Electronic apparatus with heat dissipation module
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G06F-001/20
H01L-023/467
H05K-007/20
H01L-023/427
출원번호
US-0654885
(2012-10-18)
등록번호
US-8891234
(2014-11-18)
우선권정보
TW-101105580 A (2012-02-21)
발명자
/ 주소
Huang, Lung-Chi
Yang, Chih-Hao
출원인 / 주소
Hon Hai Precision Industry Co., Ltd.
대리인 / 주소
Novak Druce Connolly Bove + Quigg LLP
인용정보
피인용 횟수 :
4인용 특허 :
6
초록▼
An electronic apparatus includes a chassis and a heat dissipation module. The chassis includes a first panel, a second panel substantially parallel to the first panel, and a motherboard attached on the first panel and located between the first panel and the second panel. The heat dissipation module
An electronic apparatus includes a chassis and a heat dissipation module. The chassis includes a first panel, a second panel substantially parallel to the first panel, and a motherboard attached on the first panel and located between the first panel and the second panel. The heat dissipation module is attached on the motherboard and includes a fan with a cover, a first fin assembly attached to a first side of the fan, and a second fin assembly attached to a second side of the fan. The cover includes a main plate with an opening and a resisting flange extending slantwise from an edge of the opening. A portion of the first fin assembly is exposed by the opening. The resisting flange resists against the second panel to keep the main plate away from the second panel.
대표청구항▼
1. An electronic apparatus comprising: a chassis comprising a first panel; a second panel, substantially parallel to the first panel; and a motherboard, attached on the first panel and located between the first panel and the second panel; anda heat dissipation module, attached on the motherboard, co
1. An electronic apparatus comprising: a chassis comprising a first panel; a second panel, substantially parallel to the first panel; and a motherboard, attached on the first panel and located between the first panel and the second panel; anda heat dissipation module, attached on the motherboard, comprising a fan with a cover; a first fin assembly, attached to a first side of the fan; and a second fin assembly attached to a second side of the fan; the first side being substantially perpendicular and adjacent to the second side; and the cover comprising a main plate with an opening, defined therein, and a resisting flange, extending slantwise from an edge of the opening;wherein a portion of the first fin assembly is exposed by the opening, and the resisting flange is resisted against the second panel to keep the main plate away from the second panel. 2. The electronic apparatus of claim 1, wherein a first heat generating component and a second heat generating component are attached on the motherboard, and the fan is attached to the first heat generating component. 3. The electronic apparatus of claim 2, wherein the heat dissipation module further comprises a heat spreader attached on the second heat generating component, each of the first fin assembly and the second fin assembly is in proximity to a first corner of the fan, the heat spreader is attached to a second corner of the fan, and the first corner and the second corner are diagonal corners of the fan. 4. The electronic apparatus of claim 3, where the first fin assembly comprises a plurality of first fins, the second fin assembly comprises a plurality of second fins, and each of the plurality of first fins is substantially perpendicular to the plurality of second fins. 5. The electronic apparatus of claim 4, wherein the heat dissipation module further comprises a heat pipe, a first end of the heat pipe extends through the first fin assembly, a second end of the heat pipe extends through the second fin assembly, and a central portion of the heat pipe is attached on the heat spreader. 6. The electronic apparatus of claim 3, wherein the heat dissipation module further comprises a mounting block located at the first corner, the mounting block comprises a rib, a holding portion extends from the rib, and a base plate is connected to a bottom edge of the holding portion. 7. The electronic apparatus of claim 6, wherein a securing hole is defined in the rib for securing the cover on the fan; and a fixing hole is defined in the base plate, for securing the heat dissipation module on the motherboard. 8. The electronic apparatus of claim 7, wherein a mounting member extends into the fixing hole and a mounting hole in the motherboard, for securing the heat dissipation module on the motherboard; and the mounting member comprises a spring resisting against the base plate. 9. The electronic apparatus of claim 7, wherein the holding portion is arc shaped; and a gap is defined in the main plate, corresponding to the holding portion. 10. An electronic apparatus comprising: a chassis comprising a base panel; a motherboard, attached on the base panel; and a top panel, the motherboard comprising a first heat generating component and a second heat generating component; anda heat dissipation module comprising a fan located, above the first heat generating component; a cover, attached on the fan; a first fin assembly, connected to a first side of the fan; a second fin assembly, connected a second side of the fan; and a heat spreader, connected to the fan and attached on the second heat generating component; and the cover comprising a main plate, substantially parallel to the base panel and the top panel; and a resisting flange, extending slantwise from the main plate and resisted against the top panel. 11. The electronic apparatus of claim 10, wherein the first side is substantially perpendicular and adjacent to the second side. 12. The electronic apparatus of claim 11, wherein a rectangular opening is defined in the main plate, the resisting flange is extended from a long edge of the rectangular opening, and a portion of the first fin assembly is exposed by the rectangular opening. 13. The electronic apparatus of claim 10, wherein each of the first fin assembly and the second fin assembly is in proximity to a first corner of the fan, the heat spreader is attached to a second corner of the fan, and the first corner and the second corner are diagonal corners of the fan. 14. The electronic apparatus of claim 13, where the first fin assembly comprises a plurality of first fins, the second fin assembly comprises a plurality of second fins, and each of the plurality of first fins is substantially perpendicular to the plurality of second fins. 15. The electronic apparatus of claim 14, wherein the heat dissipation module further comprises a heat pipe, a first end of the heat pipe extends through the first fin assembly, a second end of the heat pipe extends through the second fin assembly, and a central portion of the heat pipe is attached on the heat spreader. 16. The electronic apparatus of claim 13, wherein the heat dissipation module further comprises a mounting block located at the first corner, the mounting block comprises a rib, a holding portion extends from the rib, and a base plate is connected to a bottom edge of the holding portion. 17. The electronic apparatus of claim 16, wherein a securing hole is defined in the rib for securing the cover on the fan; and a fixing hole is defined in the base plate for securing the heat dissipation module on the motherboard. 18. The electronic apparatus of claim 17, wherein a mounting member extends into the fixing hole and a mounting hole in the motherboard for securing the heat dissipation module on the motherboard; and the mounting member comprises a spring resisting against the base plate. 19. The electronic apparatus of claim 16, wherein the holding portion is arc shaped; and a gap is defined in the main plate, corresponding to the holding portion.
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Hashimoto,Toshio; Kimura,Toru; Kaneko,Sachiko, Cooling apparatus and electronic equipment.
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