Encapsulated cure systems are provided wherein a curative is incorporated into a solid or semi-solid carrier material whereby mere fracturing or failure of the capsule wall encapsulating such cure systems will not provide for or allow sufficient release of the curative. Also provided are adhesive sy
Encapsulated cure systems are provided wherein a curative is incorporated into a solid or semi-solid carrier material whereby mere fracturing or failure of the capsule wall encapsulating such cure systems will not provide for or allow sufficient release of the curative. Also provided are adhesive systems incorporating said encapsulated cure systems.
대표청구항▼
1. An encapsulated cure system for curable compositions comprising: a) a carrier material,b) a curative contained in said carrier material, andc) a polymer capsule encasing said carrier material wherein the curative is (i) non-reactive with the carrier material in the encapsulate state, (ii) entrapp
1. An encapsulated cure system for curable compositions comprising: a) a carrier material,b) a curative contained in said carrier material, andc) a polymer capsule encasing said carrier material wherein the curative is (i) non-reactive with the carrier material in the encapsulate state, (ii) entrapped or substantially non-migratory in the carrier material and (iii) present at a concentration of at least 0.1 weight percent based on the weight of the carrier material and wherein the carrier is a natural or synthetic material or composition that is non-flowing to the extent that sufficient curative necessary to effect polymerization of a curable composition is not made available without altering the carrier to a flowable state and/or applying mechanical forces to the carrier to work the carrier and thereby expose or make available more of the entrapped curvative, wherein the carrier material is selected from the group consisting of hot melts, pressure sensitive adhesives, rubber materials, elastomer/tackifier compositions, a polymer whose Tg is less than 35° C., semi-solid and solid resins, starches and starch-based polymers, hydrogels, low temperature waxes and a thickened or gel-like mass of one or more monomers, oligomers, prepolymers or combinations thereof. 2. The encapsulated cure system of claim 1 wherein the carrier material is (a) of a soft, putty-like or gel-like character or (b) a solid or semi-solid that is (i) soluble in a liquid curable matrix component of the curable composition with which they are to be used, (ii) softened by a liquid curable matrix component of the curable composition with which they are to be used, (iii) softened by the reaction conditions under which the curable composition with which they are to be used is cured or polymerized, (iv) softened by the environmental conditions under which the curable composition with which they are to be used is cured or polymerized, (v) is softened by the method or process by which the curative is to be made available to other components of the curable composition with which they are to be used, (vi) rendered flowable by a liquid curable matrix component of the curable composition with which they are to be used, (vii) rendered flowable by the reaction conditions under which the curable composition with which they are to be used is cured or polymerized, (viii) rendered flowable by the environmental conditions under which the curable composition is cured or polymerized, (ix) is rendered flowable by the method or process by which the curative is to be made available to other components of the curable composition with which they are to be used. 3. The encapsulated cure system of claim 2 wherein the carrier material is of a soft putty-like or gel-like character and comprises a thixotropic or thickened composition of monomers, oligomers or pre-polymers, or a combination thereof. 4. The encapsulated cure system of claim 3 wherein the carrier material includes or comprises one or more thixotropic agents or one or more thixotropic or non-thixotropic gelling or thickening agents that are generated in-situ or act latently concurrent with or following encapsulation of the carrier material. 5. The encapsulated cure system of claim 2 wherein the carrier material is an adhesive or has latent adhesive properties. 6. The encapsulated cure system of claim 1 wherein the carrier material does not flow or deform except when subjected to forces of at least 1 psi. 7. The encapsulated cure system of claim 1 wherein the curative is dispersed in the carrier. 8. The encapsulated cure system of claim 1 wherein the curative is dissolved in the carrier. 9. The encapsulated cure system of claim 8 wherein the curative and the carrier are miscible with one another. 10. The encapsulated cure system of claim 1 wherein the curative amounts to from about 0.1 wt. percent to about 25 wt. percent of the carrier material. 11. The encapsulated cure system of claim 1 wherein the curative is a cross-linking agent or hardener and the amount of the curative is from about 2 wt. percent to about 50 wt. percent of the carrier material. 12. The encapsulated cure system of claim 1 wherein the shell comprises from about 0.8 wt. percent to about 25 wt. percent of the encapsulated cure system. 13. A curable composition comprising one or more liquid polymerizable monomers, oligomers, prepolymers or a combination thereof and an encapsulated cure system said encapsulated cure system comprising: a) a carrier material,b) an effective amount of a curative contained in said carrier material suitable for effecting cure of the aforementioned liquid polymerizable material, andc) a polymer capsule encasing said carrier material wherein the curative is (i) non-reactive with the carrier material in the encapsulate state, (ii) entrapped or substantially non-migratory in the carrier material and (iii) present at a concentration of at least 0.1 weight percent based on the weight of the carrier material and wherein the carrier is a natural or synthetic material or composition that is non-flowing to the extent that sufficient curative necessary to effect polymerization of a curable composition is not made available without altering the carrier to a flowable state and/or applying mechanical forces to the carrier to work the carrier and thereby expose or make available more of the entrapped curative, wherein the carrier material is selected from the group consisting of hot melts, pressure sensitive adhesives, rubber materials, elastomer/tackifier compositions, a polymer whose Tg is less than 35° C., semi-solid and solid resins, starches and starch-based polymers, hydrogels, low temperature waxes and a thickened or gel-like mass of one or more monomers, oligomers, prepolymers or combinations thereof. 