Low impedance, low modulus wire configurations for a medical device
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
A61N-001/05
H01B-005/10
출원번호
US-0092380
(2011-04-22)
등록번호
US-8660662
(2014-02-25)
발명자
/ 주소
Li, Bernard Q.
Wang, Ling
출원인 / 주소
Medtronic, Inc.
대리인 / 주소
McMahon, Beth L.
인용정보
피인용 횟수 :
2인용 특허 :
52
초록▼
Techniques are disclosed related to wires that may be used within a medical device. According to one example, a wire may include a core formed of a material having a resistivity of less than 25 micro-ohm-cm and a layer of a biocompatible beta titanium alloy surrounding the core. As one example, the
Techniques are disclosed related to wires that may be used within a medical device. According to one example, a wire may include a core formed of a material having a resistivity of less than 25 micro-ohm-cm and a layer of a biocompatible beta titanium alloy surrounding the core. As one example, the beta titanium alloy has an elastic modulus ranging from 30 GigaPascals (GPa) to 90 GPa and comprises at least two elements from a group consisting of titanium, molybdenum, niobium, tantalum, zirconium, chromium, iron and tin. In one embodiment, the core may be formed of silver, tantalum, a tantalum alloy, niobium, a niobium alloy, platinum, a platinum alloy, palladium, or a palladium alloy. In some examples, one or more wires may be incorporated into a coil or a cable and one or more such coils or cables may be carried by a medical device such as a medical electrical lead.
대표청구항▼
1. An implantable device (IMD), comprising: a core formed of a material having a resistivity of less than 25 micro-ohm-cm; and a layer of biocompatible beta titanium alloy selected from Ti-15Mo, TiOsteum (Ti-35Nb-7Zr-5Ta), TNTZ (Ti-29Nb-12Ta-5Zr), TNCS (Ti- 19Nb-5Cr-4Sn), TNCS (Ti- 18.6Nb-4.5Cr-4Sn)
1. An implantable device (IMD), comprising: a core formed of a material having a resistivity of less than 25 micro-ohm-cm; and a layer of biocompatible beta titanium alloy selected from Ti-15Mo, TiOsteum (Ti-35Nb-7Zr-5Ta), TNTZ (Ti-29Nb-12Ta-5Zr), TNCS (Ti- 19Nb-5Cr-4Sn), TNCS (Ti- 18.6Nb-4.5Cr-4Sn), Ti—Nb—Cr—Zr (Ti-20Nb-5Cr-4Zr), TMFZ, TLM (Ti-22Nb-3Zr-3Mo-2Sn), TLM (Ti-22.4Nb-2.8Zr-2.7Mo-1.8Sn) and Ti-30Ta surrounding the core to form a wire, the alloy having an elastic modulus ranging from 30 GigaPascals (GPa) to 90 GPa. 2. The IMD of claim 1, wherein the core is formed of silver. 3. The IMD of claim 1, wherein the core is formed of a material having a resistivity of between 10 and 20 micro-ohm-cm. 4. The IMD of claim 1, wherein an outer diameter of the wire is between .001 inches and .01 inches. 5. The IMD of claim 1, wherein the outer diameter of the wire is between .003 inches and .005 inches. 6. The IMD of claim 1, further comprising an electrically-coupled element that is electrically coupled to the wire, wherein a fraction of a cross-sectional area of the core to the cross-sectional area of the wire is selected so that a resistance of the wire is substantially the same as a resistance of the element. 7. The IMD claim 6, wherein the resistance of the wire is tuned to a value of between 3 ohms and 15 ohms per 4 inches of wire. 8. The IMD of claim 1, further comprising an insulating layer surrounding the layer surrounding the core. 9. The IMD of claim 8, wherein the insulating layer is ethylene tetrafluoroethylene (ETFE). 10. The IMD of claim 1, wherein the core is formed of tantalum, a tantalum alloy, niobium, a niobium alloy or platinum. 11. The IMD of claim 1, wherein the layer surrounding the core and the core are cold drawn and then heated to a beta transit temperature of the beta titanium alloy of between 730° C.-815° C. 12. The IMD of claim 1, wherein the layer surrounding the core and the core are cold drawn and then heated to a beta transit temperature of the beta titanium alloy of between 600° C.-900° C. 13. The IMD of claim 1, further compromising: multiple cores, each formed of a material having a resistivity of less than 25 micro-ohm-cm; anda respective layer of the biocompatible be titanium alloy surrounding each core to form a respective filar; andwherein the filars are configured as a coil. 14. The IMD of claim 13, wherein the coil has an outer diameter of less than .03 inches. 