Elements for signal and/or power transmission into or to cabin components
원문보기
IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
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출원번호 |
US-0181623
(2011-07-13)
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등록번호 |
US-8800922
(2014-08-12)
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우선권정보 |
DE-10 2010 027 005 (2010-07-13) |
발명자
/ 주소 |
- Schmid, Frank
- Renz, Marc
- Knopp, Norbert
- Grabmann, Jürgen
- Völkle, Dietmar
- Klingseis, Markus
- Kuhnla, Wolf-Dieter
- Pätzold, Ralph
- Schevardo, Dirk-Achim
- Younes, Peter
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출원인 / 주소 |
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대리인 / 주소 |
Scully, Scott, Murphy & Presser, P.C.
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인용정보 |
피인용 횟수 :
0 인용 특허 :
2 |
초록
▼
The description covers cabin components for aircraft, which can be produced with a sandwich structure and may have the components 1003 for signal and/or power transmission. The cabin components in this case have at least two prepreg layers 1001, 1005 and, for example, a honeycomb layer 1002, which c
The description covers cabin components for aircraft, which can be produced with a sandwich structure and may have the components 1003 for signal and/or power transmission. The cabin components in this case have at least two prepreg layers 1001, 1005 and, for example, a honeycomb layer 1002, which can be connected to one another by pressing and heating. Furthermore, electrical and/or optical signal paths are shown on cabin components, which can be produced by positioning them there or printing. In addition, according to the description, signal and/or power transmission can take place beyond the boundary of cabin components, by means of a transmitter/receiver path.
대표청구항
▼
1. A method for fitting a cabin component for an aircraft, comprising the following steps: providing a sandwich structure comprising a first honeycomb for mechanical stiffening, a second honeycomb below the first honeycomb, a first prepreg layer above the first honeycomb and a second prepreg layer b
1. A method for fitting a cabin component for an aircraft, comprising the following steps: providing a sandwich structure comprising a first honeycomb for mechanical stiffening, a second honeycomb below the first honeycomb, a first prepreg layer above the first honeycomb and a second prepreg layer below the second honeycomb,providing a component which transmits optical signals, electrical signals or power between the first honeycomb and the second honeycomb, andheating and pressing the sandwich structure for curing the sandwich structure with the component between the first honeycomb and the second honeycomb. 2. The method according to claim 1, wherein the component is arranged within a housing. 3. The method according to claim 1, wherein an elastomer film for vibration damping is arranged between the first honeycomb and the second honeycomb. 4. The method according to claim 1, wherein the component comprises at least one of an electronic circuit, a printed circuit board, an electrical conductor track, an optical waveguide and a plug connector. 5. A cabin component for an aircraft, comprising: a sandwich structure comprising a first honeycomb for mechanical stiffening, a second honeycomb below the first honeycomb, a first prepreg layer above the first honeycomb and a second prepreg layer below the second honeycomb, anda component which transmits optical signals, electrical signals or power, said component disposed between the first honeycomb and the second honeycomb,wherein the sandwich structure is heated and pressed for curing the sandwich structure with the component between the first honeycomb and the second honeycomb.
이 특허에 인용된 특허 (2)
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Adee James M. (San Diego CA), Buried element deicer.
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Rose Philip M. (Chula Vista CA) Riel Frank J. (San Diego CA), Method of manufacturing double layer attenuation panel with two layers of linear type material.
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