초록 ▼

Apparatus for and methods of rethermalizing a package of refrigerated or frozen food are disclosed. In general, heating mechanisms are brought into conductive heat transfer contact with the package of food and operated for a duration of rethermalization time to rethermalize the package of food by he

Apparatus for and methods of rethermalizing a package of refrigerated or frozen food are disclosed. In general, heating mechanisms are brought into conductive heat transfer contact with the package of food and operated for a duration of rethermalization time to rethermalize the package of food by heating the food to a rethermalized temperature, and then, if desired, to hold the rethermalized package of food at a desired holding temperature for a duration of holding time. The rethermalization time can be relatively short (e.g., thirty minutes or less), and the holding time can range from a very short period of time to a very long period of time (e.g., four, six, eight or more hours) without significant loss of food quality. Other features of the apparatus and methods are disclosed.

대표청구항 ▼

1. A method of rethermalizing food comprising placing a package of refrigerated or frozen food in a tray of thermally conductive material having a bottom wall, side walls and an open top,moving the tray into a compartment of a cabinet to a position in which the bottom wall of the tray is in conducti

1. A method of rethermalizing food comprising placing a package of refrigerated or frozen food in a tray of thermally conductive material having a bottom wall, side walls and an open top,moving the tray into a compartment of a cabinet to a position in which the bottom wall of the tray is in conductive heat transfer contact with a lower heating mechanism in the compartment, andmoving an upper heating mechanism in the compartment into conductive heat transfer contact with an outer upper face of the package in the open-top tray. 2. The method of claim 1, further comprising moving the upper heating mechanism below an upper rim of the tray into conductive heat transfer contact with the outer upper face of the package located below the upper rim of the tray. 3. The method of claim 1, wherein said upper heating mechanism is biased downward by one or more biasing elements into said conductive heat transfer contact with the outer upper face of the package. 4. The method of claim 1, wherein said upper heating mechanism is spring biased downward into conductive heat transfer contact with the outer upper face of the package. 5. The method of claim 1, wherein said upper heating mechanism is spring biased downward into conductive heat transfer contact with the outer upper face of the package, and wherein said method further comprises moving the upper heating mechanism below an upper rim of the tray into conductive heat transfer contact with the outer upper face of the package located below the upper rim of the tray. 6. The method of claim 1, wherein said package of refrigerated or frozen food comprises flexible packaging, and wherein said method further comprises maintaining the upper heating mechanism in conductive heat transfer contact with an outer upper face of the package as the package of food changes shape while the package of food is being rethermalized. 7. The method of claim 6, further comprising moving the upper heating mechanism below an upper rim of the tray while the package of food is being rethermalized. 8. The method of claim 1, wherein moving an upper heating mechanism in the compartment into conductive heat transfer contact with an outer upper face of the package in the open-top tray comprises moving the upper heating mechanism into direct conductive heat transfer contact with the outer upper face of the package.