초록 ▼

Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an enclosure for providing an inerting gas into an atmosphere above a solder reservoir during soldering of a work piece comprising: a tube i

Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an enclosure for providing an inerting gas into an atmosphere above a solder reservoir during soldering of a work piece comprising: a tube in fluid communication with an inerting gas source wherein the tube comprises one or more openings for the flow of the inerting gas therethrough, a base wherein the tube resides in therein and comprises an interior volume, a neck comprising an opening and an interior volume in fluid communication with the interior volume of the base, and a cap proximal to the opening wherein the inerting gas source travels through the tube into the interior volume and into the atmosphere through the opening defined by the neck and cap.

대표청구항 ▼

1. A method for providing an inerting gas atmosphere during wave soldering of a work piece, the method comprising: providing a wave soldering machine comprising: a solder reservoir having molten solder contained therein, at least one nozzle, and at least one pump to generate at least one solder wave

1. A method for providing an inerting gas atmosphere during wave soldering of a work piece, the method comprising: providing a wave soldering machine comprising: a solder reservoir having molten solder contained therein, at least one nozzle, and at least one pump to generate at least one solder wave from the molten solder bath upwardly through the nozzle;placing an apparatus atop at least one edge of the solder reservoir wherein the apparatus comprises at least one opening on a top surface, at least one groove that rests atop the at least one edge of the solder reservoir, and at least one tube comprising one or more openings in fluid communication with an inerting gas source, wherein the work piece and the top surface of the molten solder define an area that contains an atmosphere;passing the work piece along a path so that at least a portion of the work piece contacts the at least one solder wave emitting through the opening of the apparatus; andintroducing an inerting gas through the at least one tube into the atmosphere, wherein the at least one tube resides in an enclosure;wherein the enclosure comprises a base comprising an interior volume in fluid communication with an inerting gas source, a neck comprising an interior volume and an neck opening in fluid communication with the base, and a cap proximal to the neck opening, wherein the at least one tube residing in the enclosure is housed within the base;wherein the inerting gas travels through the at least one tube into the interior volume of the base, through the neck and is directed into the atmosphere by the cap;wherein the neck has a top surface;wherein the cap has a bottom surface; andwherein the bottom surface is facing the top surface and the bottom surface has a larger surface area than the top surface. 2. The method of claim 1 wherein at least a portion of the enclosure, the neck, the cap, or a combination thereof comprise a non-stick coating or material. 3. The method of claim 1 wherein the at least one tube resides proximal to the at least one solder wave. 4. The method of claim 1 further comprising a cover that transports the work piece across the apparatus, wherein the cover further comprises a vent which is in fluid communication with a ventilation system. 5. The method of claim 4 wherein the cover comprises a plurality of sheets that define an interior volume and wherein the interior volume is in fluid communication with the ventilation exhaust of a soldering furnace. 6. The method of claim 5 wherein the cover further comprises an inlet in fluid communication with an inerting gas source. 7. The method of claim 1 wherein the one or more tubes comprise pores and wherein the average pore size is 0.2 μm or less. 8. The method of claim 1 wherein the apparatus comprises one or more grooves wherein the grooves help to define one or more chambers in which one or more of the tubes reside. 9. The method of claim 1 wherein the solder reservoir generates a plurality of solder waves and wherein the at least one tube residing in the enclosure is interposed between the solder waves. 10. The method of claim 1 wherein the inerting gas comprises nitrogen. 11. The method of claim 10 wherein the inerting gas further comprises 5% by weight or less of hydrogen. 12. The method of claim 1 wherein the inerting gas comprises a gas selected from the group consisting of nitrogen, hydrogen, helium, neon, argon, krypton, xenon, and combinations thereof. 13. The method of claim 1, wherein the neck further comprises one or more holes along its surface.