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A bond substrate is irradiated with ions, so that an embrittlement layer is formed, then, the bond substrate is bonded to a base substrate. Next, a part of a region of the bonded bond substrate is heated at a temperature higher than a temperature of the other part of the region of the bond substrate

A bond substrate is irradiated with ions, so that an embrittlement layer is formed, then, the bond substrate is bonded to a base substrate. Next, a part of a region of the bonded bond substrate is heated at a temperature higher than a temperature of the other part of the region of the bond substrate, or alternatively, a first heat treatment is performed on the bonded bond substrate as a whole at a first temperature; and a second heat treatment is performed on a part of a region of the bonded bond substrate at a second temperature higher than the first temperature, so that separation of the bond substrate proceeds from the part of the region of the bond substrate to the other part of the region of the bond substrate in the embrittlement layer. Accordingly, a semiconductor layer is formed over the base substrate.

대표청구항 ▼

1. A method for manufacturing an SOI substrate, comprising the steps of: irradiating a semiconductor substrate with ions to form an embrittlement layer in the semiconductor substrate;bonding the semiconductor substrate to a base substrate; and,heating a first region of the semiconductor substrate at

1. A method for manufacturing an SOI substrate, comprising the steps of: irradiating a semiconductor substrate with ions to form an embrittlement layer in the semiconductor substrate;bonding the semiconductor substrate to a base substrate; and,heating a first region of the semiconductor substrate at a first temperature and heating a second region of the semiconductor substrate at a second temperature lower than the first temperature to form a semiconductor layer over the base substrate by causing separation at the embrittlement layer,wherein the first region is located at an end portion of the semiconductor substrate,wherein during the heating step, bubble growth is caused in the embrittlement layer, andwherein the bubble growth in the first region of the semiconductor substrate proceeds faster than the bubble growth in the second region of the semiconductor substrate and thereby the separation proceeds from the first region of the semiconductor substrate to the second region of the semiconductor substrate. 2. The method for manufacturing an SOI substrate according to claim 1, wherein the first temperature is higher by 10° C. or more and 30° C. or less than the second temperature. 3. The method for manufacturing an SOI substrate according to claim 1, wherein the first temperature is higher by 10° C. or more and 15° C. or less than the second temperature. 4. The method for manufacturing an SOI substrate according to claim 1, further comprising the step of forming an insulating layer over at least one of the semiconductor substrate or the base substrate before bonding the semiconductor substrate to the base substrate. 5. The method for manufacturing an SOI substrate according to claim 1, further comprising the step of removing a region of the semiconductor layer corresponding to the first region of the semiconductor substrate. 6. The method for manufacturing an SOI substrate according to claim 1, wherein the ions including hydrogen ions. 7. A method for manufacturing an SOI substrate, comprising the steps of: irradiating a semiconductor substrate with ions to form an embrittlement layer in the semiconductor substrate;bonding the semiconductor substrate to a base substrate;performing a first heat treatment on the semiconductor substrate at a first temperature; and,performing a second heat treatment on one region which is a part of the semiconductor substrate at a second temperature higher than the first temperature to form a semiconductor layer over the base substrate by causing separation at the embrittlement layer,wherein the separation proceeds from the one region of the semiconductor substrate to the other region of the semiconductor substrate. 8. The method for manufacturing an SOI substrate according to claim 7, wherein the second temperature is higher by 10° C. or more than the first temperature. 9. The method for manufacturing an SOI substrate according to claim 7, further comprising the steps of forming an insulating layer over at least one of the semiconductor substrate or the base substrate before bonding the semiconductor substrate to the base substrate. 10. The method for manufacturing an SOI substrate according to claim 7, further comprising the step of removing a region of the semiconductor layer corresponding to the one region of the semiconductor substrate. 11. The method for manufacturing an SOI substrate according to claim 7, wherein the ions including hydrogen ions. 12. A method for manufacturing a semiconductor device, comprising the steps of: irradiating a semiconductor substrate with ions to form an embrittlement layer in the semiconductor substrate;bonding the semiconductor substrate to a base substrate; and,heating a first region of the semiconductor substrate at a first temperature and a second region of the semiconductor substrate at a second temperature lower than the first temperature to form a first semiconductor layer over the base substrate by causing separation at the embrittlement layer;removing a region of the first semiconductor layer corresponding to the first region of the semiconductor substrate to form a second semiconductor layer; andforming a semiconductor element with the second semiconductor layer,wherein the separation proceeds from the first region of the semiconductor substrate to the second region of the semiconductor substrate. 