Abrasive processing of hard and /or brittle materials
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B24B-001/00
B24D-003/00
출원번호
US-0906263
(2007-10-01)
등록번호
US-8894731
(2014-11-25)
발명자
/ 주소
Ramanath, Srinivasan
Walia, Parul
출원인 / 주소
Saint-Gobain Abrasives, Inc.
대리인 / 주소
Sullivan, Joseph P.
인용정보
피인용 횟수 :
0인용 특허 :
46
초록▼
Abrasive articles possessing a highly open (porous) structure and uniform abrasive grit distribution are disclosed. The abrasive articles are fabricated using a metal matrix (e.g., fine nickel, tin, bronze and abrasives). The open structure is controlled with a porosity scheme, including interconnec
Abrasive articles possessing a highly open (porous) structure and uniform abrasive grit distribution are disclosed. The abrasive articles are fabricated using a metal matrix (e.g., fine nickel, tin, bronze and abrasives). The open structure is controlled with a porosity scheme, including interconnected porosity (e.g., formed by leaching of dispersoid), closed porosity (e.g., induced by adding a hollow micro-spheres and/or sacrificial pore-forming additives), and/or intrinsic porosity (e.g., controlled via matrix component selection to provide desired densification). In some cases, manufacturing process temperatures for achieving near full density of metal bond with fillers and abrasives, are below the melting point of the filler used, although sacrificial fillers may be used as well. The resulting abrasive articles are useful in high performance cutting and grinding operations, such as back-grinding silicon, alumina titanium carbide, and silicon carbide wafers to very fine surface finish values. Techniques of use and manufacture are also disclosed.
대표청구항▼
1. An abrasive tool comprising: a plurality of abrasive grains having an average particle size of 2 microns or less;a metal bond including a nickel, tin and bronze system: andporosity including intrinsic pores, closed pores and interconnected pores; wherein the abrasive tool comprises a content of a
1. An abrasive tool comprising: a plurality of abrasive grains having an average particle size of 2 microns or less;a metal bond including a nickel, tin and bronze system: andporosity including intrinsic pores, closed pores and interconnected pores; wherein the abrasive tool comprises a content of abrasive grains in the range of 0.25 to 40 vol% for the total content of the abrasive tool, a content of metal bond in the range of 10 to 60 vol% for the total volume of the abrasive tool, and a content of porosity in the range of 40 to 90 vol% for the total volume of the abrasive tool; andwherein the content of porosity comprises a content of intrinsic pores in the range of 0.01 to 20 vol% for the total volume of the porosity, a content of closed pores in the range of 0.01 to 49.99vol% for the total volume of the porosity and a content of interconnected pores in the range of 50 to 80 vol% for the total volume of the porosity. 2. The abrasive tool of claim 1, wherein the abrasive grains include at least one of diamond, cubic boron nitride, alumina, silicon-carbide, boron-carbide, and zirconia. 3. The abrasive tool of claim 1, wherein the metal bond possesses a plain-strain fracture toughness in the range of 1 to 6 MPa.m1/2, a Vickers hardness number in the range of 200 to 600, a Young's modulus in the range of 30 to 300GPa, and a density in the range of 2 grams/cc to 7 grams/cc. 4. The abrasive tool of claim 1, wherein the metal bond possesses a wear volume in the range of 5 to 400 mm3 when using a 5 Newton load. 5. The abrasive tool of claim 1, wherein the interconnected pores have an average size in the range of 40 to 400 microns, the closed pores have an average size in the range of 5 to 400 microns, and the intrinsic pores have an average size below 40 microns. 6. The abrasive tool of claim 1, wherein the metal bond includes from about 25 to 60 weight percent nickel, from about 20 to 60 weight percent tin, and from about 20 to 60 weight percent bronze, wherein the bronze has a copper-tin ratio from about 95:5 to 40:60 by weight percent. 7. The abrasive tool of claim 1, wherein the abrasive tool further comprises an abrasive rim that is operatively coupled to a core via a thermally stable bond. 8. The abrasive tool of claim 7, wherein the core has a circular perimeter and a minimum specific strength of 2.4 MPa-cm3/g and a core density of 0.5 to 8.0 g/cm3. 9. The abrasive tool of claim 1, wherein the workpiece is a semiconductor wafer. 10. A method for abrasive processing a workpiece to a desired surface finish, the method comprising: mounting the workpiece onto a machine capable of facilitating abrasive processing;operatively coupling an abrasive tool to the machine, the tool comprising a metal bond thermally processed together with a plurality of abrasive grains having an average particle size of 2 microns or less, the metal bond including a nickel, tin and bronze system; andporosity including intrinsic pores, closed pores and interconnected pores; wherein the abrasive tool comprises a content of abrasive grains in the range of 0.25 to 40 vol% for the total content of the abrasive tool, a content of metal bond in the range of 10 to 60 vol% for the total volume of the abrasive tool, and a content of porosity in the range of 40 to 90 vol% for the total volume of the abrasive tool; andwherein the content of porosity comprises a content of intrinsic pores in the range of 0.01 to 20 vol% for the total volume of the porosity, a content of closed pores in the range of 0.01 to 49.99 vol% for the total volume of the porosity and a content of interconnected pores in the range of 50 to 80 vol% for the total volume of the porosity; andcontacting the abrasive tool to a surface of the workpiece until the desired surface finish of the workpiece is achieved, wherein the desired surface finish is 500 Angstroms or less, Ra. 11. The method of claim 10, wherein the workpiece comprises a wafer and abrasive processing includes at least one of polishing and back-grinding the wafer. 12. The method of claim 10, wherein the abrasive grains are selected from the group consisting of diamond, cubic boron nitride, alumina, silicon-carbide, boron-carbide, and zirconia. 13. The method of claim 10, wherein the workpiece is a single crystal silicon carbide wafer and the desired surface finish is 30 Angsroms or less, Ra. 14. The method of claim 10, wherein the workpiece is a single crystal silicon carbide wafer and the desired surface finish is 30 Angstroms or less, Ra. 15. The method of claim 10, wherein the workpiece is sapphire and the desired surface finish is 200 Angstroms or less, Ra. 16. The method of claim 10, wherein the metal bond includes from about 25 to 60 weight percent nickel, from about 20 to 60 weight percent tin, and from about 20 to 60 weight percent bronze, wherein the bronze has a copper-tin ratio from about 95:5 to 40:60 by weight percent.
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