|국가/구분||United States(US) Patent 등록|
|국제특허분류(IPC7판)||H01M-010/50 F25B-029/00 H05K-007/20|
|미국특허분류(USC)||429/062; 429/120; 165/061; 361/704|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 8 인용 특허 : 164|
Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the t...
1. A thermal management system configured to manage temperature in a temperature-sensitive region of an electrical device, the system comprising: a thermoelectric device configured to transfer thermal energy between a main surface and a waste surface upon application of electric power to the thermoelectric device, wherein the main surface of the thermoelectric device is in substantial thermal communication with an electrical conductor, wherein the electrical conductor is configured to deliver electric power to or from an electrical device such that the e...