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Method and apparatus for particle removal 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-007/04
출원번호 US-0543365 (2006-10-04)
등록번호 US-8480810 (2013-07-09)
발명자 / 주소
  • Freer, Erik M.
  • de Larios, John M.
  • Mikhaylichenko, Katrina
  • Ravkin, Michael
  • Korolik, Mikhail
  • Redeker, Fritz C.
출원인 / 주소
  • Lam Research Corporation
대리인 / 주소
    Martine Penilla Group, LLP
인용정보 피인용 횟수 : 1  인용 특허 : 48

초록

A method and system for cleaning a surface, having particulate matter thereon, of a substrate features impinging upon the surface a jet of a liquid having coupling elements entrained therein. A sufficient drag force is imparted upon the coupling elements to have the same move with respect to the liq

대표청구항

1. A method for cleaning a surface, having particulate matter interspersed thereon, of a substrate, said method comprising: impinging a liquid having coupling elements and immiscible gas components entrained therein upon said surface, said impinging being configured to scan the liquid over and acros

이 특허에 인용된 특허 (48)

  1. Kottman Rickie A. (Dallas TX) Terrill Robert E. (Carrollton TX) Wise Ann E. (Dallas TX), Apparatus and method for edge cleaning.
  2. Bergman Eric J. ; Hess Mignon P., Apparatus and method for processing the surface of a workpiece with ozone.
  3. Hethcoat Gary L. (Ontario CA), Apparatus for cleaning and/or fluxing circuit card assemblies.
  4. McDermott Wayne T. (Allentown PA) Wu Jin J. (Ossining NY) Ockovic Richard C. (Northampton PA), Apparatus to clean solid surfaces using a cryogenic aerosol.
  5. Chung-Yi Lin TW, Automatic wall cleansing apparatus.
  6. Gockel Thomas R. ; Olson Lorin ; Ryle Lynn ; Whitelaw Brett A. ; Ravkin Michael, Brush box containment apparatus.
  7. Talieh Homayoun, Chemical mechanical polishing with a small polishing pad.
  8. Shumin Wang, Cleaning solution for semiconductor surfaces following chemical-mechanical polishing.
  9. Herrick Bradford James ; Baxter Mark D., Compressed air foam generator.
  10. Miyashita Naoto,JPX ; Abe Masahiro,JPX, Double side cleaning apparatus for semiconductor substrate.
  11. Matsukawa Hiroyuki,JPX ; Yonemizu Akira,JPX ; Matsushita Michiaki,JPX ; Fujimoto Akihiro,JPX ; Takekuma Takashi,JPX ; Yaegashi Hidetami,JPX ; Fukuda Takahide,JPX, Double-sided substrate cleaning apparatus and cleaning method using the same.
  12. Shuzo Sato JP; Takuo Ihira JP, Flattening polishing device and flattening polishing method.
  13. Gray Paul T. ; Masters David R., Foam producing apparatus and method.
  14. Bunkofske Raymond James, Method and apparatus for coating a semiconductor wafer.
  15. Mertens, Paul; Meuris, Marc; Heyns, Marc, Method and apparatus for localized liquid treatment of the surface of a substrate.
  16. Paul Mertens BE; Marc Meuris BE; Marc Heyns BE, Method and apparatus for localized liquid treatment of the surface of a substrate.
  17. Ravkin Michael, Method and apparatus for processing a wafer.
  18. Paul Mertens BE; Mark Meuris BE; Marc Heyns BE, Method and apparatus for removing a liquid from a surface of a rotating substrate.
  19. Starov Vladimir ; Basha Syed S. ; Shrinivasan Krishnan ; Reinhardt Karen A. ; Kabansky Aleksandr, Method and apparatus for removing post-etch residues and other adherent matrices.
