초록 ▼

A plating protocol is employed to control plating of metal onto a wafer comprising a conductive seed layer. Initially, the protocol employs cathodic protection as the wafer is immersed in the plating solution. In certain embodiments, the current density of the wafer is constant during immersion. In

A plating protocol is employed to control plating of metal onto a wafer comprising a conductive seed layer. Initially, the protocol employs cathodic protection as the wafer is immersed in the plating solution. In certain embodiments, the current density of the wafer is constant during immersion. In a specific example, potentiostatic control is employed to produce a current density in the range of about 1.5 to 20 mA/cm2. The immersion step is followed by a high current pulse step. During bottom up fill inside the features of the wafer, a constant current or a current with a micropulse may be used. This protocol may protect the seed from corrosion while enhancing nucleation during the initial stages of plating.

대표청구항 ▼

1. A method of controlling plating of copper interconnects on a semiconductor wafer, the method comprising: (a) immersing a plating surface of the wafer in plating bath comprising a copper salt and a suppressor while applying a cathodic current to the wafer in the range of about 1.5 to 20 mA/cm2 dur

1. A method of controlling plating of copper interconnects on a semiconductor wafer, the method comprising: (a) immersing a plating surface of the wafer in plating bath comprising a copper salt and a suppressor while applying a cathodic current to the wafer in the range of about 1.5 to 20 mA/cm2 during substantially the entire immersion of the plating surface;(b) within less than about 1000 ms of completing the immersion in (a), applying a high cathodic current pulse to the wafer, the pulse having a magnitude that is greater than any of the current densities applied in (a) and that is at least about 20 mA/cm2 for a duration of about 20 to 1000 ms; and(c) within less than about 1000 ms of completing the current pulse in (b), conducting bottom up copper fill using lower current densities than the current densities of the high cathodic current pulse with a baseline current density of about 1 to 20 mA/cm2 and a plurality of micropulses having a magnitude of about 10 to 40 mA/cm2 above the baseline current density, the micropulses having a duration of about 1 to 495 ms, a time interval between micropulses being about 50 to 500 ms, wherein the magnitude of each micropulse, the duration of each micropulse, or the time interval between any two micropulses is random, and wherein the suppressor is distributed across the face of the wafer at different concentrations prior to (c). 2. The method of claim 1, wherein the magnitude of each micropulse is random. 3. The method of claim 1, wherein the duration of each micropulse is random. 4. The method of claim 1, wherein the time interval between any two micropulses is random. 5. The method of claim 1, wherein the magnitude of each micropulse, the duration of each micropulse and the time interval between any two micropulses are random. 6. The method of claim 1, wherein a concentration of copper ions is about 20 to 60 g/L and a concentration of the suppressor is about 50 to 500 ppm. 7. The method of claim 1, wherein the plating bath further comprises an accelerator and a leveler. 8. The method of claim 1, wherein the plating bath further comprises an acid and chloride ions. 9. The method of claim 1, wherein the wafer has at least some features with widths of about 40 nm or smaller. 10. The method of claim 1, wherein the cathodic current pulse in (b) is applied within about 20 ms of completing the immersion in (a). 11. The method of claim 1, wherein bottom up copper fill is conducted within about 20 ms of completing the current pulse in (b). 12. The method of claim 1, wherein the cathodic current applied in (a) is applied by potentiostatic control of the wafer potential. 13. The method of claim 1, further comprising: (d) conducting a bulk electrofill after completing the bottom up copper fill in (c). 14. The method of claim 1, wherein the micropulses change a concentration profile of the suppressor across the plating surface of the wafer.