|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||062/003.2; 062/003.7; 165/104.26|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 9 인용 특허 : 20|
A hybrid thermoelectric-ejector active cooling system having an increased Coefficient of Performance (COP) when compared to typical thermoelectric cooling modules. A thermoelectric cooling module is integrated with an ejector cooling device so that heat from the thermoelectric cooling module is rejected to a high temperature evaporator of the ejector cooling device. This provides for a total COP greater than the sum of the COPs of the thermoelectric cooling module and ejector cooling device individually. For example, given 1 unit input power into the the...
1. An active cooling system for transferring heat from a heat source to an external heat sink comprising an ejector cooling system having a high temperature evaporator and a low temperature evaporator, and a thermoelectric cooling device having a hot side in thermal communication with the high temperature evaporator for supplying heat used to vaporize a primary fluid and a cold side in thermal communication with the low temperature evaporator for removing heat from the low temperature evaporator, wherein the elector comprises a nozzle and a mixing chambe...