  20. Lee, Keum Joo; Ko, Yong Sun; Hwang, In Seak, Method for cleaning damaged layers and polymer residue from semiconductor device.
  21. Mathuni Josef,DEX, Method for etching damaged zones on an edge of a semiconductor substrate, and etching system.
  22. Leenaars Adriaan F. M. (Eindhoven NLX) Huethorst Johanna A. M. (Eindhoven NLX) Marra Johannes (Eindhoven NLX), Method for removing in a centrifuge a liquid from a surface of a substrate.
  23. Williford ; Jr. John F. (7155 NE. 126th St. Kirkland WA 98034), Method for removing particulate matter.
  24. Yamasaka Miyako,JPX, Method for washing and drying substrates.
  25. Inoue Jun (Higashi-Osaka JPX), Method of automatically washing vehicles and apparatus for the same.
  26. de Larios, John Martin; Ravkin, Mike; Travis, Glen; Keller, Jim; Krusell, Wilbur, Methods for wafer proximity cleaning and drying.
  27. Moore, Scott E.; Doan, Trung Tri, Methods of treating surfaces of substrates.
  28. Britten Jerald A. (Oakley CA), Moving zone Marangoni drying of wet objects using naturally evaporated solvent vapor.
  29. Takahashi Kazuo,JPX, Polishing machine.
  30. Matthews Robert R. (Richmond CA), Process and apparatus for the treatment of semiconductor wafers in a fluid.
  31. Krusell, Wilbur; de Larios, John M.; Ravkin, Mike, Single wafer residue, thin film removal and clean.
  32. Burris William Alan, Sparger.
  33. Voegeli Douglas W. (Shoreview MN), Sparger.
  34. Matsuno, Kousaku; Iga, Masao; Ueda, Takeji; Kanayasu, Jun; Shikami, Satoshi, Substrate cleaning apparatus.
  35. Dickinson, C. John; Jansen, Frank; Murphy, Daimhin P., Substrate processing apparatus and related systems and methods.
  36. David T. Frost ; Oliver David Jones ; Mike Wallis, Substrate processing in an immersion, scrub and dry system.
  37. Sasaki Tadashi,JPX ; Ohtani Masami,JPX, Substrate spin cleaning apparatus.
  38. Fumio Morita JP; Masataka Fujiki JP; Hitoshi Oka JP; Noriyuki Oroku JP; Yuichirou Tanaka JP, Substrate treating apparatus.
  39. McDermott Wayne T. (Allentown PA) Ockovic Richard C. (Allentown PA) Wu Jin J. (Ossining NY) Cooper Douglas W. (Millwood NY) Schwarz Alexander (Allentown PA) Wolfe Henry L. (Pleasant Valley NY), Surface cleaning using a cryogenic aerosol.
  40. Kittle Paul A., Surface treatment of semiconductor substrates.
  41. Kittle Paul A., Surface treatment of semiconductor substrates.
  42. Kittle, Paul A., Surface treatment of semiconductor substrates.
  43. Paul A. Kittle, Surface treatment of semiconductor substrates.
  44. Lyons Paul Wallace ; Acampora Alfonse Anthony, Transport processor interface and video recorder/playback apparatus in a field structured datastream suitable for conveying television information.
  45. Borden Michael R. ; Kosic Thomas J. ; Bowers Charles W., Wafer cleaning using a laser and carbon dioxide snow.
  46. Yin Xiaoming ; Ning Xian J., Wafer surface cleaning apparatus and method.
  47. Abe,Yumiko; Ishikawa,Norio; Aoki,Hidemitsu; Tomimori,Hiroaki; Kasama,Yoshiko, Washing liquid composition for semiconductor substrate.
  48. Fuentes,Ricardo I., Wet processing using a fluid meniscus, apparatus and method.

이 특허를 인용한 특허 (1)

  1. Rosko, Michael Scot; Jonte, Patrick B.; DeVries, Adam M.; Thomas, Kurt J.; Sawaski, Joel D., Ozone distribution in a faucet.
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