IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
|
| 국제특허분류(IPC7판) |
|
| 출원번호 |
US-0615271
(2012-09-13)
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| 등록번호 |
US-8802970
(2014-08-12)
|
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발명자
/ 주소 |
- Merchant, Nazarali
- Shaikh, Aziz S.
- Sridharan, Srinivasan
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| 출원인 / 주소 |
- Heraeus Precious Metals North America Conshohocken LLC
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| 대리인 / 주소 |
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| 인용정보 |
피인용 횟수 :
0 인용 특허 :
33 |
초록
▼
Formulations and methods of making solar cell contacts and cells therewith are disclosed. The invention provides a photovoltaic cell comprising a front contact, a back contact, and a rear contact. The back contact comprises, prior to firing, a passivating layer onto which is applied a paste, compris
Formulations and methods of making solar cell contacts and cells therewith are disclosed. The invention provides a photovoltaic cell comprising a front contact, a back contact, and a rear contact. The back contact comprises, prior to firing, a passivating layer onto which is applied a paste, comprising aluminum, a glass component, wherein the aluminum paste comprises, aluminum, another optional metal, a glass component, and a vehicle. The back contact comprises, prior to firing, a passivating layer onto which is applied an aluminum paste, wherein the aluminum paste comprises aluminum, a glass component, and a vehicle.
대표청구항
▼
1. A method of making a photovoltaic cell comprising: a. providing a silicon wafer having a first side and a second side,b. applying a phosphorus source to the first side of the silicon wafer,c. firing the wafer to form a phosphorus glass layer on the first side of the silicon wafer,d. removing at l
1. A method of making a photovoltaic cell comprising: a. providing a silicon wafer having a first side and a second side,b. applying a phosphorus source to the first side of the silicon wafer,c. firing the wafer to form a phosphorus glass layer on the first side of the silicon wafer,d. removing at least a portion of the phosphorus glass layer from the first side of the silicon wafer,e. polishing the second side of the silicon wafer,f. applying a passivating layer to the first and second sides of the wafer,g. applying to the first side a silver paste comprising, prior to firing, i. silver,ii. a glass component, andiii. a vehicle,h. applying to the second side an aluminum paste comprising, prior to firing, i. aluminum,ii. a glass component, andiii. a vehicle,wherein (g) and (h) can be performed in any order, andi. firing the wafer for a time and temperature sufficient to adhere the silver to the front side and the aluminum to the back side, thereby forming front and back contacts. 2. The method of claim 1, wherein the aluminum paste further comprises a metal selected from the group consisting of magnesium, nickel, titanium, potassium, vanadium, copper, and combinations thereof. 3. The method of claim 1, wherein the aluminum paste further comprises a metal selected from the group consisting of palladium, silver, platinum, gold, and combinations thereof. 4. The method of claim 1, wherein the aluminum paste further comprises a metal selected from the group consisting of boron, gallium, indium, and combinations thereof. 5. The method of claim 1, wherein the aluminum paste further comprises a metal selected from the group consisting of zinc, tin, indium, antimony and combinations thereof. 6. The method of claim 2, wherein the aluminum paste comprises about 40 to about 80 wt % aluminum and about 1 to about 50 wt % nickel. 7. The method of claim 2, wherein the aluminum paste comprises about 40 to about 80 wt % aluminum and about 1 to about 50 wt % magnesium. 8. The method of claim 3, wherein the aluminum paste comprises about 40 to about 80 wt % aluminum and about 0.1 to about 50 wt % silver. 9. The method of claim 4, wherein the aluminum paste comprises about 40 to about 80 wt % aluminum and about 0.5 to about 50 wt % boron.
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