13. The method for manufacturing a semiconductor device according to claim 12, wherein the first temperature is higher by 10° C. or more and 30° C. or less than the second temperature. 14. The method for manufacturing a semiconductor device according to claim 12, wherein the first temperature is higher by 10° C. or more and 15° C. or less than the second temperature. 15. The method for manufacturing a semiconductor device according to claim 12, further comprising the step of forming an insulating layer over at least one of the semiconductor substrate or the base substrate before bonding the semiconductor substrate to the base substrate. 16. The method for manufacturing a semiconductor device according to claim 12, wherein an average surface roughness of a surface of the second semiconductor layer is less than or equal to 6.0 nm. 17. The method for manufacturing a semiconductor device according to claim 12, wherein the maximum peak-to-valley height of a surface of the second semiconductor layer is less than or equal to 150 nm. 18. The method for manufacturing a semiconductor device according to claim 12, wherein a root-mean-square surface roughness of a surface of the second semiconductor layer is less than or equal to 10 nm. 19. The method for manufacturing a semiconductor device according to claim 12, wherein the ions including hydrogen ions. 20. A method for manufacturing a semiconductor device, comprising the steps of: irradiating a semiconductor substrate with ions to form an embrittlement layer in the semiconductor substrate;bonding the semiconductor substrate to a base substrate;performing a first heat treatment on the semiconductor substrate at a first temperature;performing a second heat treatment on one region which is a part of the semiconductor substrate at a second temperature higher than the first temperature to form a first semiconductor layer over the base substrate by causing separation at the embrittlement layer;removing a region of the first semiconductor layer corresponding to the one region of the semiconductor substrate to form a second semiconductor layer; andforming a semiconductor element with the second semiconductor layer,wherein the separation proceeds from the one region of the semiconductor substrate to the other region of the semiconductor substrate. 21. The method for manufacturing a semiconductor device according to claim 20, wherein the second temperature is higher by 10° C. or more than the first temperature. 22. The method for manufacturing a semiconductor device according to claim 20, further comprising the step of forming an insulating layer over at least one of the semiconductor substrate or the base substrate before bonding the semiconductor substrate to the base substrate. 23. The method for manufacturing a semiconductor device according to claim 20, wherein an average surface roughness of a surface of the second semiconductor layer is less than or equal to 6.0 nm. 24. The method for manufacturing a semiconductor device according to claim 20, wherein the maximum peak-to-valley height of a surface of the second semiconductor layer is less than or equal to 150 nm. 25. The method for manufacturing a semiconductor device according to claim 20, wherein a root-mean-square surface roughness of a surface of the second semiconductor layer is less than or equal to 10 nm. 26. The method for manufacturing a semiconductor device according to claim 20, wherein the ions including hydrogen ions. 27. The method for manufacturing an SOI substrate according to claim 1, wherein an average surface roughness of a surface of a region of the semiconductor layer corresponding to the second region of the semiconductor substrate is less than or equal to 6.0 nm. 28. The method for manufacturing an SOI substrate according to claim 1, wherein the maximum peak-to-valley height of a surface of a region of the semiconductor layer corresponding to the second region of the semiconductor substrate is less than or equal to 150 nm. 29. The method for manufacturing an SOI substrate according to claim 1, wherein a root-mean-square surface roughness of a surface of a region of the semiconductor layer corresponding to the second region of the semiconductor substrate is less than or equal to 10 nm. 30. The method for manufacturing an SOI substrate according to claim 7, wherein an average surface roughness of a region of the semiconductor layer corresponding to the other region of the semiconductor substrate is less than or equal to 6.0 nm. 31. The method for manufacturing an SOI substrate according to claim 7, wherein the maximum peak-to-valley height of a surface of a region of the semiconductor layer corresponding to the other region of the semiconductor substrate is less than or equal to 150 nm. 32. The method for manufacturing an SOI substrate according to claim 7, wherein a root-mean-square surface roughness of a surface of a region of the semiconductor layer corresponding to the other region of the semiconductor substrate is less than or equal to 10 nm.