초록 ▼

A heat sink and method for gaseous cooling of superconducting power devices. Heat sink is formed of a solid material of high thermal conductivity and attached to the area needed to be cooled. Two channels are connected to the heat sink to allow an inlet and an outlet for cryogenic gaseous coolant. I

A heat sink and method for gaseous cooling of superconducting power devices. Heat sink is formed of a solid material of high thermal conductivity and attached to the area needed to be cooled. Two channels are connected to the heat sink to allow an inlet and an outlet for cryogenic gaseous coolant. Inside the hollow heat sink are fins to increase metal surface in contact with the coolant. The coolant enters through the inlet tube, passes through the finned area inside the heat sink and exits through the outlet tube.

대표청구항 ▼

1. A method of maintaining an operating cryogenic temperature range of a low temperature system, comprising the steps of: coupling an attachment surface of a heat intercept to a temperature-critical aspect of said low temperature system, said attachment surface conforming to the shape of said temper

1. A method of maintaining an operating cryogenic temperature range of a low temperature system, comprising the steps of: coupling an attachment surface of a heat intercept to a temperature-critical aspect of said low temperature system, said attachment surface conforming to the shape of said temperature-critical aspect, said attachment surface formed of a heat conductive material,said heat intercept including a heat sink, an inlet channel, and an outlet channel, said inlet channel and said outlet channel extending away from said heat sink, said heat sink positioned in abutting relation to said temperature-critical aspect of said low temperature system,said heat sink having a first interior with a plurality of fins affixed therewithin, said inlet channel having a second interior, said outlet channel having a third interior,said first interior of said heat sink being in open communication with said second interior of said inlet channel, said first interior of said heat sink being in open communication with said third interior of said outlet channel; andinjecting a cryogenic gaseous medium into said inlet channel, wherein said cryogenic gaseous medium enters said heat sink through said inlet channel and exits said heat sink through said outlet channel,wherein said cryogenic gaseous medium has a higher temperature when exiting said heat sink than when entering said heat sink. 2. A method as in claim 1, further comprising: said low temperature system being a superconducting power device. 3. A method as in claim 1, further comprising the step of: recirculating said cryogenic gaseous medium after exiting said heat sink through said outlet channel, such that said recirculated cryogenic gaseous medium can reenter said heat sink through said inlet channel. 4. A method as in claim 1, further comprising: said inlet channel positioned in angled relation to said heat sink, andsaid outlet channel positioned in angled relation to said heat sink. 5. A method as in claim 1, further comprising: said heat sink having a first end and a second end, said inlet channel extending from said first end if said heat sink, said outlet channel extending from said second end of said heat sink,wherein said inlet channel, said heat sink, and said outlet channel are parallel to one another. 6. A method as in claim 1, further comprising: said attachment surface being planar. 7. A method as in claim 1, further comprising: said plurality of fins each extending from said attachment surface into said first interior of said heat sink. 8. A method as in claim 1, further comprising: positioning a vacuum chamber around said temperature-critical aspect of said low temperature system and said attachment surface of said heat intercept in order to reduce heat transfer from ambient. 9. A method of maintaining an operating cryogenic temperature range of a low temperature superconducting system, comprising the steps of: coupling a planar attachment surface of a heat intercept to a temperature-critical aspect of said low temperature system, said attachment surface conforming to the shape of said temperature-critical aspect, said attachment surface formed of a heat conductive material,said heat intercept including a heat sink, an inlet channel, and an outlet channel, said inlet channel and said outlet channel extending away from said heat sink, said heat sink positioned in abutting relation to said temperature-critical aspect of said low temperature system,said heat sink having a first interior with a plurality of fins affixed to and extending from said attachment surface into said first interior of said heat sink, said inlet channel having a second interior, said outlet channel having a third interior,said first interior of said heat sink being in open communication with said second interior of said inlet channel, said first interior of said heat sink being in open communication with said third interior of said outlet channel,said heat sink having a first end and a second end, said inlet channel extending from said first end if said heat sink, said outlet channel extending from said second end of said heat sink, wherein said inlet channel, said heat sink, and said outlet channel are parallel to one another;injecting a cryogenic gaseous medium into said inlet channel, wherein said cryogenic gaseous medium enters said heat sink through said inlet channel and exits said heat sink through said outlet channel,wherein said cryogenic gaseous medium has a higher temperature when exiting said heat sink than when entering said heat sink; andrecirculating said cryogenic gaseous medium after exiting said heat sink through said outlet channel, such that said recirculated cryogenic gaseous medium can reenter said heat sink through said inlet channel. 10. A heat intercept, comprising: a heat sink having an attachment surface for coupling to a temperature-critical aspect of a low temperature system, said attachment surface having a shape conforming to the shape of said temperature-critical aspect, said attachment surface formed of a heat conductive material,said heat sink further having a first interior and a plurality of fins affixed within said first interior;an inlet channel coupled to said heat sink and extending away from said heat sink, said inlet channel having a second interior configured for the flow of a cryogenic gaseous medium;an outlet channel coupled to said heat sink and extending away from said heat sink, said outlet channel having a third interior configured for the flow of said cryogenic gaseous medium,said first interior of said heat sink being in open communication with said second interior of said inlet channel, said first interior of said heat sink being in open communication with said third interior of said outlet channel,wherein said cryogenic gaseous medium enters said heat sink through said inlet channel and exits said heat sink through said outlet channel,wherein said cryogenic gaseous medium has a higher temperature when exiting said heat sink than when entering said heat sink. 11. A heat intercept as in claim 10, further comprising: said low temperature system being a superconducting power device. 12. A heat intercept as in claim 10, further comprising: a gas recirculation system coupled to said inlet channel and said outlet channel for receiving said cryogenic gaseous medium from said outlet channel and subsequently recycling and cooling said cryogenic gaseous medium for reentry into said inlet channel. 13. A heat intercept as in claim 10, further comprising: said inlet channel positioned in angled relation to said heat sink, andsaid outlet channel positioned in angled relation to said heat sink. 14. A heat intercept as in claim 10, further comprising: said heat sink having a first end and a second end, said inlet channel extending from said first end if said heat sink, said outlet channel extending from said second end of said heat sink,wherein said inlet channel, said heat sink, and said outlet channel are parallel to one another. 15. A heat intercept as in claim 10, further comprising: said attachment surface being planar. 16. A heat intercept as in claim 10, further comprising: said plurality of fins each extending from said attachment surface into said first interior of said heat sink. 17. A heat intercept as in claim 10, further comprising: a vacuum chamber disposed in surrounding relation to said temperature-critical aspect of said low temperature system and said attachment surface of said heat intercept in order to reduce heat transfer from ambient.