IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0587099
(2005-04-20)
|
등록번호 |
US-8477310
(2013-07-02)
|
우선권정보 |
JP-2004-128536 (2004-04-23) |
국제출원번호 |
PCT/JP2005/007507
(2005-04-20)
|
§371/§102 date |
20070801
(20070801)
|
국제공개번호 |
WO2005/104196
(2005-11-03)
|
발명자
/ 주소 |
- Kobayashi, Mitsuru
- Yasuda, Masahiko
|
출원인 / 주소 |
|
인용정보 |
피인용 횟수 :
0 인용 특허 :
15 |
초록
▼
To perform high-speed and highly accurate measurement by setting desired measuring conditions for each measuring object. In an alignment sensor of exposure apparatus, in the case of performing position measurement for a plurality of sample shots, measurement is performed by changing the measuring co
To perform high-speed and highly accurate measurement by setting desired measuring conditions for each measuring object. In an alignment sensor of exposure apparatus, in the case of performing position measurement for a plurality of sample shots, measurement is performed by changing the measuring conditions, in response to a measuring axis direction, a mark or a layer whereupon a mark to be measured exists. At that time, for the measuring objects to be measured under the same measuring conditions, for example, a position in a Y axis direction and a position in an X axis direction, measurement is continuously performed. When the measuring condition is changed, a baseline value is remeasured. The changeable measuring conditions are wavelength of measuring light, use and selection of a retarder, NA and σ of an optical system, a light quantity of measuring light, illumination shape, signal processing algorithm, etc.
대표청구항
▼
1. A measurement method, of using a measurement system to measure a plurality of X marks and a plurality of Y marks as measurement objects formed on a prescribed substrate, comprising: a first process of setting a measurement condition for the measurement system to a first condition when measuring,
1. A measurement method, of using a measurement system to measure a plurality of X marks and a plurality of Y marks as measurement objects formed on a prescribed substrate, comprising: a first process of setting a measurement condition for the measurement system to a first condition when measuring, with the measurement system, all of the X marks among the marks which are the measurement objects on the prescribed substrate without measuring the Y marks under the first condition, the X marks including all marks for measuring positions in a first direction in a two-dimensional place on the substrate, the Y marks including all marks for measuring positions in a second direction orthogonal to the first direction in the two-dimensional plane on the substrate;a second process, after measuring all of the X marks on the prescribed substrate under the first condition, of switching the measurement condition from the first condition and setting a second condition; anda third process of measuring, with the measurement system, all of the Y marks without measuring the X marks, under the second condition. 2. The measurement method according to claim 1, wherein the X marks are marks formed on a first layer disposed on the substrate, and the Y marks are marks formed on a second layer disposed on the substrate and different from the first layer. 3. An exposure method, of transferring a pattern formed on a mask to a substrate, comprising: a process of using the measurement method according to claim 1, to measure the positions of marks formed on the mask or on the substrate, and of positioning the mask or the substrate based on the measurement result. 4. A measurement apparatus that measures measurement objects on a body by means of the measurement method according to claim 1. 5. The measurement method according to claim 1, wherein: each of the X marks has line patterns that extend in a Y direction;each of the Y marks has line patterns that extend in an X direction, the X direction being orthogonal to the Y direction. 6. A measurement method, of using a measurement system comprising an illumination optical system which illuminates a plurality of X marks and a plurality of Y marks, which are measurement objects formed on a prescribed substrate, with an illumination beam, and a light-receiving optical system which receives the beam from the marks, wherein the measurement system comprises, as a measurement condition which can be modified when measuring the marks, a light quantity of the illumination beam, NA or σ of the illumination optical system, an insertion or retraction of a phase-imparting member which imparts a prescribed phase difference to a diffraction beam of prescribed order arising from the marks, into or out of the optical path of the light-receiving optical system, and a signal processing condition when processing a photoelectric conversion signal obtained upon receiving the beam arising from the marks,the method comprising:when measuring the X marks on the prescribed substrate with the measurement system without measuring the Y marks, setting the measurement condition of the measurement system to a first condition, the X marks including all marks for measuring positions in a first direction in a two-dimensional plane on the substrate; andwhen measuring the Y marks on the prescribed substrate with the measurement system without measuring the X marks, setting the measurement condition of the measurement system to a second condition different from the first condition, the Y marks including all marks for measuring positions in a second direction orthogonal to the first direction in the two-dimensional plane on the substrate. 7. A method for measuring a plurality of X marks and a plurality of Y marks formed on a substrate by using a measurement system, the method comprising: setting a measurement condition for the measurement system to a first condition;measuring, with the measurement system, positions of all of the X marks under the first condition without measuring the Y marks, the X marks for measuring positions on the substrate in a first direction in a two-dimensional plane, the Y marks for measuring positions on the substrate in a second direction orthogonal to the first direction in the two-dimensional plane;switching the measurement condition from the first condition to a second condition after the measurement of all of the X marks; andmeasuring, with the measurement system, positions of all of the Y marks under the second direction without measuring the X marks. 