[특허]Assembly having stacked die mounted on substrate

Assembly having stacked die mounted on substrate 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-023/522
출원번호	US-0728246 (2012-12-27)
등록번호	US-8729690 (2014-05-20)
발명자 / 주소	Vindasius, Al Robinson, Marc E. Jacobsen, Larry Almen, Donald
출원인 / 주소	Invensas Corporation
대리인 / 주소	Lerner, David, Littenberg, Kromholz & Mentlik, LLP
인용정보	피인용 횟수 : 0 인용 특허 : 143

초록 ▼

Metal rerouting interconnects at one or more sides of a die or multiple die segments can form edge bonding pads for electrical connection. Insulation can be applied to surfaces of the die or multiple die segments after optional thinning and singulation, and openings can be made in the insulation to the electrical connection pads. After being placed atop one another in a stack, vertically adjacent die or die segments can be electrically interconnected using a flexible bond wire or bond ribbon attached to an electrical connection pad exposed within such opening, the bond wire or ribbon protruding horizontally, and an electrically conductive polymer, or epoxy, filaments or lines can be applied to the stack.

대표청구항 ▼

1. A semiconductor die assembly, comprising: a die stack comprising a first die mounted on a substrate and at least one additional die stacked over said first die mounted on said substrate, said first die and each said additional die having a plurality of peripheral electrical connection sites arrayed in a row near and generally parallel to a peripheral edge of said die, at least one die selected from said first die and said at least one additional die being a memory die, and dielectric spacers maintaining a fixed spacing between the at least one additional die and the first die, and a conducting element electrically connected to at least one of said peripheral electrical connection sites on at least one of said die and extending from said at least one peripheral electrical connection site toward said peripheral die edge on said at least one of said die; andthe substrate having an electrical connection land at a die mount side thereof, whereinsaid at least one of said peripheral electrical connection sites is electrically connected to said electrical connection land on said substrate by an electrically conductive polymer element applied to a side of said die stack adjacent said peripheral die edge, said electrically conductive polymer element contacting said conducting element and being electrically connected to said land. 2. The assembly of claim 1, wherein adjacent die of the first die and the at least one additional die are attached to one another with an electrically insulating material. 3. The assembly of claim 2, wherein the spacers are disposed in the electrically insulating material between the adjacent die. 4. The assembly of claim 2, wherein the spacers include spheres. 5. The assembly of claim 4, wherein the spheres include spheres made of glass, ceramic or quartz. 6. A semiconductor die assembly, comprising: a die stack comprising a first die mounted on a substrate and at least one additional die stacked over said first die mounted on said substrate, said first die and each said additional die having a plurality of peripheral electrical connection sites arrayed in a row near and generally parallel to a peripheral edge of said die, and a conducting element electrically connected to at least one of said peripheral electrical connection sites on at least one of said die and extending from said at least one peripheral electrical connection site toward said peripheral die edge on said at least one of said die; the substrate having an electrical connection land at a die mount side thereof, whereinsaid at least one of said peripheral electrical connection sites is electrically connected to said electrical connection land on said substrate by an electrically conductive polymer element applied to a side of said die stack adjacent said peripheral die edge, said electrically conductive polymer element contacting said conducting element and being electrically connected to said land; anda heatsink covering the die stack. 7. The assembly of claim 6 wherein said conducting element extends into the electrically conductive polymer element. 8. The assembly of claim 6, said additional die and said first die mounted on said substrate comprising a plurality of die; wherein said at least one interconnection site on at least a first one of said plurality of die is electrically connected to said at least one interconnection site on at least a second one of said plurality of die by an electrically conductive polymer element applied to a side of said die stack adjacent said peripheral edge,said electrically conductive polymer element contacting a said conducting element electrically connected to said at least one interconnection site on each of said plurality of die. 9. The assembly of claim 6 wherein said peripheral interconnection site on any one of more of said die comprises an original peripheral die pad. 10. The assembly of claim 6 wherein any one of more of said die is rerouted to connect original die pads to peripheral interconnection sites. 11. The assembly of claim 6, further comprising an electrical insulator between any one of more of said die and the electrically conductive polymer element. 12. The assembly of claim 6 wherein the electrical insulator comprises a conformal coating. 13. The assembly of claim 12 wherein the conformal coating has openings above selected ones of the interconnection sites. 14. The assembly of claim 6 wherein the electrically conductive polymer element is oriented generally perpendicular to the die mount side of the substrate. 15. The assembly of claim 6 wherein said conducting element comprises a lead frame lead. 16. The assembly of claim 6, further comprising an underfill between said first die and said substrate. 17. The assembly of claim 6, wherein said substrate comprises a multi-layer substrate. 18. The assembly of claim 17 wherein said multi-layer substrate comprises a heat sinking layer. 19. The assembly of claim 18 wherein said heat sinking layer is a metal layer.

이 특허에 인용된 특허 (143)

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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Assembly having stacked die mounted on substrate 원문보기

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대표청구항 ▼

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연합인증

Assembly having stacked die mounted on substrate 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

전체(0) 논문(0) 특허(0) 보고서(0)

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이 특허에 인용된 특허 (143)

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IPC 상위 출원인

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

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