Method of forming a wood board incorporating embedded sound attenuating elements and stiffening elements
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
E04C-001/00
E04B-001/74
E04B-001/00
B27L-005/02
E04B-001/84
E04F-015/02
E04B-005/12
E04B-005/02
출원번호
US-0065860
(2011-03-31)
등록번호
US-8769912
(2014-07-08)
발명자
/ 주소
Stanhope, Thomas Spencer
출원인 / 주소
Stanhope, Thomas Spencer
대리인 / 주소
Ference, Thomas G.
인용정보
피인용 횟수 :
0인용 특허 :
14
초록▼
A board comprised of a wood structure having a first surface, a second surface, a first lateral edge, a second lateral edge and opposing ends. Sound attenuating elements embedded within the wood structure and stiffening elements positioned within the wood structure to coincide with the location of f
A board comprised of a wood structure having a first surface, a second surface, a first lateral edge, a second lateral edge and opposing ends. Sound attenuating elements embedded within the wood structure and stiffening elements positioned within the wood structure to coincide with the location of floor joist to which the board will be secured. The boards further forming a ceiling/floor structure by laying a single set of the boards adjacent to each other and securing them to the floor joists.
대표청구항▼
1. A method of fabricating a board, comprising the steps of: providing a first wood layer, having a first upper wood surface, a second lower wood surface, a first wood lateral edge, a second wood lateral edge opposite the first lateral edge, and opposing ends, said first wood layer having a length a
1. A method of fabricating a board, comprising the steps of: providing a first wood layer, having a first upper wood surface, a second lower wood surface, a first wood lateral edge, a second wood lateral edge opposite the first lateral edge, and opposing ends, said first wood layer having a length and a width;milling said first wood layer from said first wood lateral edge or said second wood lateral edge towards said second wood lateral edge or said first wood lateral edge, respectively, forming a plurality of hollow regions spaced from one another along the length, each of said plurality of hollow regions being milled between said first upper wood surface and said second lower wood surface of said first wood layer, each of said plurality of hollow regions formed along the length of said first wood layer and extending generally the width of said first wood layer or the whole width of said first wood layer;embedding a sound attenuating element within and filling each of said plurality of hollow regions, said sound attenuating element having a first upper side and a second lower side, said first upper side covered completely by said first upper wood surface and said second lower side covered completely by said second lower wood surface. 2. A method as recited in claim 1, wherein said embedding step includes said sound attenuating element being a solid sound attenuating material. 3. A method as recited in claim 1, wherein said milling step involves creating transverse stiffening elements extending between said first wood lateral edge and said second wood lateral edge, wherein said transverse stiffening elements are spaced along the length of said first wood layer at equal distances. 4. A method as recited in claim 1, further comprising embedding lateral stiffening elements along at least one from the group including said first wood lateral edge and said second wood lateral edge. 5. A method as recited in claim 1, further comprising shaping said board to have a tongue on said first wood lateral edge and a groove on said second wood lateral edge. 6. A method as recited in claim 1, further comprising shaping said board to have a chamfer on said first wood lateral edge and second wood lateral edge. 7. A method as recited in claim 1, wherein said embedding step includes filling each said hollow region with sound attenuating foam. 8. A method of fabricating a board, comprising the steps of: a) providing a piece of wood formed from softwood directly bonded to hardwood, said piece of wood having a softwood side with a first wood surface, a hardwood side with a second wood surface, a first wood lateral edge, a second wood lateral edge and opposite wood ends;b) milling said wood layer from at least one from the group including said first wood lateral edge and said second wood lateral edge to create a plurality of hollow regions therein, each hollow region having a first hollow surface and a second hollow surface, all first hollow surfaces of said hollow regions covered completely by said softwood, all second hollow surfaces of said hollow regions covered completely by said hardwood, said hollow regions separated by transverse stiffening elements extending between said first wood lateral edge and said second wood lateral edge; andc) embedding in each said hollow region a sound attenuating element that has a first side and second side, said first side covered completely by said first wood surface and said second side completely covered by said second wood surface. 9. A method as recited in claim 8, wherein said embedding step includes filling each said hollow region with sound attenuating foam. 10. A method as recited in claim 8, further comprising shaping said board to have a chamfer on said first wood lateral edge and said second wood lateral edge. 11. A method of fabricating a board, comprising the steps of: a) providing a first wood layer bonded to a second wood layer, said bonded wood layers having a hardwood side, a softwood side, a first lateral edge, a second lateral edge and opposing ends;b) milling said bonded wood layers from at least one from the group including said first lateral edge and said second lateral edge, wherein said milling creates a plurality of hollow regions within said bonded wood layers, each hollow region having a first hollow surface and a second hollow surface, all first hollow surfaces of said hollow regions covered completely by said hardwood side, all second hollow surfaces of said hollow regions covered completely by said softwood side;c) embedding in each said hollow region a sound attenuating element that has a first side and second side, said first side covered completely by said hardwood side and said second side covered completely by said softwood side;d) shaping said board to have a tongue on said first lateral edge and a groove on said second lateral edge; ande) shaping said board to have a chamfer on said first and second lateral edges. 12. A method as recited in claim 11, wherein said providing step further includes said first wood layer directly bonded to said second wood layer. 13. A method as recited in claim 11, wherein said milling step creates a plurality of transverse stiffening elements extending between said first lateral edge and said second lateral edge. 14. A method as recited in claim 11, wherein said embedding step includes filling each said hollow region with sound attenuating foam.
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이 특허에 인용된 특허 (14)
Kurrasch Andrew J. (Saugatuck MI), Acoustic panel.
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