$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Micromachined resonant magnetic field sensors 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01R-033/02
  • G01R-033/028
  • G01R-033/038
출원번호 US-0004365 (2011-01-11)
등록번호 US-8860409 (2014-10-14)
발명자 / 주소
  • Seeger, Joseph
  • Lo, Chiung C.
  • Cagdaser, Baris
  • Shaeffer, Derek
출원인 / 주소
  • Invensense, Inc.
대리인 / 주소
    Sawyer Law Group, P.C.
인용정보 피인용 횟수 : 2  인용 특허 : 73

초록

A micromachined magnetic field sensor is disclosed. The micromachined magnetic field comprises a substrate; a drive subsystem, the drive subsystem comprises a plurality of beams, and at least one anchor connected to the substrate; a mechanism for providing an electrical current through the drive sub

대표청구항

1. A micromachined magnetic field sensor comprising: a substrate;a drive subsystem, the drive subsystem comprises a plurality of beams, and at least one anchor connected to the substrate; a mechanism for providing an electrical current through the drive subsystem along a first axis; and Lorentz forc

이 특허에 인용된 특허 (73)

  1. Funk Karsten,DEX ; Laermer Franz,DEX ; Elsner Bernhard,DEX ; Frey Wilhelm,DEX, Acceleration sensing device.
  2. Touge Hiroshi,JPX, Angular rate sensor.
  3. Huang Yongli ; Lim Martin ; Haniff Tariq M. ; Yun Weijie, Angular rate sensor made from a structural wafer of single crystal silicon.
  4. Schepis Dominic J. (Wappingers Falls NY) Srikrishnan Kris V. (Wappingers Falls NY) Subbanna Seshadri (Hopewell Junction NY) Tejwani Manu J. (Yorktown Heights NY), Antifuse element with electrical or optical programming.
  5. Shiratori,Norihiko; Ichikawa,Kazutoyo; Tamura,Hideki; Izawa,Yuji; Terashima,Masaki, Body motion detector.
  6. Kaiser William J. (Los Angeles CA) Pister Kristofer S. J. (Pacific Palisades CA) Stafsudd Oscar M. (Los Angeles CA) Nelson Phyllis R. (Mar Vista CA) Burstein Amit (N. Hollywood CA), CMOS integrated microsensor with a precision measurement circuit.
  7. Kang, Seok-jin, Chip scale surface-mountable packaging method for electronic and MEMS devices.
  8. Cesaretti, Juan Manuel; Monreal, Gerardo; Taylor, William P.; Doogue, Michael C., Circuits and methods for generating a diagnostic mode of operation in a magnetic field sensor.
  9. Bryzek Janusz ; Burns David W. ; Nasiri Steven S. ; Cahill Sean S., Compensated semiconductor pressure sensor.
  10. Tamura,Masaya, Composite sensor device and method of producing the same.
  11. Daneman, Michael J.; Behin, Behrang, Conductive equipotential landing pads formed on the underside of a MEMS device.
  12. Donato Cardarelli, Coriolis oscillating gyroscopic instrument.
  13. Stewart Robert E. (Woodland Hills CA) Warren Keith O. (Newbury Park CA), Force balance instrument with electrostatic charge control.
  14. Tsai, Chialun, High performance MEMS device fabricatable with high yield.
  15. Salatino Matthew M. ; Young William R. ; Begley Patrick A., Lid wafer bond packaging and micromachining.
  16. Givens Robert B. ; Murphy John C. ; Wickenden Dennis K. ; Osiander Robert ; Kistenmacher Thomas J., Lorentz force magnetometer having a resonator.
  17. Foerstner, Juergen A.; Smith, Steven M.; Roop, Raymond Mervin, Low temperature plasma Si or SiGe for MEMS applications.
  18. Ma, Qing; Cheng, Peng; Rao, Valluri, MEMS device integrated chip package, and method of making same.
  19. Reeds, III, John William; Hsu, Ying Wen; Dao, Phu Cu, MEMS sensor with single central anchor and motion-limiting connection geometry.
  20. John W. Orcutt ; Andrew Steven Dewa ; Tsen-Hwang Lin, MEMS wafer level package.
  21. Dummermuth, Ernst H.; Knieser, Michael J.; Herbert, Patrick C.; Annis, Jeffrey R.; Galecki, Steven M.; Harris, Richard D.; Lucak, Mark A.; Kretschmann, Robert J., MEMS-based electrically isolated analog-to-digital converter.
  22. Spooner, Timothy R.; Harney, Kieran P., Method and device for protecting micro electromechanical system structures during dicing of a wafer.
  23. Wood R. Andrew ; Ridley Jeffrey A. ; Higashi Robert E., Method for making a wafer-pair having sealed chambers.
  24. Thomas Michael E. (Milpitas CA), Method of bonding semiconductor chips to a substrate.
  25. Ma, Qing, Method of fabricating an integrated circuit that seals a MEMS device within a cavity.
  26. Byeoung Ju Ha KR; Seog-soon Baek KR; Hyun-cheol Kim KR; Hoon Song KR; Yong-soo Oh KR, Method of fabricating micro electro mechanical system structure which can be vacuum-packed at wafer level.
  27. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Method of fabricating microelectromechanical systems and devices having trench isolated contacts.
  28. Hinzel, David H.; Goldsmith, Charles L.; Linder, Lloyd F., Method of integrating MEMS device with low-resistivity silicon substrates.
  29. Nasiri, Steven S.; Flannery, Jr., Anthony Francis, Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging.
