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A process for fabricating hollow metal shells such as Be or Al filled with a selected gas such as D or T. An organic preform is coated with a slurry of organic binder and metal powder of Be or Al. The coated preform is heated to remove the preform and any organics to form a hollow shell which is the

A process for fabricating hollow metal shells such as Be or Al filled with a selected gas such as D or T. An organic preform is coated with a slurry of organic binder and metal powder of Be or Al. The coated preform is heated to remove the preform and any organics to form a hollow shell which is then fired at an elevated temperature in a gas so as to seal the shell and capture the gas inside the sealed shell.

대표청구항 ▼

1. A process of fabricating a hollow beryllium shell which comprises preparing a slurry of a binder and beryllium powder, coating an organic preform with the slurry, heating the preform so as to remove organics in the preform to achieve a hollow shell of beryllium, and firing the hollow beryllium sh

1. A process of fabricating a hollow beryllium shell which comprises preparing a slurry of a binder and beryllium powder, coating an organic preform with the slurry, heating the preform so as to remove organics in the preform to achieve a hollow shell of beryllium, and firing the hollow beryllium shell in an essentially deuterium atmosphere at an elevated temperature and elevated pressure. 2. The process of claim 1 wherein the firing step occurs in an essentially deuterium atmosphere at a pressure of about 85 to about 110 atmospheres at a temperature of about 1000° C. to about 1300° C. 3. The process of claim 1 wherein the organic preform is removed through pyrolization at a temperature below about 500° C. 4. The process of claim 3 wherein the organic preform is removed through pyrolization at a temperature below about 450° C. 5. The process of claim 4 wherein the organic preform is removed through pyrolization at a temperature below about 425° C. 6. The process of claim 1 wherein the organic preform pyrolizes at a temperature below about 500° C. 7. The process of claim 6 wherein the organic preform pyrolizes at a temperature below about 450° C. 8. The process of claim 7 wherein the preform organics pyrolize at temperature below about 425° C. 9. The process of claim 1 wherein the binder pyrolizes at a temperature below about 500° C. 10. The process of claim 9 wherein the binder pyrolizes at a temperature below about 450° C. 11. The process of claim 10 wherein the binder pyrolizes at a temperature below about 425° C. 12. A process of fabricating a hollow beryllium shell which comprises preparing a slurry of a binder and beryllium powder, coating an organic preform with the slurry, heating the preform so as to remove organics in the preform to achieve a hollow shell of beryllium, and firing the hollow beryllium shell at an elevated temperature, said firing of the hollow shell being in an inert gas atmosphere, a pressurized gas being added to the shell through a hole in the shell, said hole being filled to encapsulate the gas at a pressure above atmospheric. 13. The process of claim 12 wherein the organic preform is removed through pyrolization at a temperature below about 500° C. 14. The process of claim 12 wherein the firing step occurs in an inert atmosphere at a pressure of about 85 to about 110 atmospheres at a temperature of about 1000° C. to about 1300° C. 15. The process of claim 12 wherein the organic preform is removed through pyrolization at a temperature below about 500° C. 16. The process of claim 15 wherein the organic preform is removed through pyrolization at a temperature below about 450° C. 17. The process of claim 16 wherein the organic preform is removed through pyrolization at a temperature below about 425° C. 18. The process of claim 12 wherein the organic preform pyrolizes at a temperature below about 500° C. 19. The process of claim 18 wherein the organic preform pyrolizes at a temperature below about 450° C. 20. The process of claim 19 wherein the preform organics pyrolize at temperature below about 425° C. 21. The process of claim 12 wherein the binder pyrolizes at a temperature below about 500° C. 22. The process of claim 21 wherein the binder pyrolizes at a temperature below about 450° C. 23. The process of claim 22 wherein the binder pyrolizes at a temperature below about 425° C.