Electronic apparatus and methods may include a hafnium tantalum oxynitride film on a substrate for use in a variety of electronic systems. The hafnium tantalum oxynitride film may be structured as one or more monolayers. The hafnium tantalum oxynitride film may be formed using atomic layer depositio
Electronic apparatus and methods may include a hafnium tantalum oxynitride film on a substrate for use in a variety of electronic systems. The hafnium tantalum oxynitride film may be structured as one or more monolayers. The hafnium tantalum oxynitride film may be formed using atomic layer deposition. Metal electrodes may be disposed on a dielectric containing a hafnium tantalum oxynitride film.
대표청구항▼
1. A method comprising: transmitting a voltage to an electrode, the electrode electrically coupled to an insulator and further electrically coupled to a conductive region, the conductive region forming at least a part of a conductive path, the insulator comprising HfTaON; andstoring a charge based o
1. A method comprising: transmitting a voltage to an electrode, the electrode electrically coupled to an insulator and further electrically coupled to a conductive region, the conductive region forming at least a part of a conductive path, the insulator comprising HfTaON; andstoring a charge based on the voltage. 2. The method of claim 1, wherein storing includes storing using the insulator. 3. The method of claim 1, wherein transmitting includes transmitting using the insulator. 4. The method of claim 1, wherein transmitting includes transmitting using an insulator comprising substantially HfTaON. 5. A method comprising: receiving a signal using a circuit device including a dielectric portion located between two or more conductive regions, the dielectric portion comprising HfTaON; andcoupling the signal to provide an electric field, the electric field strength based on the dielectric portion. 6. The method of claim 5, including: transmitting the signal using circuitry associated with at least one of a mixed signal circuit, a radio frequency device, a transceiver, and an optical transmitter. 7. The method of claim 5, wherein receiving includes receiving using a circuit associated with a portable wireless device. 8. The method of claim 5, wherein receiving includes receiving using a circuit associated with at least one of a processor, a controller, and a memory. 9. The method of claim 5, wherein receiving includes the dielectric portion comprising the HfTaON disposed in a dielectric stack. 10. The method of claim 5, wherein coupling includes coupling an electric field between the two or more conductive regions. 11. The method of claim 5, wherein coupling includes selectively coupling to establish an electric field between the two or more conductive regions. 12. A method comprising: receiving a signal using a circuit device including a dielectric portion located between two or more conductive regions, the dielectric portion comprising a transition metal and a refractory metal; andcoupling the signal to provide an electric field, the electric field strength based on the dielectric portion, wherein coupling includes coupling to provide an electric field to form a charge inversion layer. 13. The method of claim 12, wherein the dielectric portion comprising the transition metal and the refractory metal is HfTaON. 14. The method of claim 12, wherein the HfTaON is disposed in a nanolaminate. 15. The method of claim 12, wherein one of the two or more conductive regions includes aluminium, gold, silver, an alloy of aluminum, an alloy of gold, an alloy of silver, copper, platinum, rhenium, ruthenium, an alloy of tantalum, an alloy of tungsten, rhodium, nickel, osmium, palladium, iridium, cobalt, germanium, or combinations thereof.
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