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Wraparound assembly for combination touch, handwriting and fingerprint sensor 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G02F-001/1335
출원번호 US-0271065 (2011-10-11)
등록번호 US-8724038 (2014-05-13)
발명자 / 주소
  • Ganapathi, Srinivasan Kodaganallur
  • Buchan, Nicholas Ian
  • Petersen, Kurt Edward
  • Shenoy, Ravindra V.
  • Lin, Peng Cheng
  • Cheng, Ericson
출원인 / 주소
  • QUALCOMM MEMS Technologies, Inc.
대리인 / 주소
    Weaver Austin Villeneuve & Sampson, LLP
인용정보 피인용 횟수 : 41  인용 특허 : 167

초록

This disclosure provides systems, methods and apparatus for a combined sensor device. In some implementations, a combined sensor device includes a wrap-around configuration wherein an upper flexible substrate has patterned conductive material on an extended portion to allow routing of signal lines,

대표청구항

1. An apparatus, comprising: a first substantially transparent substrate;a first plurality of substantially transparent electrodes formed in a first region of the first substantially transparent substrate;a second plurality of substantially transparent electrodes formed in a second region of the fir

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