Vortex-based temperature control system and method
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F25B-009/02
G05D-023/00
출원번호
US-0147366
(2008-06-26)
등록번호
US-8820095
(2014-09-02)
발명자
/ 주소
Lessig, Ken
Cronk, Kevin
O'Malley, Brian
Swain, Matt
Sundaram, Ramesh
출원인 / 주소
Finisar Corporation
대리인 / 주소
Maschoff Brennan
인용정보
피인용 횟수 :
0인용 특허 :
4
초록▼
A vortex-based temperature control system comprises a test chamber configured to receive a test article therein, a sensor disposed within the test chamber for detecting a temperature within the test chamber, a first vortex tube coupled to the test chamber for providing a heating airflow to the test
A vortex-based temperature control system comprises a test chamber configured to receive a test article therein, a sensor disposed within the test chamber for detecting a temperature within the test chamber, a first vortex tube coupled to the test chamber for providing a heating airflow to the test chamber, and a second vortex tube coupled to the test chamber for providing a cooling airflow to the test chamber. The system also comprises a temperature controller coupled to the sensor and configured to control an airflow delivered to the first and second vortex tubes to obtain a desired temperature setting within the test chamber.
대표청구항▼
1. A vortex-based temperature control system, comprising: a chamber that at least partially encloses an optical transceiver or vertical cavity surface emitting laser (VCSEL) to be tested;a printed circuit board to which the optical transceiver or VCSEL is mounted, wherein the printed circuit board i
1. A vortex-based temperature control system, comprising: a chamber that at least partially encloses an optical transceiver or vertical cavity surface emitting laser (VCSEL) to be tested;a printed circuit board to which the optical transceiver or VCSEL is mounted, wherein the printed circuit board is configured to enable operation of the optical transceiver or VCSEL while the optical transceiver or VCSEL is at least partially enclosed within the chamber;a sensor disposed within the chamber for detecting a temperature within the chamber;a first vortex tube coupled to the chamber for providing a heating airflow to the chamber;a second vortex tube coupled to the chamber for providing a cooling airflow to the chamber;an air supply coupled to the first and second vortex tubes, wherein the air supply comprises: a booster configured to increase a pressure of an airflow deliverable to the first and second vortex tubes;a capacity tank coupled to receive an output of the booster and configured to store pressurized gas; anda pressure regulator coupled to receive an output of the capacity tank and configured to control the pressure of the airflow released downstream to the first and second vortex tubes; anda temperature controller coupled to the sensor and configured to control an airflow delivered to the first and second vortex tubes to obtain a desired temperature setting within the chamber. 2. The system of claim 1, further comprising at least one airflow control device controllable by the temperature controller to regulate an airflow delivered to at least one of the first and second vortex tubes. 3. The system of claim 1, further comprising a plurality of solenoid valves coupled to the temperature controller and each respectively coupled to the first and second vortex tubes, wherein actuation of at least one of the plurality of solenoid valves is controlled by the temperature controller to control the airflow delivered to the respective first and second vortex tubes. 4. The system of claim 1, further comprising a mass flow controller coupled to the temperature controller and controllable by the temperature controller to vary an airflow rate deliverable to at least one of the first and second vortex tubes. 5. The system of claim 1, further comprising a pressure controller coupled to the temperature controller and controllable by the temperature controller to control a volume of airflow deliverable to at least one of the first and second vortex tubes. 6. The system of claim 1, further comprising a plurality of pressure controllers coupled to the temperature controller and each respectively coupled to the first and second vortex tubes, wherein the temperature controller is configured to control the plurality of pressure controllers to control the airflow delivered to the respective first and second vortex tubes. 7. The system of claim 1, further comprising a mixing valve actuatable to control the airflow delivered to the first and second vortex tubes. 8. The system of claim 1, wherein the temperature controller is configured to control airflow delivered to the first and second vortex tubes to change a temperature within the chamber between an above-ambient temperature and a below-ambient temperature without cessation of testing the optical transceiver or VCSEL within the chamber. 9. The system of claim 1, wherein the temperature controller is configured to control airflow delivered to the first and second vortex tubes to change a temperature within the chamber between an above-ambient temperature and a below-ambient temperature without opening the chamber. 