초록 ▼

According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible h

According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material.

대표청구항 ▼

1. A thermally-conductive interface assembly comprising a perforated thermally-conductive sheet having first and second sides and one or more perforations extending through the perforated thermally-conductive sheet from the first side to the second side, the perforated thermally-conductive sheet san

1. A thermally-conductive interface assembly comprising a perforated thermally-conductive sheet having first and second sides and one or more perforations extending through the perforated thermally-conductive sheet from the first side to the second side, the perforated thermally-conductive sheet sandwiched between first and second layers of thermal interface material, which comprises non-phase change gap filler that is conformable to mating surfaces such that the first and second layers of thermal interface material are respectively conformable to one of the mating surfaces of at least one heat generating component of an electronic device and one of the mating surfaces of a heat dissipating member, wherein each of the first and second layers of thermal interface material has a layer thickness greater than a thickness of the perforated thermally-conductive sheet; wherein: the perforated thermally-conductive sheet comprises a flexible graphite sheet; andthe thermal interface material comprises thermally-conductive polymer that encapsulates the flexible graphite sheet, covers the one or more perforations, and forms a polymer-to-polymer bond through the one or more perforations, whereby the polymer-to-polymer bond helps mechanically bond the first and second layers to the flexible graphite sheet and helps provide heat conduction between the first and second layers. 2. The thermally-conductive interface assembly of claim 1, wherein a portion of the thermal interface material is disposed within the one or more perforations, and helps form a thermally-conductive pathway between the first and second layers, and wherein the thermal interface material comprises elastomer and at least one thermally-conductive metal, boron nitride, and/or ceramic filler, such that the thermal conductivity is at least 1.2 Watts per meter per Kelvin and such that the thermal interface material is conformable even without undergoing a phase change or reflow. 3. A thermally-conductive interface assembly comprising a perforated thermally-conductive sheet having first and second sides and one or more perforations extending through the perforated thermally-conductive sheet from the first side to the second side, the perforated thermally-conductive sheet sandwiched between first and second layers of thermal interface material, which comprises non-phase change gap filler that is conformable to mating surfaces such that the first and second layers of thermal interface material are respectively conformable to one of the mating surfaces of at least one heat generating component of an electronic device and one of the mating surfaces of a heat dissipating member, wherein each of the first and second layers of thermal interface material has a layer thickness greater than a thickness of the perforated thermally-conductive sheet; wherein the perforated thermally-conductive sheet comprises particles of intercalated and exfoliated graphite flakes formed into a flexible graphite sheet, wherein the perforations allow the thermal interface material to flow through the perforations whereby the thermal interface material fills the perforations and establishes a mechanical bond between the first and second layers through the perforations, and wherein the thermal interface material is softer and/or more conformable than the flexible graphite sheet. 4. The thermally-conductive interface assembly of claim 3, wherein the thermal interface material comprises thermally-conductive polymer that encapsulates the flexible graphite sheet, covers the one or more perforations, and forms a polymer-to-polymer bond through the one or more perforations, whereby the polymer-to-polymer bond helps mechanically bond the first and second layers to the flexible graphite sheet and helps provide heat conduction between the first and second layers. 5. The thermally-conductive interface assembly of claim 1, wherein the thermal interface material comprises a thermally conductive polymer gap filler pad having a thermal conductivity of at least 1.2 Watts per meter per Kelvin. 6. The thermally-conductive interface assembly of claim 1, wherein the first layer is formed from a different thermal interface material than the second layer. 7. The thermally-conductive interface assembly of claim 1, wherein the thermal interface material comprises elastomer and at least one thermally-conductive metal, boron nitride, and/or ceramic filler. 8. The thermally-conductive interface assembly of claim 1, wherein the thermally-conductive interface assembly further includes a metal foil layer disposed on the outer surface of the second layer of thermal interface material. 9. An electronic device including the thermally-conductive interface assembly of claim 1, wherein the thermal interface material has a thermal conductivity of at least 1.2 Watts per meter per Kelvin. 10. The thermally-conductive interface assembly of claim 1, wherein the thermal interface material comprises a soft thermal interface material that is conformable even without undergoing a phase change or reflow. 11. The thermally-conductive interface assembly of claim 10, wherein the soft thermal interface material comprises thermally-conductive polymer gap filler. 12. The thermally-conductive interface assembly of claim 10, wherein: the first layer of soft thermal interface material provides a thermally-conductive path between the flexible graphite sheet and an outer surface of the first layer of soft thermal interface material that is intended to contact one or more electronic components;the flexible graphite sheet laterally spreads heat therein; andthe second layer of soft thermal interface material provides a thermally-conductive path from the flexible graphite sheet to an outer surface of the second layer of soft thermal interface material. 13. The thermally-conductive interface assembly of claim 10, wherein the flexible graphite sheet comprises particles of intercalated and exfoliated graphite flakes formed into a flexible graphite sheet. 14. The thermally-conductive interface assembly of claim 10, wherein the flexible graphite sheet comprises particles of intercalated and exfoliated graphite flakes formed into a flexible graphite sheet having one or more perforations. 15. The thermally-conductive interface assembly of claim 10, wherein the soft thermal interface material comprises elastomer and at least one thermally-conductive metal, boron nitride, and/or ceramic filler, such that the thermal conductivity is at least 1.2 Watts per meter per Kelvin. 16. The thermally-conductive interface assembly of claim 10, wherein: the thermally-conductive interface assembly further includes a metal foil layer disposed on the outer surface of the second layer of soft thermal interface material; and/orthe first layer is formed from a different thermal interface material than the second layer. 17. An electronic device including the thermally-conductive interface assembly of claim 10, wherein the soft thermal interface material comprises elastomer and at least one thermally-conductive metal, boron nitride, and/or ceramic filler, such that the thermal conductivity is at least 1.2 Watts per meter per Kelvin. 18. The thermally-conductive interface assembly of claim 1 suitable for use in dissipating or transferring heat from one or more heat generating components of a circuit board, whereby the thermal interface material provides at least a portion of a thermally-conductive path between the flexible graphite sheet and the one or more heat-generating components when the thermally-conductive interface assembly is positioned relative to the circuit board such that the first layer of thermal interface material is in contact with and conforms to an outer surface portion of at least one of the one or more heat generating components. 19. The thermally-conductive interface assembly of claim 18, wherein the thermal interface material comprising elastomer and at least one thermally-conductive metal, boron nitride, and/or ceramic filler. 20. The thermally-conductive interface assembly of claim 18, further comprising a metal foil layer disposed over the second layer of thermal interface material for helping to protect said second layer of thermal interface material. 21. An electronic device including a circuit board having one or more electronic components and the thermally-conductive interface assembly of claim 18, wherein the non-phase change gap filler is in contact with and in relatively close conformance to an outer surface portion of the one or more heat generating components, and wherein the thermal interface material comprises elastomer and at least one thermally-conductive metal, boron nitride, and/or ceramic filler, such that the thermal conductivity is at least 1.2 Watts per meter per Kelvin and such that the thermal interface material is conformable even without undergoing a phase change or reflow.