초록 ▼

A cathodically-protected pad conditioner for chemical mechanical planarization includes: an abrasive member including a metallic substrate, a support carrier, and an anode affixed to the peripheral edge of the support carrier. A cathodic protection circuit is configured to provide a cathodic protect

A cathodically-protected pad conditioner for chemical mechanical planarization includes: an abrasive member including a metallic substrate, a support carrier, and an anode affixed to the peripheral edge of the support carrier. A cathodic protection circuit is configured to provide a cathodic protection current from the anode to the abrasive member if contacted with an electrolyte solution. A method of using the cathodically-protected pad conditioner is also disclosed.

대표청구항 ▼

1. A cathodically-protected pad conditioner for chemical mechanical planarization comprising: an abrasive member comprising a metallic substrate having an abrasive surface and a back surface opposite the abrasive surface, wherein the abrasive surface comprises abrasive particles affixed to the metal

1. A cathodically-protected pad conditioner for chemical mechanical planarization comprising: an abrasive member comprising a metallic substrate having an abrasive surface and a back surface opposite the abrasive surface, wherein the abrasive surface comprises abrasive particles affixed to the metallic substrate;a support carrier having a receiving surface and a peripheral edge adjacent the receiving surface, wherein the receiving surface is affixed and adjacent to the back surface of the abrasive member;an anode affixed to the peripheral edge; anda cathodic protection circuit configured to provide a cathodic protection current from the anode to the metallic substrate if contacted with an electrolyte solution that bridges the metallic substrate and the anode. 2. The cathodically-protected pad conditioner of claim 1, wherein the cathodic protection circuit comprises an electric cell having a positive terminal and a negative terminal, wherein the positive terminal is electrically coupled to the anode, and wherein the negative terminal is electrically coupled to the metallic substrate. 3. The cathodically-protected pad conditioner of claim 2, wherein the electric cell is at least partially disposed within a cavity in the support carrier. 4. The cathodically-protected pad conditioner of claim 2, wherein the negative terminal is at least partially affixed to the metallic substrate by conductive adhesive. 5. The cathodically-protected pad conditioner of claim 1, wherein the peripheral edge has a beveled portion adjacent the abrasive member, and wherein the anode is disposed on the beveled portion. 6. A method of conditioning a pad, the method comprising using the cathodically-protected pad conditioner of any one of claims 1 to 5 to condition the pad during chemical mechanical planarization of a semiconductor wafer. 7. The method of claim 6, wherein the cathodically-protected pad conditioner contacts and conditions the pad during chemical mechanical planarization of a semiconductor wafer.