14. The encapsulated cure system of claim 13 wherein the carrier material is (a) of a soft, putty-like or gel-like character or (b) a solid or semi-solid that is (i) soluble in a liquid curable matrix component of the curable composition with which they are to be used, (ii) softened by a liquid curable matrix component of the curable composition with which they are to be used, (iii) softened by the reaction conditions under which the curable composition with which they are to be used is cured or polymerized, (iv) softened by the environmental conditions under which the curable composition with which they are to be used is cured or polymerized, (v) is softened by the method or process by which the curative is to be made available to other components of the curable composition with which they are to be used, (vi) rendered flowable by a liquid curable matrix component of the curable composition with which they are to be used, (vii) rendered flowable by the reaction conditions under which the curable composition with which they are to be used is cured or polymerized, (viii) rendered flowable by the environmental conditions under which the curable composition with which they are to be used is cured or polymerized, (ix) is rendered flowable by the method or process by which the curative is to be made available to other components of the curable composition with which they are to be used. 15. The curable composition of claim 13 wherein the encapsulated curative is dispersed in the liquid polymerizable component which further comprises a thickening agent or a thixotrope so that the encapsulated curative will remain suspended therein. 16. The curable composition of claim 13 wherein the liquid polymerizable material is selected from the group consisting of monomers, oligomers and/or prepolymers that undergo vinyl polymerization; unsaturated polyesters; urethanes; epoxy resins; polysulfides; isocyanates; silicones; polyethers, polyurethanes and polyolefins having silanol moieties capable of undergoing silanol condensation or hydrosilation reactions; and phenoxy resins. 17. An adhesive or sealant composition that is capable of being preapplied to a substrate comprising: a) an encapsulated cure system containing a curative andb) a separately encapsulated liquid curable composition, both encapsulated components (a) and (b) being dispersed inc) a binder for adhering the encapsulated components to the substrate to which they are to be applied; wherein the curative is present in an effective amount for effecting cure of the encapsulated liquid curable composition and wherein the encapsulated cure system comprises the aforementioned curative, a carrier material in which the curative is incorporated and a polymer capsule encasing said carrier material wherein the curative is (i) non-reactive with the carrier material in the encapsulate state, (ii) entrapped or substantially non-migratory in the carrier material and (iii) present at a concentration of at least 0.1 weight percent based on the weight of the carrier material and wherein the carrier is a natural or synthetic material or composition that is non-flowing to the extent that sufficient curative necessary to effect polymerization of a curable composition is not made available without altering the carrier to a flowable state and/or applying mechanical forces to the carrier to work the carrier and thereby expose or make available more of the entrapped curative, wherein the carrier material is selected from the group consisting of hot melts, pressure sensitive adhesives, rubber materials, elastomer/tackifier compositions, a polymer whose Tg is less than 35° C., semi-solid and solid resins, starches and starch-based polymers, hydrogels, low temperature waxes and a thickened or gel-like mass of one or more monomers, oligomers, prepolymers or combinations thereof. 18. The composition of claim 17 wherein the carrier material is (a) of a soft, putty-like or gel-like character or (b) a solid or semi-solid that is (i) soluble in a liquid curable matrix component of the curable composition with which they are to be used, (ii) softened by a liquid curable matrix component of the curable composition with which they are to be used, (iii) softened by the reaction conditions under which the curable composition with which they are to be used is cured or polymerized, (iv) softened by the environmental conditions under which the curable composition with which they are to be used is cured or polymerized, (v) is softened by the method or process by which the curative is to be made available to other components of the curable composition with which they are to be used, (vi) rendered flowable by a liquid curable matrix component of the curable composition with which they are to be used, (vii) rendered flowable by the reaction conditions under which the curable composition with which they are to be used is cured or polymerized, (viii) rendered flowable by the environmental conditions under which the curable composition with which they are to be used is cured or polymerized, (ix) is rendered flowable by the method or process by which the curative is to be made available to other components of the curable composition with which they are to be used. 19. The composition of claim 17 wherein the binder material is selected from the group consisting of (a) an adhesive or coating material in solution, (b) an aqueous based binder system, and (c) an actinic radiation curable composition. 20. The composition of claim 17 wherein the carrier material is of a soft putty-like or gel-like character and comprises a thixotropic or thickened composition of monomers, oligomers or pre-polymers, or a combination thereof, which composition is substantially non-reactive with the curative in the encapsulated state. 21. The composition of claim 17 wherein the liquid curable composition is selected from the group consisting of monomers, oligomers and/or prepolymers that undergo vinyl polymerization; unsaturated polyesters; urethanes; epoxy resins; polysulfides; isocyanates; silicones; polyethers, polyurethanes and polyolefins having silanol moieties capable of undergoing silanol condensation or hydrosilation reactions; and phenoxy resins.
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이 특허에 인용된 특허 (1)
Schwantes, Todd Arlin, In situ microencapsulated adhesive.
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