초록

An optical element has at least one additional element fitted thereon which dissipates the vibrational energy of the optical element by friction.

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1. A system, comprising: an optical element;a mount holding the optical element;an element connected to the mount, the element comprising an additional mass, the additional mass comprising a ring connected to the mount; anda second element supported by the ring or the optical element, wherein: the e

1. A system, comprising: an optical element;a mount holding the optical element;an element connected to the mount, the element comprising an additional mass, the additional mass comprising a ring connected to the mount; anda second element supported by the ring or the optical element, wherein: the element is configured so that, when the mount undergoes vibration,the element dissipates vibrational energy of the mount via Coulomb friction, the ring is concentrically disposed around the optical element; andthe second element is configured so that, when the mount undergoes vibration, the element dissipates vibrational energy of the mount via Coulomb friction. 2. The system of claim 1, wherein the additional mass is connected to the mount via an adhesive. 3. The system of claim 1, wherein the additional mass is arranged on a fibrous medium. 4. The system of claim 1, wherein the additional mass is surrounded by a fibrous medium. 5. The system of claim 1, wherein the ring is arranged in an annular cutout in the mount. 6. The system of claim 1, wherein the optical element comprises a lens. 7. The system of claim 1, wherein the element is fitted on one or more of those points of the mount at which the amplitude of the vibration is highest. 8. The system of claim 1, wherein the element is connected exclusively to the mount and has no contact with another element. 9. The system of claim 1, wherein the element is arranged in a cutout in the mount. 10. The system of claim 1, wherein the element is tuned to the natural frequency of the mount. 11. The system of claim 1, wherein the element comprises a container containing a pourable medium having individual particles. 12. The system of claim 11, wherein the pourable medium is sand. 13. The system of claim 11, wherein the pourable medium is a granular material. 14. The system of claim 11, wherein the pourable medium comprises a powder. 15. The system of claim 1, wherein the additional mass comprises a wire cable comprising a number of individual wires with ends, respective masses being disposed on the ends of the wires. 16. The system of claim 1, wherein the optical element comprises a mirror. 17. An objective, comprising: a system as claimed in claim 1,wherein the objective is a lithography objective. 18. A projection exposure machine, comprising: an illumination system; anda lithography objective comprising a system as claimed in claim 1,wherein the projection exposure machine is a semiconductor lithography projection exposure machine. 19. A method, comprising: using a projection exposure machine to produce semiconductor components, the projection exposure machine comprising: an illumination system; anda lithography objective comprising a system as claimed in claim 1,wherein the projection exposure machine is configured to produce semiconductor components. 20. The system of claim 1, wherein the system is configured to be used in a semiconductor lithography objective.