Imide-linked maleimide and polymaleimide compounds
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IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C08G-069/08
C08G-073/10
C08G-073/14
출원번호
US-0021700
(2011-02-04)
등록번호
US-8513375
(2013-08-20)
발명자
/ 주소
Mizori, Farhad G
Dershem, Stephen M
출원인 / 주소
Designer Molecules, Inc.
대리인 / 주소
The Law Office of Jane K. Babin, Professional Corporation
인용정보
피인용 횟수 :
3인용 특허 :
83
초록▼
The invention is directed to maleimide thermosets incorporating imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended maleimide compounds are prepared by the condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds. These compounds ar
The invention is directed to maleimide thermosets incorporating imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended maleimide compounds are prepared by the condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds. These compounds are then condensed with excess maleic anhydride to yield imide-extended maleimide compounds.
대표청구항▼
1. A compound having the structure: wherein:each of R and Q is independently selected from the group consisting of a substituted or an unsubstituted aliphatic, aromatic, heteroaromatic, siloxane, unsaturated hydrocarbon, polyester, polyamide and polyurethane moieties;X is a polymerizable or a curati
1. A compound having the structure: wherein:each of R and Q is independently selected from the group consisting of a substituted or an unsubstituted aliphatic, aromatic, heteroaromatic, siloxane, unsaturated hydrocarbon, polyester, polyamide and polyurethane moieties;X is a polymerizable or a curative moiety; andn is an integer having the value between 1 and about 10. 2. The compound of claim 1, wherein the polymerizable moiety is selected from the group consisting of a cationic polymerizable moiety, an anionic polymerizable moiety, a ring-opening polymerizable moiety and a free radical polymerizable moiety. 3. The compound of claim 1, wherein the curative is selected from the group consisting of phenol, a phenyl ester, an anhydride, a thiol, an amino, a carboxyl, an alcohol moieties and any combination thereof. 4. The compound of claim 1, wherein the polymerizable moiety selected from the group consisting of is vinyl ether, vinyl ester, an acrylate, a methacrylate, an epoxy, an oxetane, an oxazoline, a benzoxazine, vinyl chloride, an urethane, norbornyl, maleimide, phenol, a phenyl ester, styrenic, a propargyl ether, a cyanate ester, nadimide and combinations thereof. 5. The polymer of claim 1, wherein each of R and Q is independently selected from the group consisting of: (a) a substituted or an unsubstituted linear, branched, cyclic aliphatic and alkenyl moieties having between 2 and about 500 carbon atoms; and(b) a substituted or an unsubstituted aromatic or heteroaromatic moieties having between 6 and about 20 carbon atoms. 6. The compound of claim 1, wherein the compound is an imide-extended bismaleimide having the structure: wherein:each of R and Q is independently selected from the group consisting of a substituted or an unsubstituted aliphatic, alkenyl, aromatic, heteroaromatic and siloxane moieties; andR2 is selected from the group consisting of H and methyl,with the further proviso that the imide-extended bismaleimide is not 7. The compound of claim 6, wherein each of R and Q is independently selected from the group consisting of: (a) substituted or unsubstituted linear, branched, cyclic aliphatic and alkenyl moieties having between 2 and about 500 carbon atoms;(b) substituted or unsubstituted aromatic or heteroaromatic moieties having between 6 and about 20 carbon atoms; and(c) substituted or unsubstituted siloxane moieties having between 2 and about 1000 silicon atoms. 8. The compound of claim 7, wherein each of R and Q is independently selected from the group consisting of substituted or unsubstituted siloxane moieties, wherein the siloxane moieties are polysiloxanes comprising repeating units selected from the group consisting of dimethylsiloxane, methylphenylsiloxane, diphenylsiloxane, methylhydrosiloxane, and combinations thereof. 9. The compound of claim 7, wherein the substituted aliphatic, alkenyl, aromatic, heteroaromaticor siloxane moieties comprise substituents selected from the group consisting of an alkyl, an alkenyl, an alkynyl, hydroxy, oxo, an alkoxy, mercapto, a cycloalkyl, a substituted cycloalkyl, a heterocyclic, a substituted heterocyclic, an aryl, a substituted aryl, a heteroaryl, a substituted heteroaryl, an aryloxy, a substituted aryloxy, a halogen, a haloalkyl, cyano, nitro, nitrone, an amino, an amido, —C(O)H, —C(O)—O—, —C(O)—, —S—, —S(O)2—, —OC(O)—O—, —NR—C(O)—, —NR—C(O)—NR—, —OC(O)—NR—, wherein R is selected from the group consisting of H, a lower alkyl, an acyl, an oxyacyl, carboxyl, carbamate, sulfonyl, sulfonamide and sulfuryl. 10. An adhesive composition comprising: (a) between 0.1 wt % and about 5 wt % of at least one curing initiator based on total weight of the composition, the curing initiator comprising a free-radical initiator or a photoinitiator; and(b) at least one imide-extended bismaleimide of claim 6.
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이 특허에 인용된 특허 (83)
Dershem Stephen M. (San Diego CA) Osuna ; Jr. Jose A. (San Diego CA), Adhesive bonding composition with bond line limiting spacer system.
Dershem Stephen M. (San Diego CA) Derfelt Deborah L. (San Diego CA) Patterson Dennis B. (La Jolla CA), Die-attach composition comprising polycyanate ester monomer.
Beggs James M. (Washington DC) Mikroyannidis John A. (Patras CA GBX) Kourtides Demetrius A. (Gilroy CA), Fire and heat resistant laminating resin based on maleimido and citraconimido substituted 1-[diorganooxyphosphonyl)-meth.
Mikroyannidis John A. (Patras CA GBX) Kourtides Demetrius A. (Gilroy CA), Fire and heat resistant laminating resins based on maleimido and citraconimido substituted 1-(diorganooxyphosphonyl)-met.
You Kyung-hee,KRX ; Han Kwan-soo,KRX ; Rhee Tae-hyung,KRX, Polyimide for optical communications, method of preparing the same, and method of forming multiple polyimide film using the polyimide.
Goto Hirofumi,JPX ; Yamada Takako,JPX ; Ito Nobuyuki,JPX, Polyimide-based composite, electronic parts using the composite, and polyimide-based aqueous dispersion.
Mueller Werner H. (E. Greenwich RI) Khanna Dinesh N. (W. Warwick RI) Vora Rohitkumar H. (W. Warwick RI) Erckel Ruediger J. (Warren NJ), Polymers prepared from 4,4′-bis(2-(amino(halo) phenoxyphenyl) hexafluoroisopropyl) diphenyl ether.
Mueller Werner H. (E. Greenwich RI) Khanna Dinesh N. (W. Warwick RI) Vora Rohitkumar H. (W. Warwick RI) Erckel Ruediger J. (Warren NJ), Polymers prepared from 4,4′-bis[2-(3,4-(dicarboxyphenyl)hexafluoroisopropyl]diphenyl ether dianhydride.
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