8. An exposure method for transferring a pattern formed on a mask to a substrate, comprising: measuring positions of marks formed on the mask or the substrate by using the method according to claim 7; andpositioning the mask or the substrate based on a result of the measurement. 9. A measurement apparatus that measures a measurement object on a body by using the method according to claim 7. 10. A measurement method comprising: measuring a plurality of X marks on a substrate with a measurement system under a first condition without measuring the Y marks, the X marks each having line patterns that extend in a Y direction, the Y marks having line patterns that extend in an X direction, the X direction being orthogonal to the Y direction;after measuring X marks on the substrate under the first condition, switching the measurement condition from the first condition to a second condition, the second condition being different from the first condition; andmeasuring the Y marks on the substrate with the measurement system under the second condition without measuring the X marks. 11. An exposure method comprising: measuring positions of marks formed on a mask or a substrate by using the measurement method according to claim 10;positioning the mask or the substrate based on the measurement result; andtransferring a pattern formed on the mask onto the substrate. 12. A measurement method, of using a measurement system to measure a plurality of X marks and a plurality of Y marks as measurement objects formed on a prescribed substrate, comprising: a first process of setting a measurement condition for the measurement system to a first condition when measuring, with the measurement system, all of the Y marks among the marks which are the measurement objects on the prescribed substrate without measuring the X marks under the first condition, the X marks including all marks for measuring positions in a first direction in a two-dimensional plane on the substrate, the Y marks including all marks for measuring positions in a second direction orthogonal to the first direction in the two-dimensional plane on the substrate;a second process, after measuring all of the Y marks on the prescribed substrate under the first condition, of switching the measurement condition from the first condition and setting a second condition; anda third process of measuring, with the measurement system, all of the X marks without measuring the Y marks, under the second condition. 13. The measurement method according to claim 12, wherein the X marks are marks formed on a first layer disposed on the substrate, and the Y marks are marks formed on a second layer disposed on the substrate and different from the first layer. 14. An exposure method, of transferring a pattern formed on a mask to a substrate, comprising: a process of using the measurement method according to claim 12, to measure the positions of marks formed on the mask or on the substrate, and of positioning the mask or the substrate based on the measurement result. 15. A measurement apparatus that measures measurement objects on a body by means of the measurement method according to claim 12. 16. The measurement method according to claim 12, wherein: each of the X marks has line patterns that extend in a Y direction; each of the Y marks has line patterns that extend in an X direction, the X direction being orthogonal to the Y direction. 17. A method for measuring a plurality of X marks and a plurality of Y marks formed on a substrate by using a measurement system, the method comprising: setting a measurement condition for the measurement system to a first condition;measuring, with the measurement system, positions of all of the Y marks under the first condition without measuring the X marks, the X marks for measuring positions on the substrate in a first direction in a two-dimensional plane, the Y marks for measuring positions on the substrate in a second direction orthogonal to the first direction in the two-dimensional plane;switching the measurement condition from the first condition to a second condition after the measurement of all of the Y marks; andmeasuring, with the measurement system, positions of all of the X marks under the second condition without measuring the Y marks. 18. An exposure method for transferring a pattern formed on a mask to a substrate, comprising: measuring positions of marks formed on the mask or the substrate by using the method according to claim 17; andpositioning the mask or the substrate based on a result of the measurement. 19. A measurement apparatus that measures a measurement object on a body by using the method according to claim 17. 20. A measurement method comprising: measuring Y marks on a substrate with a measurement system under a first condition without measuring X marks on the substrate, the X marks each having line patterns that extend in a Y direction, the Y marks each having line patterns that extend in an X direction, the X direction being orthogonal to the Y direction;after measuring the Y marks on the substrate under the first condition, switching the measurement condition from the first condition to a second condition, the second condition being different from the first condition; andmeasuring the X marks on the substrate with the measurement system under the second condition without measuring the Y marks. 21. An exposure method comprising: measuring positions of marks formed on a mask or a substrate by using the measurement method according to claim 20;positioning the mask or the substrate based on the measurement result; andtransferring a pattern formed on the mask onto the substrate.
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