15. The IMD of claim 13, wherein a ratio of a pitch of the coil to an outer diameter of the coil is greater than one. 16. The IMD of claim 13, wherein the IMD comprises more than four filars. 17. The IMD of claim 1 farther comprising: multiple cores, each formed of a material having a resistivity of less than 25 micro-ohm-cm; anda respective layer of the biocompatible beta titanium alloy surrounding each core to term a respective wire; andwherein the wires are configured as at least one cable that has been heated to a stress-relieve temperature of the beta titanium alloy. 18. The IMD of claim 17, wherein the biocompatible beta titanium alloy is Ti-15Mo and the at least one cable has been heated to a stress-relieve temperature of between 500° C.-650° C. for less than 10 seconds. 19. The IMD of claim. 17, wherein the wires are configured as multiple cables, and further comprising a lead body comprising at least eight lumens, each lumen carrying a respective one of the cables. 20. The IMD of claim 1, wherein the layer of beta titanium alloy is an ubroken lever having a substantially uniform thickness. 21. An electrically-conducting element for a medical electrical device, comprising: a core formed of a material having a resistivity of less than 25 micro-ohm-cm; and a layer of biocompatible beta titanium alloy selected from Ti-15Mo, TiOsteum (Ti-35Nb-7Zr-5Ta), TNTZ (Ti-29Nb-12Ta-5Zr), TNCS (Ti- 19Nb-5Cr-4Sn), TNCS (Ti- 18.6Nb-4.5Cr-4Sn), Ti—Nb—Cr—Zr (Ti-20Nb-5Cr-4Zr), TMFZ, TLM (Ti-22Nb-3Zr-3Mo-2Sn), TLM (Ti-22.4Nb-2.8Zr-2.7Mo-1.8Sn) and Ti-30Ta surrounding the core to form a wire, the alloy having an elastic modulus ranging from 30 GigaPascals (GPa) to 90 GPa. 22. The electrical-coducting element of claim 21,wherein the core is formed of a material having a resistivity of between 10 micro-ohm-cm and 20 micro-ohm-cm.) 23. The electrically-conducting element of claim 21, wherein the core is formed of silver, tantalum, a tantalum alloy, niobium, a niobium alloy, platinum, a platinum alloy, palladium, or a palladium alloy. 24. The electrically-conducting element of claim 21, wherein the layer surrounding the core is formed of Ti-15Mo. 25. The implantable medical device claim 1, wherein the biocompatible beta titanium alloy is Ti-15Mo.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (52)
Naoki Ishii JP; Takashi Kaneko JP; Shin Sumimoto JP; Hideki Yamamoto JP; Ichiro Nagao JP, .beta.-titanium alloy wire, method for its production and medical instruments made by said .beta.-titanium alloy wire.
Davidson James A. (2573 Windy Oaks Rd. Germantown TN 38138) Kovacs Paul (3227 S. Mendenhall Rd. Memphis TN 38115), Biocompatible low modulus titanium alloy for medical implants.
Scheiner Avram (University Heights OH) Marsolais E. Byron (Shaker Heights OH) Mortimer J. Thomas (Cleveland Heights OH) Kicher Thomas P. (South Euclid OH), Double helix functional stimulation electrode.
Steinemann Samuel G. (St. Sulpice CHX), Electrical cable for performing stimulations and/or measurements inside a human or animal body and method of manufacturi.
Bush M. Elizabeth (Fremont CA) Hoffmann Drew (Los Gatos CA) Matthews M. Dean (Saratoga CA) Medrano Pedro G. (Santa Clara CA), Electrical connection for medical electrical stimulation electrodes.
Breyen Mark D. (Plymouth MN) Lessar Joseph F. (Coon Rapids MN) Stokes Kenneth B. (Brookyn Park MN) Upton James E. (New Brighton MN) Istephanous Naim S. (Roseville MN) Miller Jennifer P. (Elk River MN, Medical electrical lead.
Molacek Richard L. (Maple Grove MN) Jevne Allan H. (Anoka MN) Pohndorf Peter J. (Stillwater MN) Cobian Kenneth E. (St. Anthony MN) Lessar Joseph F. (Coon Rapids MN) Upton James E. (New Brighton MN), Medical electrical lead.
Lin, Jiin-Huey Chern; Ju, Chien-Ping; Lee, Chih-Min, Medical implant made of biocompatible low modulus high strength titanium-niobium alloy and method of using the same.
De Bellis Ferruccio (Rome ITX) Borghi Enzo (Budrio ITX), Safety element to permanently assure the electric reliability of pulse transmitting leads utilized in cardiac pacemakers.
Hwang,JungHwan; Furuta,Tadahiko; Nishino,Kazuaki; Saito,Takashi, Titanium alloy having high elastic deformation capacity and method for production thereof.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.