contacts; andwherein each ground tab portion of the plurality of ground tab portions of the first ground shield is positioned in the wafer assembly adjacent to a ground tab portion of the plurality of ground tab portions of the second ground shield to form a plurality of ground tabs. 18. A wafer assembly comprising: a first overmolded array of electrical contacts, each electrical contact of the first overmolded array of electrical contacts defining an electrical mating connector extending past an edge of an overmold of the first overmolded array of electrical contacts at a mating end of the wafer assembly, the first overmolded array of electrical contacts defining a plurality of apertures;a first ground shield configured to be assembled with the first overmolded array of electrical contacts, the first ground shield defining a plurality of apertures;a second overmolded array of electrical contacts configured to be assembled with the first overmolded array of electrical contacts, each electrical contact of the second overmolded array of electrical contacts defining an electrical mating connector extending past an edge of an overmold of the second overmolded array of electrical contacts at the mating end of the wafer assembly, the second overmolded array of electrical contacts defining a plurality of apertures;a second ground shield configured to be assembled with the second overmolded array of electrical contacts, the second ground shield defining a plurality of apertures; anda conductive ground bracket positioned in the wafer assembly between a portion of the first overmolded array of electrical contacts and a portion of the second array of electrical contacts;wherein the conductive ground bracket defines a first array of ridges on a first side of the conductive ground bracket, each ridge of the first array of ridges positioned in an aperture of the plurality of apertures defined by the first overmolded array of electrical contacts and positioned in an aperture of the plurality of apertures defined by the first ground shield;wherein the conductive ground bracket defines a second array of ridges on a second side of the conductive ground bracket that is opposite to the first side of the conductive ground bracket, each ridge of the second array of ridges positioned in an aperture of the plurality of apertures defined by the second overmolded array of electrical contacts and an aperture of the plurality of apertures defined by the second ground shield; andwherein the conductive ground bracket, first ground shield, and second ground shield provide the wafer assembly with a common ground. 19. The wafer assembly of claim 18, wherein the first ground shield defines a plurality of ground tab portions extending past the edge of the of the overmold of the first overmolded array of electrical contacts when the first ground shield is assembled with the first overmolded array of electrical contacts; wherein the second ground shield defines a plurality of ground tab portions extending past the edge of the overmold of the second overmolded array of electrical contacts when the second ground shield is assembled with the second overmolded array of electrical contacts; andwherein each ground tab portion of the plurality of ground tab portions of the first ground shield is positioned in the wafer assembly adjacent to a ground tab portion of the plurality of ground tab portions of the second ground shield to form a plurality of ground tabs.