IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0535545
(2009-08-04)
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등록번호 |
US-8763702
(2014-07-01)
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발명자
/ 주소 |
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출원인 / 주소 |
- Baker Hughes Incorporated
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대리인 / 주소 |
Mossman, Kumar & Tyler, PC
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인용정보 |
피인용 횟수 :
0 인용 특허 :
19 |
초록
▼
A device for dissipating heat away from a heat sensitive component includes a heat dissipation member thermally coupled to a heat sensitive component. The heat dissipation member may be formed of a composite material. In aspects, the device may be include an enclosure coupled to a conveyance device;
A device for dissipating heat away from a heat sensitive component includes a heat dissipation member thermally coupled to a heat sensitive component. The heat dissipation member may be formed of a composite material. In aspects, the device may be include an enclosure coupled to a conveyance device; a heat sensitive component disposed in the enclosure; and a composite heat dissipation member thermally coupled to the heat sensitive component. The composite heat dissipation member may include a metal and a non-metal. The apparatus may also include an encapsulation substantially encapsulating the heat dissipation member and the heat sensitive component.
대표청구항
▼
1. An apparatus for use in a wellbore, comprising: a conveyance device configured to be deployed in the wellbore;a heat sensitive component coupled to the conveyance device, the heat sensitive component having electrical connections connecting the heat sensitive component to a board, the electrical
1. An apparatus for use in a wellbore, comprising: a conveyance device configured to be deployed in the wellbore;a heat sensitive component coupled to the conveyance device, the heat sensitive component having electrical connections connecting the heat sensitive component to a board, the electrical connections being responsive to vibrations; anda heat dissipation member thermally coupled to the heat sensitive component, the heat dissipating member being affixed to the heat sensitive member such that a mass of the heat dissipating member causes an increase in forces applied to the connections due to the vibrations, the heat dissipation member being formed of a composite material and having a heat radiating surface configured and aligned to radiate heat conducted away from the heat sensitive component. 2. The apparatus of claim 1, wherein the composite material includes at least a metal and a non-metal, and wherein the forces increased by the mass of the heat dissipation member include at least a shear force and a bending moment and wherein the vibrations include at least an axial vibration, a lateral vibration, and a torsional vibration. 3. The apparatus of claim 1, wherein the composite material includes at least aluminum and diamond particles. 4. The apparatus of claim 1, further comprising an encapsulation at least partially encapsulating the heat dissipation member and the heat sensitive component, the encapsulation being configured to draw heat away from the heat sensitive component. 5. The apparatus of claim 1, further comprising an affixing agent connecting the heat dissipation member to the heat sensitive component, and wherein the heat sensitive component is configured to generate heat. 6. The apparatus of claim 1, wherein the composite material has a thermal conductivity of at least 400 W/m*k. 7. The apparatus of claim 1, wherein the composite material has a density less than about four grams per cubic centimeter. 8. The apparatus of claim 1, wherein the conveyance device is one of: (i) a drill string, and (ii) a wireline. 9. The apparatus of claim 1, wherein the heat sensitive component includes the board and at least one chip connected to the board, wherein the electrical connection is a soldered connection between the at least one chip and the board, and wherein the heat dissipating member is fixed to the at least one chip. 10. The apparatus of claim 1, wherein the heat sensitive component has heat radiating surfaces and wherein the heat radiating surface of the heat dissipation member has a larger surface area than the heat radiating surfaces of the heat sensitive component. 11. A method for operating a device in a wellbore, comprising: forming a heat dissipation member of a composite material;thermally coupling the heat dissipation member to a heat sensitive component, the heat sensitive component having electrical connections responsive to vibrations, and the heat dissipation member being affixed to the heat sensitive member such that the heat dissipating member causes an increase in forces applied to the connections due to the vibrations;conveying the heat sensitive component into a wellbore;radiating heat away from the heat sensitive component using a surface of the heat dissipation member. 12. The method of claim 11, wherein the composite material includes at least a metal and a non-metal, wherein the electrical connections are between the heat sensitive component and a printed circuit board, and wherein the heat dissipation member is affixed to the heat sensitive component. 13. The method of claim 11, wherein the composite material includes at least aluminum and diamond particles. 14. The method of claim 11, further comprising drawing heat away from the heat sensitive component using an encapsulation that at least partially encapsulates the heat dissipation member and the heat sensitive component. 15. The method of claim 11, further comprising connecting the heat dissipation member to the heat sensitive component with an affixing agent. 16. The method of claim 11, wherein the composite material has a thermal conductivity of at least 400 W/m*k. 17. The method of claim 11, wherein the composite material has a density less than about four grams per cubic centimeter. 18. The method of claim 11, further comprising at least one of: (i) logging the wellbore; and (ii) drilling the wellbore. 19. The method of claim 11, further comprising generating heat by energizing the heat sensitive component, affixing the heat dissipating member to the heat sensitive component. 20. The method of claim 11, wherein the heat sensitive component has heat radiating surfaces and wherein the heat radiating surface of the heat dissipation member has a larger surface area than the heat radiating surfaces of the heat sensitive component.
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