초록 ▼

A sensor unit with at least one magnetic field sensor element, at least one application specific integrated circuit (ASIC) and at least one magnet are arranged in a capsule housing on at least one leadframe. The capsule housing is surrounded by a sensor encapsulation and is intended to have smaller

A sensor unit with at least one magnetic field sensor element, at least one application specific integrated circuit (ASIC) and at least one magnet are arranged in a capsule housing on at least one leadframe. The capsule housing is surrounded by a sensor encapsulation and is intended to have smaller dimensions so as to allow it to be positioned in the encapsulating mold with less effort and at the same time in the exact position. For this purpose, it is provided that the capsule housing has a number of fixing aids adapted in their outer dimensions to an injection mold assigned to the sensor encapsulation.

대표청구항 ▼

1. A sensor unit comprising at least one magnetic field sensor element,at least one application specific integrated circuit andat least one magnet on at least one leadframe,wherein the at least one magnetic field sensor element, the at least one application specific integrated circuit and the at lea

1. A sensor unit comprising at least one magnetic field sensor element,at least one application specific integrated circuit andat least one magnet on at least one leadframe,wherein the at least one magnetic field sensor element, the at least one application specific integrated circuit and the at least one magnet are arranged in a capsule housing surrounded by a sensor encapsulation, and wherein the capsule housing has a number of fixing aids adapted in their outer dimensions to an injection mold assigned to the sensor encapsulation, at least one of the fixing aids retains its original form in the sensor encapsulation and is completely surrounded by the sensor encapsulation, andwherein the fixing aids are configured to ensure exact positioning of the sensor element by supporting themselves in the mold of the sensor encapsulation. 2. The sensor unit as claimed in claim 1, wherein the fixing aids thereof are formed on the capsule housing. 3. The sensor unit as claimed in claim 1, wherein the fixing aids thereof are placed against the capsule housing in the manner of pairs of shells. 4. The sensor unit as claimed in claim 1, wherein the fixing aids thereof are adhesively attached to the capsule housing in the manner of pairs of shells. 5. The sensor unit as claimed in claim 1, wherein a number of fixing aids not connected to the capsule housing or arranged on the latter are arranged on at least one leadframe leading into the capsule housing. 6. The sensor unit as claimed in claim 5, wherein coating of a number of fixing aids is provided. 7. The sensor unit as claimed in claim 6, wherein the same material as for the sensor encapsulation is provided as the material for the coating of the fixing aids. 8. The sensor unit as claimed in claim 1, wherein the fixing aids thereof are elastically configured. 9. The sensor unit as claimed in claim 1, wherein a compression and/or tension relief is arranged on a leadframe leading into the capsule housing. 10. The sensor unit as claimed in claim 9, wherein the tension and compression relief thereof is arranged in the direction of the X axis. 11. The sensor unit as claimed in claim 1, wherein a compression and/or tension relief is arranged on one or more of the fixing aids. 12. The sensor unit as claimed in claim 1, wherein coating of the capsule housing is provided. 13. The sensor unit as claimed in claim 12, wherein the same material used for the sensor encapsulation is provided as the material for the coating of the capsule housing. 14. The sensor unit as claimed in claim 1, wherein an outer end of at least one of the fixing aids is spaced apart from a delimitation of the encapsulation.