초록

A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.

대표청구항 ▼

1. In a computing device, a low Z profile consolidated thermal module (CTM) for securing and cooling an integrated circuit (IC) mounted to a printed circuit board (PCB), the CTM comprising: a heat removal assembly having a reduced footprint, the heat removal assembly disposed on a first surface of t

1. In a computing device, a low Z profile consolidated thermal module (CTM) for securing and cooling an integrated circuit (IC) mounted to a printed circuit board (PCB), the CTM comprising: a heat removal assembly having a reduced footprint, the heat removal assembly disposed on a first surface of the PCB and in thermal contact with the IC;a backer plate disposed on a second surface of the PCB;a retaining mechanism disposed on the backer plate; andat least one fastener used to secure the heat removal assembly to the backer plate and the retaining mechanism, wherein the retaining mechanism causes a substantially uniform retaining force to be applied across the backer plate thereby minimizing an amount of torque applied to the IC, wherein the heat removal assembly comprises: a thermally conductive casting,a heat pipe arranged to transport excess heat away from the IC, anda thermally conductive slug disposed between the heat pipe and the IC. 2. The CTM as recited in claim 1, further comprising: a socket attached to the first surface of the PCB, the socket providing receptors for capturing IC signal pins, the receptors arranged to electrically connect the captured IC signal pins to electrical traces in the PCB. 3. The CTM as recited in claim 2, wherein the uniform retaining force causes the captured signal pins to be uniformly disposed within the receptors. 4. The CTM as recited in claim 3, wherein the CTM has a reduced footprint, the reduced footprint conserving PCB real estate thereby providing greater flexibility in layout of the electrical traces in the PCB. 5. The CTM as recited in claim 1, wherein the retaining mechanism is a leaf spring. 6. The CTM as recited in claim 1 wherein the slug is made of copper. 7. The CTM as recited in claim 1, wherein the backer plate is made of steel. 8. The CTM as recited in claim 1, wherein the thermally conductive casting is made of aluminum. 9. The CTM as recited in claim 1, wherein the computing device is a desktop computer. 10. A method of installing a consolidated thermal module (CTM) in a small form factor computer to cool an integrated circuit (IC), comprising: receiving a plurality of CTM components including at least a backer plate, a retaining mechanism, and a heat removal assembly;receiving a printed circuit board (PCB) for a small form factor computer;placing the backer plate on a first side of the PCB;placing the retaining mechanism on the backer plate;placing the heat removal assembly on a second side of the PCB, in thermal contact with the IC; andsecuring the retaining mechanism to the heat removal assembly, wherein the heat removal assembly comprises: a thermally conductive casting,a heat pipe arranged to transport excess heat away from the IC, anda thermally conductive slug disposed between the heat pipe and the IC. 11. The method as recited in claim 10, wherein an integrated circuit to be cooled by the CTM is a Central Processing Unit (CPU). 12. The method as recited in claim 10, wherein an integrated circuit to be cooled by the CTM is a Graphics Processing Unit (GPU). 13. The method as recited in claim 10, wherein the retaining mechanism is a leaf spring. 14. The method as recited in claim 10, wherein the slug is made of copper. 15. The method as recited in claim 10, wherein the backer plate is made of steel. 16. The method as recited in claim 10, wherein the thermally conductive casting is made of aluminum.