초록 ▼

An electrical apparatus according to the present disclosure comprises a molded device having a molded portion and being formed via an overmolding process. The electrical apparatus includes a wire set at least partially overmolded within the device, the wire set having an outer sheath surrounding a p

An electrical apparatus according to the present disclosure comprises a molded device having a molded portion and being formed via an overmolding process. The electrical apparatus includes a wire set at least partially overmolded within the device, the wire set having an outer sheath surrounding a plurality of wires. The molded portion surrounds a portion of the wire set. The electrical apparatus further includes polyurethane bonding material occurring between the outer sheath and the molded portion. The polyurethane bonding material bonds at least a portion of the wire set to the molded portion during the overmolding process.

대표청구항 ▼

1. An electrical apparatus, comprising: a wire set having an outer sheath composed of polyvinylchloride surrounding at least a portion of a plurality of wires; andan overmolded portion being formed via an overmolding process, wherein the overmolded portion surrounds at least a portion of the wire se

1. An electrical apparatus, comprising: a wire set having an outer sheath composed of polyvinylchloride surrounding at least a portion of a plurality of wires; andan overmolded portion being formed via an overmolding process, wherein the overmolded portion surrounds at least a portion of the wire set and is composed of polyvinylchloride;polyurethane bonding material disposed between the overmolded portion and the outer sheath, wherein the polyurethane bonding material is configured to bond at least a portion of the polyvinylchloride outer sheath to the polyvinylchloride overmolded portion. 2. The apparatus of claim 1, wherein the apparatus is a molded socket having a front surface and at least one hole extending from the front surface at least partially through the socket, wherein at least one of the plurality of wires extends into the at least one hole in the socket. 3. The apparatus of claim 1, wherein the outer sheath is substantially cylindrical in shape and has a circumference, and wherein the polyurethane bonding material is a piece of polyurethane film positioned around the circumference of the outer sheath along a substantially cylindrical portion of the outer sheath. 4. The apparatus of claim 1, wherein the overmolded portion has a front surface and an opposite back surface, with a portion of the wire set extending out from the back surface. 5. An electrical apparatus, comprising: a wire set having an outer sheath surrounding at least a portion of a plurality of wires; andan overmolded portion being formed via an overmolding process, wherein the overmolded portion surrounds at least a portion of the wire set;polyurethane bonding material contacting both the outer sheath and the overmolded portion, wherein the polyurethane bonding material is configured to bond at least a portion of the wire set to the overmolded portion. 6. The apparatus of claim 5, wherein the overmolded portion has a front surface and an opposite back surface, wherein the wire set extends out from the back surface, wherein the polyurethane bonding material is positioned in contact with the outer sheath of the wire set and the back surface of the overmolded portion to bond at least a portion of the wire set to the overmolded portion following the overmolding process. 7. The apparatus of claim 5, wherein the overmolded portion has a front surface and an opposite back surface, wherein the wire set extends out from the back surface, wherein the overmolded portion defines an adjoining edge where the back surface meets the outer sheath, and wherein the polyurethane bonding material covers at least a portion of the adjoining edge and is in contact with the outer sheath and the back surface to bond at least a portion of the wire set to the overmolded portion following the overmolding process. 8. The apparatus of claim 5, wherein the polyurethane bonding material is a piece of polyurethane film. 9. The apparatus of claim 5, wherein the outer sheath and the overmolded portion are composed of polyvinylchloride. 10. The apparatus of claim 5, wherein the apparatus is a molded socket. 11. An electrical apparatus, comprising: a wire set having an outer sheath surrounding at least a portion of a plurality of wires; andan overmolded portion being formed via an overmolding process and having an outer surface, wherein the overmolded portion surrounds at least a portion of the wire set;polyurethane bonding material applied to the outer surface of the overmolded portion following the overmolding process to patch an area of the overmolded portion. 12. The apparatus of claim 11, wherein the outer surface of the overmolded portion is substantially cylindrical in shape and the polyurethane bonding material is a piece of polyurethane film positioned around the circumference of the overmolded portion along a segment of the outer surface. 13. The apparatus of claim 11, wherein the outer sheath and the overmolded portion are composed of polyvinylchloride.