A simple, cost-effective stamping or molding in the nanometer range is enabled using a stamping surface or molding face with a surface layer having hollow chambers that have been formed by anodic oxidation.
대표청구항▼
1. Method for producing a stamping tool with a structured stamping surface, comprising the steps of: oxidizing a surface or covering layer of the stamping tool for forming the stamping surface at least partially anodally and forming open hollow chambers that are at least essentially uniformly shaped
1. Method for producing a stamping tool with a structured stamping surface, comprising the steps of: oxidizing a surface or covering layer of the stamping tool for forming the stamping surface at least partially anodally and forming open hollow chambers that are at least essentially uniformly shaped and at least essentially evenly distributed over the surface or surface area of the stamping surface without the use of a model. 2. Method according to claim 1, wherein the surface or covering layer is oxidized potentiostatically. 3. Method according to claim 1, wherein the surface layer or covering layer is oxidized with varying voltage. 4. Method according to claim 3, wherein the surface or covering layer is oxidized galvanostatically. 5. Method according to claim 1, wherein the surface or covering layer that is oxidized is formed of a material selected from the group consisting of aluminum, silicon, iron, steel and titanium. 6. Method according to claim 1, comprising the additional step of modifying the stamping surface at least one of before and after said oxidizing step for producing a rough structure. 7. Method for structuring a surface of a work piece in a nanometer range by means of a stamping tool with a structured stamping surface, comprising at least one of pressing and rolling a stamping surface, formed of an anodally oxidized surface or covering layer with open hollow chambers which have diameters in a nanometer range that have been created model-free by anodic oxidation, onto the surface to be structured. 8. Method according to claim 7, wherein the surface is first roughly structured in a first step by means of a first stamping tool and then is finely structured by means of a second stamping tool in a second step. 9. Method according to claim 8, wherein the surface is finely structured by means of said second stamping tool in said second step with a stamping force that is reduced relative to that applied with said first stamping tool. 10. Method according to claim 8, wherein the surface is finely structured by means of said second stamping tool in said second step after hardening of the surface structured by said first step. 11. Method for at least partially structuring a surface of a cast work piece, comprising the steps of: casting the work piece using a casting mold with a structured molding face having an anodally oxidized surface or covering layer with open hollow chambers created model-free by anodic oxidation. 12. Method according to claim 11, wherein the surface or covering layer is formed at least substantially of a material selected from the group consisting of aluminum oxide, silicon oxide, iron oxide, oxidized steel, and titanium oxide. 13. An anti-reflection surface, comprising: a surface including at least one of projections of diameters in a nanometer range, and hollow chambers including diameters in a nanometer range, wherein the at least one of projections and hollow chambers on the anti-reflection surface are irregularly distributed, and wherein groups of the projections form larger projections of an order ranging from 0.1-50 micrometers, the larger projections including a surface having additional projections of 10-400 nm. 14. The anti-reflection surface according to claim 13, wherein the surface comprises an anodically oxidized material selected from the group consisting of aluminum, silicon, iron, steel and titanium. 15. The anti-reflection surface of claim 13, wherein the hollow chambers include diameters ranging from 10-500 nanometers. 16. The anti-reflection surface of claim 15, wherein the hollow chambers include diameters ranging from 15-200 nanometers. 17. The anti-reflection surface of claim 16, wherein the hollow chambers include diameters ranging from 20-100 nanometers. 18. The anti-reflection surface of claim 13, wherein the projections include diameters ranging from 10-400 nanometers. 19. A device, comprising the anti-reflection surface of claim 13. 20. A workpiece, comprising the anti-reflection surface of claim 13. 21. A device, comprising a workpiece, wherein the anti-reflection surface of claim 13 is a surface of the workpiece. 22. The anti-reflection surface of claim 13, wherein the projections include irregularly shaped projections. 23. The anti-reflection surface of claim 13, wherein the projections are of a somewhat conical shape. 24. The anti-reflection surface of claim 13, wherein the hollow chambers are irregularly shaped hollow chambers. 25. The anti-reflection surface of claim 13, wherein the hollow chambers are of a somewhat conical shape. 26. The anti-reflection surface of claim 13, wherein the anti-reflection surface is formed from an acrylic resin. 27. The anti-reflection surface of claim 26, wherein the acrylic resin is PMMA. 28. The anti-reflection surface of claim 13, wherein the hollow chambers include structural widths ranging from 30-600 nanometers. 29. An anti-reflection surface, comprising: a surface including at least one of projections and hollow chambers distributed over the surface at a density of 109 to 1011/cm2, wherein the at least one of projections and hollow chambers have a substantially conical shape. 30. The anti-reflection surface according to claim 29, wherein the anti-reflection surface is formed of an anodically oxidized material selected from the group consisting of aluminum, silicon, iron, steel and titanium. 31. The anti-reflection surface of claim 29, wherein the hollow chambers of the anti-reflection surface includes diameters ranging from 10-500 nanometers. 32. The anti-reflection surface of claim 31, wherein the hollow chambers include diameters ranging from 15-200 nanometers. 33. The anti-reflection surface of claim 32, wherein the hollow chambers include diameters ranging from 20-100 nanometers. 34. The anti-reflection surface of claim 29, wherein the projections include diameters ranging from 10-400 nanometers. 35. The anti-reflection surface of claim 34, wherein groups of the projections form larger projections of an order ranging from 0.1-50 micrometers. 36. A device, comprising the anti-reflection surface of claim 29. 37. A workpiece, comprising the anti-reflection surface of claim 29. 38. A device, comprising a workpiece, wherein the anti-reflection surface of claim 29 is a surface of the workpiece. 39. The anti-reflection surface of claim 29, wherein the hollow chambers of the anti-reflection surface includes irregularly distributed hollow chambers. 40. The anti-reflection surface of claim 29, wherein the anti-reflection surface includes irregularly shaped hollow chambers. 41. The anti-reflection surface of claim 29, wherein the anti-reflection surface includes irregularly distributed projections. 42. The anti-reflection surface of claim 29, wherein the anti-reflection surface includes irregularly shaped projections. 43. The anti-reflection surface of claim 29, wherein the anti-reflection surface is formed from an acrylic resin. 44. The anti-reflection surface of claim 43, wherein the acrylic resin is PMMA. 45. The anti-reflection surface of claim 29, wherein the anti-reflection surface includes hollow chambers with structural widths ranging from 30-600 nanometers.
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