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Monolithic cold plate configuration 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-003/12
  • F28F-009/02
  • H01L-023/473
출원번호 US-0901602 (2010-10-11)
등록번호 US-8869877 (2014-10-28)
발명자 / 주소
  • Zaffetti, Mark A.
  • Laurin, Michael B.
출원인 / 주소
  • Hamilton Sundstrand Space Systems International, Inc.
대리인 / 주소
    Carlson, Gaskey & Olds, P.C.
인용정보 피인용 횟수 : 1  인용 특허 : 47

초록

A cold plate assembly includes a monolithic cold plate which defines a trough located to intersect a fluid path.

대표청구항

1. A cold plate assembly comprising: a monolithic cold plate which defines a trough located to intersect a fluid path, wherein the trough is spaced from a manifold and forms an opening through a face of the monolithic cold plate and the opening extends the substantial length of the trough through th

이 특허에 인용된 특허 (47)

  1. Wenacur, Joel, Adjustable marine and aviation tool.
  2. Zywiak, Thomas; Bruno, Louis J.; Drew, Diane; Christians, Douglas L., Aircraft galley chiller system.
  3. Zywiak,Thomas; Bruno,Louis J.; Drew,Diane; Christians,Douglas L., Aircraft galley chiller system.
  4. Zaffetti,Mark; Stephens,Kurt, Apparatus for reducing thermal fatigue in heat exchanger cores.
  5. Hall ; Jr. John J. (13 Ridgwood Rd. Wallingford CT 06492), Boring tool having a detachable cutting blade.
  6. Davis ; Jr. George B. (7512 Marbury Road Bethesda MD 20014), Caulking gun adapter for an electric hand drill.
  7. Miao,Rongsheng; Kha,Leo; Swass,Matthew, Coaxial cooled laser modules with integrated thermal electric cooler and optical components.
  8. Wainwright,Richard E.; Kersting,James K., Combination IGBT mounting method.
  9. Downing Robert Scott, Cooling apparatus and method of assembling same.
  10. Becker Klaus,DEX ; Staiger Wolfgang,DEX ; Jung Matthias,DEX ; Heinemeyer Peter,DEX, Cooling body for cooling power gates.
  11. Tajima Makoto,JPX, Cooling device for electronic component.
  12. Laurila,Risto; Sikanen,Jukka; Ukkola,Erkki, Cooling element.
  13. Lopes William F. (Groton MA), Cooling header connection for a thyristor stack.
  14. Nomura,Takuji, Deep hole cutter.
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  16. DiFrancesco Lawrence (Hayward CA) Helber ; Jr. Carlyle L. (Fountain Valley CA), Electroformed high efficiency heat exchanger and method for making.
  17. Tajima Makoto,JPX, Electronic component cooling unit.
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  22. Larry ; George A., Gun drill.
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  24. Labinka Richard T. (137 Southwyck Chagrin Falls OH 44022), Gun drill mechanism.
  25. Goslee David Earl (White Marsh MD) Barr Harold Newton (Baltimore MD), Header.
  26. Bizzarro, Peter, Heat exchanger assembly with core-reinforcing closure bars.
  27. Zuo, Jon, Heat spreader with oscillating flow.
  28. Van Dine Pieter ; Thaxton Edgar S. ; Smith James S. ; Linkinhoker Jeffrey, Heat transfer cold plate arrangement.
  29. Barker Edison D. (Kettering OH) Cook John A. (Dayton OH), High speed coolant feeding gun drill and cutting head section therefor.
  30. Yamamoto Yoshihiko,JPX, High-speed gun drill.
  31. Ghosh, Debashis; Bhatti, Mohinder Singh, Integrated liquid cooled heat sink for electronic components.
  32. August Melvin C. (Chippewa Falls WI) Neumann Eugene F. (Chippewa Falls WI) Bowen Stephen A. (Chippewa Falls WI) Williams John T. (Chippewa Falls WI), Interconnected multiple circuit module.
  33. Reyzin,Ilya; Bhatti,Mohinder Singh, Liquid cooled thermosiphon with flexible coolant tubes.
  34. Miettinen,Osmo; Pussinen,Matti, Liquid cooling element and connection arrangement of liquid cooling element.
  35. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Liquid-based cooling system for cooling a multi-component electronics system.
  36. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Liquid-based cooling system for cooling a multi-component electronics system.
  37. Harms Eugene H. (Perrysburg OH), Method for filtering contaminated liquids.
  38. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Method of assembling a cooling system for a multi-component electronics system.
  39. Spitzmesser J. B. (Columbia SC) Cameron R. J. (Columbia SC) Doty F. D. (Columbia SC) Miller Brian L. (Elgin SC), Method of assembling tube arrays.
  40. Army, Jr.,Donald E.; Christians,Douglas L.; Peacos, III,Frederick, Pack and a half condensing cycle pack with combined heat exchangers.
  41. Monzon, Franklin G.; Dujari, Prateek; Lian, Bin, Process for local on-chip cooling of semiconductor devices using buried microchannels.
  42. Schierz ; Winfried, Semiconductor rectifier device with improved cooling arrangement.
  43. Chao-Fan Chu Richard (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. (New Paltz NY), Super-position cooling.
  44. Chu Richard C. (Poughkeepsie NY), Thermal conduction module.
  45. Arik,Mehmet; Aksel,Bulent; Gerstler,William Dwight; Bulkes,Cherik; Kelley,Douglas Arthur; Brzozowski,Steven Joseph, Thermal management system and method for MRI gradient coil.
  46. Regan Donald J. (Farmington Hills MI), Tool holder and gun drill or reamer.
  47. Dardick David (500 Via Del Monte Palos Verdes Estates CA 90274), Tround terra-drill processes and apparatus.

이 특허를 인용한 특허 (1)

  1. Obasih, Kem M.; DeKeuster, Richard M., Air cooled thermal management system for HEV battery pack.
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