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A biomedical polymer composite that exhibits ultra-low thermal conductivity properties. In a preferred embodiment, the biomedical polymer composite comprises a base polymer component with a dispersed thermally non-conductive filler component consisting of glass or ceramic nanospheres or microspheres

A biomedical polymer composite that exhibits ultra-low thermal conductivity properties. In a preferred embodiment, the biomedical polymer composite comprises a base polymer component with a dispersed thermally non-conductive filler component consisting of glass or ceramic nanospheres or microspheres that have a thermal conductivity of less than 5 W/m-K, and preferably less than 2 W/m-K. In one embodiment, the polymer composite has an electrically conductive filler and can be used in a filament for treating arteriovascular malformations. In another embodiment, the polymeric composite can be used as an energy-coupling means to apply energy to tissue.

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1. A method of thermally treating tissue, comprising: selecting a targeted portion of a tissue structure to be treated;forming a bipolar electrode layer upon the tissue structure adjacent the targeted portion, the bipolar electrode layer comprising first and second conductive layers separated by an

1. A method of thermally treating tissue, comprising: selecting a targeted portion of a tissue structure to be treated;forming a bipolar electrode layer upon the tissue structure adjacent the targeted portion, the bipolar electrode layer comprising first and second conductive layers separated by an insulative layer; andcausing current to flow from the first conductive layer to the second conductive layer, at least a portion of the current flowing around the nonconductive layer and through the targeted portion of the tissue structure,wherein the first and second conductive layers, and the insulative layer, comprise a flowable material. 2. The method of claim 1, wherein forming comprises extruding one or more of the first and second conductive layers, and the insulative layer. 3. The method of claim 2, wherein forming comprises coextruding the first and second conductive layers, and the insulative layer. 4. The method of claim 2, further comprising extruding the flowable material in an elongate formation. 5. The method of claim 3, wherein coextruding comprising substantially encapsulating the first and second conductive layers in the insulative layer. 6. The method of claim 2, wherein extruding comprises manually actuating an extrusion device configured to induce positive flow of the flowable material through the device. 7. The method of claim 1, wherein the insulative layer comprises a base polymer and a dispersed nonconductive filler. 8. The method of claim 7, wherein the dispersed nonconductive filler comprises hollow microspheres. 9. The method of claim 7, wherein the base polymer and dispersed nonconductive filler comprise bio-absorbable materials. 10. The method of claim 7, wherein the base polymer is selected from the group consisting of: polyamide, polycarbonate, polystyrene, polyacrylonitrile, polyacetal, thermoplastic modified cellulose, polysulfone, thermoplastic polyester, PET, poly(ethyl acrylate), poly(methyl methacrylate), nylon, fluoropolymer, polyvinylidene fluoride, and ethylene tetrafluoroethylene. 11. The method of claim 1, wherein the insulative layer has a thermal conductivity of less than about 5 W/m-K. 12. The method of claim 1, wherein the insulative layer comprises a thermochromic material.