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특허 상세정보

Systems and methods for composite structures with embedded interconnects

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05K-001/00    H05K-001/03    H05K-003/46    H05K-003/00    H05K-001/02    H05K-001/05   
미국특허분류(USC) 174/254; 164/262
출원번호 US-0539677 (2012-07-02)
등록번호 US-8809689 (2014-08-19)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Cantor Colburn LLP
인용정보 피인용 횟수 : 1  인용 특허 : 58
초록

A composite interconnect assembly includes a body structure formed from a composite material (e.g., a carbon graphite material) with one or more conductive traces embedded therein (e.g., a copper or copper alloy). One or more contact regions are provided such that the conductive traces are exposed and are configured to mechanically and electrically connect to one or more electronic components. The body structure may have a variety of shapes, including planar, cylindrical, conical, and the like.

대표
청구항

1. A composite interconnect assembly, comprising: a generally tubular, composite body structure comprising layers of two or more constituent materials having different physical and chemical properties;a conductive trace embedded within the composite body structure at a border between the layers, the conductive trace traversing the border such that a portion of the conductive trace only partially intrudes into and forms at least three contact surfaces with one of the layers and an opposite portion of the conductive trace only partially intrudes into and f...

이 특허에 인용된 특허 (58)

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