초록 ▼

An electroless plating pretreatment agent that can retain stably Pd(II) over a long period of time in an organic solvent, an electroless plating method using the same that is capable of forming an electroless plated film having excellent adhesion, and an electroless plated object. The electroless pl

An electroless plating pretreatment agent that can retain stably Pd(II) over a long period of time in an organic solvent, an electroless plating method using the same that is capable of forming an electroless plated film having excellent adhesion, and an electroless plated object. The electroless plating pretreatment agent contains an organic palladium compound and a coordination compound having a functional group with a metal-capturing capability dissolved in an organic solvent, the coordination compound being selected from the group consisting of the imidazole analogs, polyethyleneamines, ethyleneimines and polyethyleneimines.

대표청구항 ▼

1. An electroless plating pretreatment agent consisting of an organic palladium compound and a coordination compound having a functional group with a metal-capturing capability dissolved in an organic solvent, in which the coordination compound is selected from the group consisting of imidazole anal

1. An electroless plating pretreatment agent consisting of an organic palladium compound and a coordination compound having a functional group with a metal-capturing capability dissolved in an organic solvent, in which the coordination compound is selected from the group consisting of imidazole analogs, polyethyleneamines, ethyleneimines and polyethyleneimines and the coordination compound is added in an amount of 0.01 mole to 5 moles per 1 mole of the organic palladium compound, wherein the imidazole analogs is a compound represented by Formula (1) below: where R1, R2, R3 and R4 each represent hydrogen, a lower alkyl or a phenyl group. 2. The electroless plating pretreatment agent according to claim 1, wherein the compound represented by Formula (I) is selected from the group consisting of imidazole, 1-methylimidazole, 2-methylimidazole, 2-phenylimidazole, 1,2-dimethylimidazole and 2,4-dimethylimidazole. 3. The electroless plating pretreatment agent according to claim 1, wherein the organic palladium compound is selected from the group consisting of palladium naphthenate, acetylacetone palladium and a fatty acid palladium compound with 5 to 25 carbon atoms. 4. The electroless plating pretreatment agent according to claim 3, wherein the fatty acid palladium compound with 5 to 25 carbon atoms is palladium neodecanoate, palladium octylate, palladium heptanoate or palladium pentadecanoate. 5. An ink composition containing the electroless plating pretreatment agent according to claim 1. 6. An electroless plating method, comprising pretreating an object to be plated with the electroless plating pretreatment agent described in claim 1 and then electroless plating. 7. A plated object obtained by the electroless plating method according to claim 6. 8. An electroless plating method, comprising pretreating an object to be plated with the ink composition described in claim 5 and then electroless plating. 9. The electroless plating method according to claim 8, wherein pretreating the object to be plated comprises a step of forming a fine line pattern on the object by drawing with the ink composition containing the electroless plating pretreatment agent. 10. A plated object obtained by the electroless plating method according to claim 8.