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[미국특허] Integrated circuit package system with exposed interconnects 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/02
  • H01L-021/44
출원번호 US-0354806 (2006-02-14)
등록번호 US-8704349 (2014-04-22)
발명자 / 주소
  • Chow, Seng Guan
  • Shim, II Kwon
  • Han, Byung Joon
출원인 / 주소
  • Stats Chippac Ltd.
대리인 / 주소
    Ishimaru & Associates LLP
인용정보 피인용 횟수 : 4  인용 특허 : 228

초록 ▼

An integrated circuit package system is provided including providing a substrate having a first surface and second surface; mounting interconnects to the first surface; mounting integrated circuit dies to the first surface; embedding the interconnects and the integrated circuit die within an encapsu

대표청구항 ▼

1. A method of manufacture of an integrated circuit package system comprising: providing a substrate having a first surface and a second surface;mounting a first set of interconnects to the first surface, the first set of interconnects having exposed top portions and at least partial spheroidal shap

이 특허에 인용된 특허 (228) 인용/피인용 타임라인 분석

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