  30. Robert B. McIntosh, Method to force-balance capacitive transducers.
  31. Haronian Dan,ILX, Micro-electro-mechanics systems (MEMS).
  32. Andrei M. Shkel ; Roger T. Howe, Micro-machined angle-measuring gyroscope.
  33. Beatty Christopher C. (Fort Collins CO), Microchip assembly with electrical element in sealed cavity.
  34. Dummermuth, Ernst H.; Harris, Richard D.; Knieser, Michael J., Microelectricalmechanical system (MEMS) electrical isolator with reduced sensitivity to inertial noise.
  35. Nasiri, Steven; Smith, James H.; Marx, David Lambe; Novack, Mitchell Joseph, Microelectromechanical mirror and mirror array.
  36. Steven S. Nasiri, Microelectromechanical mirror and mirror array.
  37. Knieser, Michael J.; Harris, Richard D.; Kretschmann, Robert J.; Dummermuth, Ernst H.; Herbert, Patrick C., Microelectromechanical system (MEMS) digital electrical isolator.
  38. McCall, Hiram; Lin, Ching-Fang, Microelectromechanical system for measuring angular rate.
  39. Clark William A., Micromachined Z-axis vibratory rate gyroscope.
  40. Roszhart Terry V. (West Paterson NJ), Micromachined acceleration and coriolis sensor.
  41. John A. Geen ; Donald W. Carow, Micromachined devices with anti-levitation devices.
  42. John A. Geen ; Donald W. Carow, Micromachined devices with stop members.
  43. Geen John A. ; Carow Donald W., Micromachined gyros.
  44. Tran Chau C. ; Geen John A. ; Brokaw A. Paul ; Haigh Geoffrey T., Micromachined semiconductor magnetic sensor.
  45. Schoefthaler Martin,DEX ; Schellin Ralf,DEX ; Emmerich Harald,DEX ; Kaienburg Joerg,DEX, Micromechanical magnetic field sensor.
  46. Buestgens Burkhard,DEX, Micromechanical resonator of a vibration gyrometer.
  47. Shaw Kevin A. (Ithaca NY) Zhang Z. Lisa (Ithaca NY) MacDonald Noel C. (Ithaca NY), Microstructures and high temperature isolation process for fabrication thereof.
  48. MacGugan, Douglas C., Miniature 3-dimensional package for MEMS sensors.
  49. Schirmer,Mark L.; Kelly,Thomas W., Motion detector and method of producing the same.
  50. Dunn William C. (Mesa AZ), Multi-axes gyroscope.
  51. Holm-Kennedy James W. (Honolulu HI) Lee Gordon P. (Waipahu HI) Kaneshiro Michael H. (Pearl City HI), Multidimensional force sensor.
  52. Pulskamp, Jeffrey S., PZT MEMS resonant Lorentz force magnetometer.
  53. Carr, Dustin W.; Greywall, Dennis S.; Jin, Sungho; Pardo, Flavio; Soh, Hyongsok, Packaged MEMS device and method for making the same.
  54. Ma, Qing; Rao, Valluri; Heck, John; Wong, Daniel; Berry, Michele, Packaging microelectromechanical structures.
  55. Yinon Degani ; Thomas Dixon Dudderar ; King Lien Tai, Packaging micromechanical devices.
  56. Miles, Mark W., Photonic mems and structures.
  57. Schuster Gunther (Gammelshausen DEX) Panitsch Klaus (Kirchheim DEX), Process for the laminar joining of silicon semiconductor slices.
  58. Cheung, Kin P., Processes for hermetically packaging wafer level microscopic structures.
  59. Jon Victor Osborn, RF MEMS switch.
  60. Hiroshi Kawai JP; Kuniki Ohwada JP, Resonant element.
  61. Jeong, Hee-moon; Kim, Jun-o; Lee, Byeung-leul; Lee, Sang-woo, Rotation-type decoupled MEMS gyroscope.
  62. Zabler Erich (Stutensee DEX) Wolf Joerg (Karlsruhe DEX) Lutz Markus (Reutlingen DEX), Rotational rate sensor with two acceleration sensors.
  63. Matsunaga Tadao,JPX ; Kunimi Takashi,JPX ; Nezu Masahiro,JPX ; Mori Masatomo,JPX ; Esashi Masayoshi,JPX, Semiconductor acceleration sensor and manufacturing method thereof.
  64. Zhu Zuhua ; Ng Tuoh-Bin ; Lo Yu-Hwa, Semiconductor eutectic alloy metal (SEAM) technology for fabrication of compliant composite substrates and integration of materials.
  65. Murphy,Gregory P.; Reimer,Lawrence B., Two wire resistive sensor.
  66. Roland W. Gooch, Vacuum package fabrication of microelectromechanical system devices with integrated circuit components.
  67. Nasiri,Steven S.; Flannery, Jr.,Anthony Francis, Vertically integrated MEMS structure with electronics in a hermetically sealed cavity.
  68. Lee Ki Bang,KRX ; Lee Byung-leul,KRX ; Cho Young-ho,KRX ; Song Ci-moo,KRX, Vibratory structure, method for controlling natural frequency thereof, and actuator, sensor, accelerator, gyroscope and.
  69. Maurice S. Karpman, Wafer level method of capping multiple MEMS elements.
  70. Turner, Terry R.; Spain, James D.; Banks, Richard M., Wafer thinning using magnetic mirror plasma.
  71. Ouellet, Luc, Wafer-level MEMS packaging.
  72. Brady, Frederick T., Wafer-level through-wafer packaging process for MEMS and MEMS package produced thereby.
  73. Nasiri, Steven S.; Seeger, Joseph, X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging.

이 특허를 인용한 특허 (2)

  1. Rogers, Daniel J.; Papadakis, Stergios J.; Churchill, Layne R.; Wong, Chee Wei, Chip-scale optomechanical magnetometer.
  2. Hoffberg, Steven M., Steerable rotating projectile.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로