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Interlocked jets cooling method and apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28C-001/00
출원번호 US-0859168 (2010-08-18)
등록번호 US-8490419 (2013-07-23)
발명자 / 주소
  • Zrodnikov, Volodymyr
  • Spokoyny, Mikhail
출원인 / 주소
  • United States Thermoelectric Consortium
대리인 / 주소
    The Webostad Firm, A Professional Corp.
인용정보 피인용 횟수 : 9  인용 특허 : 59

초록

Dissipating heat and apparatus therefor from a heat dissipation surface is described. In an embodiment, first jets are streamed along the heat dissipation surface in a first direction and are spaced apart from one another. Second jets are streamed along the heat dissipation surface in a second direc

대표청구항

1. A method for dissipating heat from a heat dissipation surface, comprising: providing a first plurality of jets streaming along the heat dissipation surface in a first direction and spaced apart from one another;providing a second plurality of jets streaming along the heat dissipation surface in a

이 특허에 인용된 특허 (59)

  1. Ballard Gerald W. (West Dundee IL) Turocy James W. (Arlington Heights IL) Beise Thomas R. (Hoffman Estates IL), Apparatus and method for spray-cooling an electronic module.
  2. Daikoku Takahiro (Ushiku JPX) Inouye Hiroshi (Ibaraki JPX), Apparatus for cooling heat generating members.
  3. Elliott Herbert J. (63 Poulton Estate Bradford-on-Avon GB2), Apparatus for solidifying molten material.
  4. McDunn Kevin J. ; Limper-Brenner Linda ; Press Minoo D., Apparatus for spray-cooling multiple electronic modules.
  5. Kamath, Vinod; Loebach, Beth Frayne; Matteson, Jason Aaron; Mansuria, Mohanlal S., Apparatus having forced fluid cooling and pin-fin heat sink.
  6. Ghosh, Kunal; Czajkowski, Michael; Leitch, Frank Joseph; Fuller, Christopher Alfred; Anders, Lorraine, Brazing method for workpiece having relatively higher mass portion.
  7. Rockenfeller Uwe (Boulder City NV), Chemical energy storage system.
  8. Novotny Shlomo D. (Wayland MA), Closed-cycle expansion-valve impingement cooling system.
  9. Foster, Sr.,Jimmy Grant; June,Michael Sean; Makley,Albert Vincent; Matteson,Jason Aaron, Coaxial air ducts and fans for cooling and electronic component.
  10. Ahn Tae-Bong,KRX, Cooling apparatus for electronic systems and computer systems with such apparatus.
  11. Ikeda Hironobu (Tokyo JPX), Cooling structure for integrated circuit.
  12. Chu, Richard C.; Ellsworth, Jr., Micheal J.; Simons, Robert E., Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader.
  13. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack.
  14. Jacoby John H. (Jackson Pond Rd. New Hampton NH 03256), Dimpled heat transfer surface and method of making same.
  15. Cader,Tahir; Knight,Paul A., Dual sided board thermal management system.
  16. Tilton Charles L. ; Smetana Bruce A, EMI shielding fluid control apparatus.
  17. Carter, Daniel P.; Crocker, Michael T.; Broili, Ben M.; Byquist, Tod A.; Llapitan, David J., Electronic assemblies with high capacity curved fin heat sinks.
  18. Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Electronic module with integral refrigerant evaporator assembly and control system therefore.
  19. Chao-Fan Chu Richard (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Goth Gary F. (Pleasant Valley NY) Simons Robert E. (Poughkeepsie NY) Zumbrunnen Michael L. (Poughkeepsie NY), Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels.
  20. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Fin heat sink and airflow tube assembly employing annular airflows, and methods of fabrication thereof.
  21. Kinsell Robert C. (Los Angeles CA) Saba Michael P. (Huntington Beach CA) Strang James E. (Fountain Valley CA), Fluid conditioning apparatus and system.
  22. Cannell, Michael J.; Cooley, Roger; Garman, Richard W.; Green, Geoffrey; Harrison, Peter N.; Walters, Joseph D., Fluid-cooled heat sink with turbulence-enhancing support pins.
  23. Gregory T. Wyler ; Peter B. Favini ; Blaine C. Wotring ; Bibek Chapagain, Folded fin heat sink and fan attachment.
  24. Cray Seymour R. (Colorado Springs CO) Sherwood Gregory J. (Colorado Springs CO), Gas-liquid forced turbulence cooling.
  25. Gabriel Rouchon, Heat dissipating device.
  26. Gedamu, Elias; Man, Denise, Heat dissipation apparatus and method.
  27. William B. Rife, Heat dissipation device with threaded fan module.
  28. Feenstra Sean D., Heat sink utilizing the chimney effect.
  29. Modahl Robert J. (Galesville WI) Luckeroth Virgil C. (La Crosse WI), Heat transfer surface for efficient boiling of liquid R-11 and its equivalents.
  30. Tilton Donald E. (Kent WA) Tilton Charles L. (Kent WA), High heat flux evaporative spray cooling.
