Manufacturing method of developing device, remanufacturing method of process cartridge, developing device, and process cartridge
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G03G-015/00
G03G-015/08
G03G-021/18
출원번호
US-0444168
(2012-04-11)
등록번호
US-8755713
(2014-06-17)
우선권정보
JP-2011-096348 (2011-04-22)
발명자
/ 주소
Kawai, Tachio
Uratani, Shunsuke
출원인 / 주소
Canon Kabushiki Kaisha
대리인 / 주소
Fitzpatrick, Cella, Harper & Scinto
인용정보
피인용 횟수 :
0인용 특허 :
40
초록▼
A remanufacturing method of a developing device that includes a developer accommodating portion partitioned by a partitioning portion, a first opening provided in the partitioning portion and a seal member welded on the partitioning portion, surrounding the first opening, wherein the first opening i
A remanufacturing method of a developing device that includes a developer accommodating portion partitioned by a partitioning portion, a first opening provided in the partitioning portion and a seal member welded on the partitioning portion, surrounding the first opening, wherein the first opening is opened by removing the seal member to supply a developer to the outside. The method includes hermetically sealing, before or after re-filling the developer in the developer accommodating portion for reuse, the first opening by bonding, on the partitioning portion, a plate-like member, which is provided with a second opening corresponding to the first opening, and on which a reseal member for sealing the second opening is detachably bonded, at a region outside of a welding trace, a region inside of the trace, or a region ranging from an inside to an outside of the trace, so as to cover the welding trace.
대표청구항▼
1. A remanufacturing method of a developing device that includes a developer accommodating portion partitioned by a partitioning portion, a first opening provided in the partitioning portion, and a seal member, welded on the partitioning portion, which surrounds the first opening, for sealing the fi
1. A remanufacturing method of a developing device that includes a developer accommodating portion partitioned by a partitioning portion, a first opening provided in the partitioning portion, and a seal member, welded on the partitioning portion, which surrounds the first opening, for sealing the first opening, wherein the first opening is opened for use by removing the seal member from the partitioning portion to supply a developer to outside of the developer accommodating portion through the first opening, said method comprising: hermetically sealing, before or after re-filling the developer in the developer accommodating portion for reuse from which the seal member has been removed, the first opening, by bonding, on the partitioning portion, a plate-like member, which is provided with a second opening corresponding to the first opening and on which a reseal member for sealing the second opening is detachably bonded, at a region outside of a welding trace, a region inside of the welding trace, or a region ranging from an inside to an outside of the welding trace, so as to cover the welding trace. 2. A remanufacturing method according to claim 1, wherein the plate-like member is formed of a thermoplastic resin material and is bonded on the partitioning portion with a double-coated tape. 3. A remanufacturing method according to claim 1, wherein the second opening of the plate-like member has a size that is larger than the first opening. 4. A remanufacturing method according to claim 1, wherein the plate-like member is bonded from a direction opposing the first opening, so as to seal the first opening. 5. A developing device for use with an electrophotographic image forming apparatus, said developing device comprising: a developer accommodating portion partitioned by a partitioning portion;a first opening provided at a partitioning portion, for supplying a developer accommodated in said developer accommodating container to outside of the developer accommodating portion; anda plate-like member for hermetically sealing the first opening, wherein said plate-like member is provided with a second opening corresponding to the first opening and on which a reseal member for sealing the second opening is detachably bonded, and wherein said plate-like member is bonded, on the partitioning portion, at a region outside of a welding trace provided at the partitioning portion, a region inside of the welding trace, or a region ranging from an inside to an outside of the welding trace, so as to cover the welding trace. 6. A developing device according to claim 5, wherein the welding trace is a trace of a seal member welded on and then removed from said plate-like member. 7. A developing device according to claim 5, wherein said plate-like member is formed of a thermoplastic resin material and is bonded on the partitioning portion with a double-coated tape. 8. A developing device according to claim 5, wherein the second opening of said plate-like member has a size that is larger than said first opening. 9. A developing device according to claim 5, wherein said plate-like member is bonded from a direction opposing said first opening so as to seal said first opening. 10. A remanufacturing method of a process cartridge that includes an electrophotographic photosensitive member, a developing chamber provided with a developer carrying member for developing an electrostatic latent image formed on the electrophotographic photosensitive member with a developer, a developer accommodating portion partitioned from the developing chamber by a partitioning portion, a first opening provided in the partitioning portion, and a seal member, welded on the partitioning portion, which surrounds the first opening, for sealing the first opening, wherein the first opening is opened for use by removing the seal member from the partitioning portion to supply the developer from the developer accommodating portion to the developing chamber, said method comprising: hermetically sealing, before or after re-filling the developer in the developer accommodating portion for reuse from which the seal member has been removed, the first opening, by bonding, on the partitioning portion, a plate-like member, which is provided with a second opening corresponding to the first opening and on which a reseal member for sealing the second opening is detachably bonded, at a region outside of a welding trace, a region inside of the welding trace, or a region ranging from an inside to an outside of the welding trace, so as to cover the welding trace. 11. A remanufacturing method according to claim 10, wherein the plate-like member is formed of a thermoplastic resin material and is boned on the partitioning portion with a double-coated tape. 12. A remanufacturing method according to claim 10, wherein the second opening of the plate-like member has a size that is larger than the first opening. 13. A remanufacturing method according to claim 10, wherein the plate-like member is bonded from a direction opposing the first opening, so as to seal the first opening. 14. A process cartridge detachably mountable to an electrophotographic image forming apparatus, said process cartridge comprising: an electrophotographic photosensitive member;a developing chamber provided with a developer carrying member for developing an electrostatic latent image formed on said electrophotographic photosensitive member with a developer;a developer accommodating portion partitioned from said developing chamber by a partitioning portion;a first opening provided at a partitioning portion, for supplying a developer accommodated in said developer accommodating container to said developing chamber; anda plate-like member for hermetically sealing the first opening, wherein said plate-like member is provided with a second opening corresponding to the first opening and on which a reseal member for sealing the second opening is detachably bonded, and wherein said plate-like member is bonded, on the partitioning portion, at a region outside of a welding trace provided at the partitioning portion, a region inside of the welding trace, or a region ranging from an inside to an outside of the welding trace, so as to cover the welding trace. 15. A process cartridge according to claim 14, wherein the welding trace is a trace of a seal member welded on and then removed from said plate like member. 16. A process cartridge according to claim 14, wherein said plate-like member is formed of a thermoplastic resin material and is bonded on the partitioning portion with a double-coated tape. 17. A process cartridge according to claim 14, wherein the second opening of said plate-like member has a size that is larger than said first opening. 18. A process cartridge according to claim 14, wherein said plate-like member is bonded from a direction opposing said first opening so as to seal said first opening.
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이 특허에 인용된 특허 (40)
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