10. The system of claim 1, wherein the temperature controller comprises a proportional-integral-derivative (PI D) controller. 11. The system of claim 1, further comprising at least one muffler coupled to at least one of the first and second vortex tubes. 12. The system of claim 1, further comprising a chilling device disposed upstream along an airflow path from the second vortex tube. 13. A vortex-based temperature control system, comprising: a chamber that at least partially encloses an optical transceiver or vertical cavity surface emitting laser (VCSEL) to be tested;a printed circuit board to which the optical transceiver or VCSEL is mounted, wherein the printed circuit board is configured to enable operation of the optical transceiver or VCSEL while the optical transceiver or VCSEL is at least partially enclosed within the chamber;a sensor directly exposed to air within the chamber for detecting a temperature of the air within the chamber;a vortex tube coupled to the chamber for providing an airflow to the chamber, the airflow comprising a heating airflow;an air supply coupled to the vortex tube, wherein the air supply comprises: a booster configured to increase a pressure of the airflow deliverable to the vortex tube;a capacity tank coupled to receive an output of the booster and configured to store pressurized gas; anda pressure regulator coupled to receive an output of the capacity tank and configured to control the pressure of the airflow released downstream to the vortex tube;a pressure controller located within an airflow path between the air supply and the vortex tube; anda temperature controller coupled to the sensor and the pressure controller, the temperature controller configured to control the pressure controller to control a rate of airflow delivered to the vortex tube to obtain a desired temperature setting within the chamber. 14. The system of claim 13, further comprising a valve disposed in the airflow path between the pressure controller and the vortex tube, the temperature controller configured to control actuation of the valve for providing an airflow to the vortex tube. 15. The system of claim 13, wherein an inlet to the vortex tube is coupled to an outlet of another vortex tube. 16. The system of claim 13, wherein the temperature controller comprises a proportional-integral-derivative (PI D) controller. 17. The system of claim 13, further comprising a chilling device disposed upstream along an airflow path from the vortex tube. 18. A vortex-based temperature control system, comprising: a chamber that at least partially encloses an optical transceiver or vertical cavity surface emitting laser (VCSEL) to be tested;a printed circuit board to which the optical transceiver or VCSEL is mounted, wherein the printed circuit board is configured to enable operation of the optical transceiver or VCSEL while the optical transceiver or VCSEL is at least partially enclosed within the chamber;a sensor directly exposed to air within the chamber for detecting a temperature of the air within the chamber;a vortex tube coupled to the chamber for providing an airflow to the test chamber, the airflow comprising a heating airflow;an air supply coupled to the vortex tube, wherein the air supply comprises: a booster configured to increase a pressure of the airflow deliverable to the vortex tube;a capacity tank coupled to receive an output of the booster and configured to store pressurized gas; anda pressure regulator coupled to receive an output of the capacity tank and configured to control the pressure of the airflow released downstream to the vortex tube;a mass flow controller located within an airflow path between the air supply and the vortex tube; anda temperature controller coupled to the sensor and the mass flow controller, the temperature controller configured to control the mass flow controller to control a rate of airflow delivered to the vortex tube to obtain a desired temperature setting within the chamber. 19. The system of claim 18, further comprising a valve disposed in the airflow path between the mass flow controller and the vortex tube, the temperature controller configured to control actuation of the valve for providing an airflow to the vortex tube. 20. The system of claim 18, wherein an inlet to the vortex tube is coupled to an outlet of another vortex tube. 21. The system of claim 18, wherein the temperature controller comprises a proportional-integral-derivative (PID) controller. 22. The system of claim 18, further comprising a chilling device disposed upstream along an airflow path from the vortex tube.
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이 특허에 인용된 특허 (4)
Nihad Dukhan ; Mark Cress ; Michael R. Cosley, Cooling and heating system for an equipment enclosure using a vortex tube.
Chaparro John J. (San Diego CA) De Kreek Dirk (Thousand Oaks CA) Holdaway Charles R. (San Diego CA), Environmental response control apparatus and method.
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