  31. Clark William E. (401 Hyder St. ; N.E. Palm Bay FL 32907), Liquid-cooled, flat plate heat exchanger.
  32. Anderson Timothy M. (Poughkeepsie NY) Chrysler Gregory M. (Poughkeepsie NY) Chu Richard C. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY), Local condensation control for liquid impingement two-phase cooling.
  33. Shooshtarian,Sohaila; Acharya,Narasimha; Elbert,Mike; Tillmann,Andreas; Zernickel,Dieter, Localized heating and cooling of substrates.
  34. Cader, Tahir; Ressa, Robert J., Low momentum loss fluid manifold system.
  35. Boucher Armand R. ; Hambrick Philip N., Low temperature vacuum distillation and concentration process.
  36. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,Dave; McMaster,Mark; Lovette,James, Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device.
  37. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,David, Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device.
  38. Selim Mehmet Senkan, Method and apparatus for screening catalyst libraries.
  39. Kostiainen, Risto; Kauppila, Tiina; Haapala, Markus; Pol, Jaroslav; Kotiaho, Tapio, Method and system for desorbing and ionizing chemical compounds from surfaces.
  40. Gregory S. Cole ; Robert P. Scaringe, Method and two-phase spray cooling apparatus.
  41. Root Loren F. ; McDunn Kevin J., Method for spray-cooling a tunable semiconductor device.
  42. Chrysler Gregory Martin ; Chu Richard Chao-Fan, Method of making an ultra high-density, high-performance heat sink.
  43. Korpman Ralf (Bridgewater NJ), Molten adhesive fibers and products made therefrom.
  44. Ku, Shih-Chang, Multi-opening heat-dissipation device for high-power electronic components.
  45. Ward Terence G. ; Downer Scott D., Pin fin heat sink and pin fin arrangement therein.
  46. Saia ; III Louis P. (Houma LA) Wilbrandt Cynthia S. (Houma LA), Portable self-contained cooler/freezer apparatus for use on airplanes, common carrier type unrefrigerated truck lines, a.
  47. Bartilucci Anthony R. (Wantagh NY), Portable self-contained cooler/freezer apparatus with nitrogen environment container.
  48. Limper-Brenner Linda ; Schmidt Detlef W. ; McDunn Kevin J. ; Press Minoo D., Process for mounting an electronic component to a substrate and process for spray-cooling the electronic component mount.
  49. Rhoad John H. (P.O. Box 108 Lapush WA 98350), Refrigerated storage and transportation container for perishable commodities.
  50. Tantoush, Mohammad A., Scalable and modular heat sink-heat pipe cooling system.
  51. Kieda Shigekazu (Ishioka JPX) Nakajima Tadakatsu (Ibaraki JPX) Kuwahara Heikichi (Ibaraki JPX) Sato Motohiro (Ibaraki JPX), Semiconductor cooling device.
  52. Yamada Takeo (Boston MA) Isomura Satoru (Ohme JPX) Shimizu Atsushi (Ohme JPX) Ito Yuko (Hamura JPX) Kobayashi Tohru (Iruma JPX) Kawaji Mikinori (Hino JPX), Semiconductor device and semiconductor module having auxiliary high power supplying terminals.
  53. Tilton, Charles L.; Smetana, Bruce A.; Weir, Tom D., Spray cool means for cooling a modular inverter electric motor system.
  54. Tilton,Donald E.; Tilton,Charles L.; Weiler,Jeffery K., Spray cooling system for transverse thin-film evaporative spray cooling.
  55. Chandrakant D. Patel ; Cullen E. Bash, Spray cooling with local control of nozzles.
  56. Tilton, Charles L.; Tilton, Donald E., Thermal management system for evaporative spray cooling.
  57. Kerner James M. (779 Hillgrove Chico CA 95926), Thermoelectric closed-loop heat exchange system.
  58. Felix Vinci Martinez ; Mohan Pidatala Krishna ; McHale William Francis, Wear resistant non-stick resin coated substrates.
  59. Minato Ken,JPX ; Hamamoto Yasuo,JPX ; Tomino Shinichiro,JPX ; Hosojima Takuro,JPX ; Ishibashi Hiroo,JPX, Widthwise uniform cooling system for steel strip in continuous steel strip heat treatment step.

이 특허를 인용한 특허 (9)

  1. Shedd, Timothy A.; Lindeman, Brett A., Flexible two-phase cooling system.
  2. Shedd, Timothy A.; Meives, Mark S., Fluid distribution unit for two-phase cooling system.
  3. Shedd, Timothy A.; Lindeman, Brett A., Heat sink module.
  4. Lee, Gyoo Taek; Park, Jung Hun, Method and apparatus for controlling the strip temperature of the rapid cooling section of a continuous annealing line.
  5. Shedd, Timothy A., Method of absorbing sensible and latent heat with series-connected heat sinks.
  6. Shedd, Timothy A.; Lindeman, Brett A., Method of cooling series-connected heat sink modules.
  7. Shedd, Timothy A., Method of operating a cooling apparatus to provide stable two-phase flow.
  8. Shedd, Timothy A.; Lindeman, Brett A.; Buchanan, Robert A., Microprocessor assembly adapted for fluid cooling.
  9. Shedd, Timothy A.; Lindeman, Brett A., Redundant heat sink module.
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